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公开(公告)号:US20200294719A1
公开(公告)日:2020-09-17
申请号:US16816856
申请日:2020-03-12
Applicant: TDK Corporation
Inventor: Akihiro MASUDA , Norihisa ANDO , Shinya ITO , Kosuke YAZAWA , Yoshiki SATOU , Katsumi KOBAYASHI
Abstract: An electronic component has capacitor chips where terminal electrodes are formed on both end surfaces, individual metal terminals connected to the terminal electrodes, an insulation case accommodating the capacitor chips, and a connecting portion interconnecting a plurality of the insulation cases.
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公开(公告)号:US20230411077A1
公开(公告)日:2023-12-21
申请号:US18331294
申请日:2023-06-08
Applicant: TDK CORPORATION
Inventor: Akihiro MASUDA , Shinya ITO , Norihisa ANDO , Hideki KANEKO , Ken ABURAKAWA , Kenya TAMAKI , Akitoshi YOSHII
Abstract: The electronic device includes: a case including a recessed portion and an opening edge portion of the recessed portion; a ceramic element arranged in the recessed portion, having a first main surface and a second main surface facing each other, and including a first electrode portion formed on the first main surface and a second electrode portion formed on the second main surface; a first metal terminal including a first mounting portion, arranged in the opening edge portion and approximately horizontal with respect to the first main surface and the second main surface, and a first electrode connection portion connected to the first electrode portion; and a second metal terminal including a second mounting portion, arranged in the opening edge portion and approximately horizontal with respect to the first main surface and the second main surface, and a second electrode connection portion connected to the second electrode portion.
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公开(公告)号:US20210375547A1
公开(公告)日:2021-12-02
申请号:US17229393
申请日:2021-04-13
Applicant: TDK CORPORATION
Inventor: Shinya SAITO , Kenya TAMAKI , Norihisa ANDO , Shinya ITO , Akihiro MASUDA , Kosuke YAZAWA , Yoshiki SATOU , Katsumi KOBAYASHI , Toshihiro IGUCHI
Abstract: An electronic device includes chip components, a case, conductive terminals, and a fuse. The chip components each include a terminal electrode. The case includes accommodation recesses for accommodating the chip components. The conductive terminals are fixed to the case and respectively connected to the terminal electrodes of the chip components. The fuse electrically connects the chip components.
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公开(公告)号:US20210125781A1
公开(公告)日:2021-04-29
申请号:US17062736
申请日:2020-10-05
Applicant: TDK CORPORATION
Inventor: Akihiro MASUDA , Norihisa ANDO , Shinya ITO
Abstract: A ceramic electronic device includes a ceramic element body, a terminal electrode, and a lead terminal. The ceramic element body has an end surface and a lateral surface. The terminal electrode is formed on from the end surface to a part of the lateral surface of the ceramic element body. The lead terminal is connected to the terminal electrode by a connection member. The lead terminal includes an electrode facing portion disposed correspondingly to an end-surface electrode of the terminal electrode, an extension unit extending downward from a lower end of the electrode facing portion, and a step surface located between the electrode facing portion and the extension unit. The electrode facing portion has a recess dented in a direction away from the terminal electrode. A center of the recess is located below a center of the electrode facing portion in a height direction.
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公开(公告)号:US20210043382A1
公开(公告)日:2021-02-11
申请号:US16988819
申请日:2020-08-10
Applicant: TDK CORPORATION
Inventor: Akihiro MASUDA , Norihisa ANDO , Shinya ITO , Kosuke YAZAWA , Yoshiki SATOU , Katsumi KOBAYASHI
Abstract: A conductive terminal includes an inner electrode part, an opening edge electrode part, and a lateral electrode part. The inner electrode part is connectable to a terminal electrode of a chip component by being inserted along an inner wall of an accommodation recess of a case. The opening edge electrode part is formed continuously to the inner electrode part. The lateral electrode part is formed continuously to the opening edge electrode part along an outer surface of the case. The inner electrode part includes a base part, a curved part, and a continuous boundary part. The base part continues to the opening edge electrode part. The curved part is formed near a tip of the base part and protrudes away from the lateral electrode part. The continuous boundary part is formed between the base part and the curved part and continuously connects them.
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公开(公告)号:US20230010668A1
公开(公告)日:2023-01-12
申请号:US17847717
申请日:2022-06-23
Applicant: TDK CORPORATION
Inventor: Akihiro MASUDA , Shinya ITO , Norihisa ANDO , Kosuke YAZAWA , Yoshiki SATOU , Katsumi KOBAYASHI
IPC: H01G4/224
Abstract: An electronic device 10 comprises chip capacitors 20a and 20b, an accommodation recess 62 accommodating the chip capacitors 20a and 20b, and a case 60 including a protrusion 64 partitioning the accommodation recess 62 into a first accommodation space 62a and a second accommodation space 62b along the X-axis direction. The protrusion 64 includes a first protrusion 64a and a second protrusion 64b disposed away from the first protrusion 64a along the Y-axis direction. The first protrusion 64a and the second protrusion 64b are disposed with a communication space 69 provided between the first protrusion 64a and the second protrusion 64b, so that the first accommodation space 62a and the second accommodation space 62b communicate.
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公开(公告)号:US20220157533A1
公开(公告)日:2022-05-19
申请号:US17494538
申请日:2021-10-05
Applicant: TDK CORPORATION
Inventor: Akihiro MASUDA , Shinya ITO , Norihisa ANDO , Tomoyuki SASAKI , Shinya ONODERA
Abstract: An electronic device includes a plurality of chip components and an insulating case. The chip components are arranged in a first direction. The case includes a plate portion, a first protrusion portion, and a second protrusion portion. The plate portion faces first side surfaces of the chip components. The first protrusion portion is formed along a plate-portion first side of the plate portion and protrudes from the plate portion toward a downside perpendicular to the first direction. The second protrusion portion is formed to the first protrusion portion in a second direction and protrudes from the plate portion toward the downside. A protrusion length of the first protrusion portion and the second protrusion portion from the plate portion toward the downside is smaller than a protrusion length of the chip component included in the chip components from the plate portion toward the downside.
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公开(公告)号:US20210225589A1
公开(公告)日:2021-07-22
申请号:US17133102
申请日:2020-12-23
Applicant: TDK CORPORATION
Inventor: Akihiro MASUDA , Shinya ITO , Norihisa ANDO , Kosuke YAZAWA , Yoshiki SATOU , Katsumi KOBAYASHI , Koji UTSUI , Koji KANEKO
Abstract: An electronic device includes a chip component, a conductive terminal, a case, and a fixation part. The chip component includes a terminal electrode on an end surface of the chip component. The conductive terminal is connected to the terminal electrode. The case includes an accommodation recess for accommodating the chip component. The fixation part fixes the case to an installation portion.
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公开(公告)号:US20250157735A1
公开(公告)日:2025-05-15
申请号:US18829466
申请日:2024-09-10
Applicant: TDK Corporation
Inventor: Takaaki SATO , Akihiro MASUDA , Norihisa ANDO , Shinya ITO , Masahiro MORI
Abstract: An electronic component includes: a ceramic body having principal surfaces; electrode parts respectively provided on the principal surfaces; lead terminals electrically connected to the respective electrode parts; and an exterior resin provided so as to cover the ceramic body, the electrode parts, and base end portions of the lead terminals, in which the exterior resin has a two-layer structure including an inner layer and an outer layer having colors different from each other, and the color of the inner layer is a color having a color difference of within 150 from a separation color having the largest color difference with respect to the color of the outer layer in an L*a*b* color space S each having a value of 0 to 255.
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公开(公告)号:US20240196538A1
公开(公告)日:2024-06-13
申请号:US18522664
申请日:2023-11-29
Applicant: TDK Corporation
Inventor: Akihiro MASUDA , Katsuya MIURA , Natsuki KUMAGAI
CPC classification number: H05K1/183 , H05K1/0203 , H05K2201/09372 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003
Abstract: An electronic device comprises chip components aligned along a predetermined first direction and including respective terminal electrodes, and a metal block including an electrode-opposing surface and a mounting surface. The electrode-opposing surface is opposed and connected to the respective terminal electrodes of the chip components continuously along the first direction. The mounting surface is substantially perpendicular to the electrode-opposing surface and is substantially parallel to the first direction to oppose a land pattern when the electronic device is mounted on the land pattern.
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