IMAGE FORMING APPARATUS AND METHOD OF ADJUSTING IMAGE
    51.
    发明申请
    IMAGE FORMING APPARATUS AND METHOD OF ADJUSTING IMAGE 失效
    图像形成装置和调整图像的方法

    公开(公告)号:US20120262750A1

    公开(公告)日:2012-10-18

    申请号:US13444018

    申请日:2012-04-11

    IPC分类号: G06K15/00

    摘要: An image forming apparatus includes plural image forming units of plural colors, each including a print head including plural LED chips aligned in a main scanning direction; a screen angle selecting unit that selects screen angles for the plural colors respectively based on the amounts of skew of the plural image forming units; an image processing unit that performs image processing on input data to be expressed by pixels of the plural colors such that the pixels of the colors have the corresponding screen angles selected by the screen angle selecting unit; a correction amount determining unit that determines a total amount of skew correction based on the amount of skew detected by the skew detection unit, and determines the amounts of skew correction in the sub-scanning direction for predetermined groups of the pixels, based on the total amount of skew correction, for each of the colors.

    摘要翻译: 图像形成装置包括多个颜色的图像形成单元,每个图像形成单元包括在主扫描方向上排列的多个LED芯片的打印头; 屏幕角度选择单元,分别基于多个图像形成单元的偏斜量来选择多种颜色的屏幕角度; 图像处理单元,对由多个颜色的像素表示的输入数据执行图像处理,使得颜色的像素具有由屏幕角度选择单元选择的相应屏幕角度; 校正量确定单元,其基于由所述歪斜检测单元检测到的歪斜量来确定歪斜校正的总量,并且基于总计来确定预定组像素的副扫描方向上的歪斜校正量 每种颜色的偏斜校正量。

    Phosphor and phosphor paste
    52.
    发明授权
    Phosphor and phosphor paste 失效
    磷光体和荧光粉膏

    公开(公告)号:US07964112B2

    公开(公告)日:2011-06-21

    申请号:US10575466

    申请日:2003-10-21

    IPC分类号: C09K11/08 C09K11/64

    摘要: A phosphor having a high brightness after being exposed to plasma and a phosphor paste containing the phosphor. The phosphor comprises a fluorescent substance A1 containing a compound represented by the following formula (I) and at least one activator selected from the group consisting of Eu and Mn, and a fluorescent substance B1 containing an aluminate; mM1O.nM2O.2M3O2  (I) [in the formula (I), M1 is at least two selected from the group consisting of Ca, Sr and Ba, or Ca alone or Ba alone; M2 is at least one selected from the group consisting of Mg and Zn; M3 is at least one selected from the group consisting of Si and Ge; 0.5≦m≦3.5; and 0.5≦n≦2.5].

    摘要翻译: 暴露于等离子体后具有高亮度的荧光体和含有荧光体的荧光体膏。 荧光体包含含有下述式(I)表示的化合物和至少一种选自Eu和Mn的活化剂的荧光物质A1和含有铝酸盐的荧光物质B1; (I)式中,M1是选自Ca,Sr和Ba中的至少两种,或单独的Ca或单独的Ba中的至少两种; M2是选自Mg和Zn中的至少一种; M3是选自Si和Ge中的至少一种; 0.5≦̸ m≦̸ 3.5; 和0.5≦̸ n≦̸ 2.5]。

    Method for Producing Bonded Wafer, Bonded Wafer, and Surface Grinding Machine
    54.
    发明申请
    Method for Producing Bonded Wafer, Bonded Wafer, and Surface Grinding Machine 审中-公开
    粘结晶片,粘结晶片和平面磨床的生产方法

    公开(公告)号:US20090233109A1

    公开(公告)日:2009-09-17

    申请号:US11886877

    申请日:2006-03-29

    摘要: The present invention is a method for producing a bonded wafer, comprising at least: bonding a base wafer serving as a support substrate to a bond wafer made of a silicon single crystal via an insulator film or directly bonding the wafers to provide a bonded wafer; and reducing a thickness of the bond wafer to form a thin film made of the silicon single crystal on the base wafer, wherein the thickness of the bonded wafer is reduced based on at least surface grinding while measuring the thickness of the bond wafer, and surface grinding with respect to the bond wafer is stopped when the thickness of the bond wafer reaches a target thickness. As a result, the method for producing a bonded wafer enabling a silicon single crystal thin film to precisely have a desired film thickness, a bonded wafer, and a surface grinding machine enabling a silicon single crystal thin film to precisely have a desired film thickness are provided.

    摘要翻译: 本发明是一种用于制造接合晶片的方法,至少包括:通过绝缘膜将用作支撑衬底的基底晶片接合到由硅单晶制成的接合晶片上,或直接接合晶片以提供接合晶片; 并且减小接合晶片的厚度以在基底晶片上形成由单晶硅制成的薄膜,其中,至少基于表面研磨减少接合晶片的厚度,同时测量接合晶片的厚度和表面 当接合晶片的厚度达到目标厚度时,停止对接合晶片的研磨。 结果,能够使硅单晶薄膜精确地具有期望的膜厚的接合晶片的制造方法,接合晶片和能够使硅单晶薄膜精确地具有期望的膜厚度的表面研磨机, 提供。

    Method for manufacturing bonded wafer
    56.
    发明申请
    Method for manufacturing bonded wafer 有权
    贴合晶圆的制造方法

    公开(公告)号:US20090111245A1

    公开(公告)日:2009-04-30

    申请号:US11921081

    申请日:2006-05-18

    IPC分类号: H01L21/302 H01L21/02

    CPC分类号: H01L21/76256

    摘要: The present invention provides a method for manufacturing a bonded wafer comprising steps of forming an oxide film on at least a surface of a base wafer or a surface of a bond wafer; bringing the base wafer and the bond wafer into close contact via the oxide film; subjecting these wafers to a heat treatment under an oxidizing atmosphere to bond the wafers together; grinding and removing the outer periphery of the bond wafer so that the outer periphery has a predetermined thickness; subsequently removing an unbonded portion of the outer periphery of the bond wafer by etching; and then thinning the bond wafer so that the bond wafer has a desired thickness, wherein the etching is conducted by using a mixed acid at 30° C. or less at least comprising hydrofluoric acid, nitric acid, and acetic acid. Thus there is provided a method for manufacturing a bonded wafer by which unbonded portions of the outer periphery of the bond wafer are removed with a high selectivity ratio (RSi/RSiO2) without causing metallic contamination.

    摘要翻译: 本发明提供了一种用于制造接合晶片的方法,包括以下步骤:在基底晶片或接合晶片的表面的至少一个表面上形成氧化膜; 使基底晶片和接合晶片经由氧化膜紧密接触; 在氧化气氛下对这些晶片进行热处理以将晶片粘合在一起; 研磨和去除接合晶片的外周,使得外周具有预定厚度; 随后通过蚀刻去除接合晶片的外周的未结合部分; 然后使接合晶片变薄,使得接合晶片具有期望的厚度,其中通过使用至少包含氢氟酸,硝酸和乙酸的30℃或更低的混合酸来进行蚀刻。 因此,提供了一种制造接合晶片的方法,通过该方法,以高选择率(RSi / RSiO2)除去接合晶片的外周的未结合部分而不引起金属污染。

    Legged Mobile Robot
    57.
    发明申请
    Legged Mobile Robot 有权
    有腿的移动机器人

    公开(公告)号:US20070273320A1

    公开(公告)日:2007-11-29

    申请号:US11578180

    申请日:2005-02-18

    IPC分类号: B25J9/00

    CPC分类号: B25J19/0091

    摘要: In a legged mobile robot having a body and legs connected to the body, a seating aid is provided at its body so as to enable to sit on a seat. With this, the space occupied by the robot can be decreased to reduce space during storage and transport, and also enhance safety in the course of transport. In addition, maintenance work is simplified because immobilization in the seated condition is possible. Still further, the range of works is expanded to enable deskwork and the like. Further, the seating aid is provided at a location that is rearward of a center of gravity of the robot when the robot is seated. With this, the moment acting on the robot about the center of gravity during seating does not operate to tilt the robot rearward and, therefore, the robot can be enabled to keep a stable posture from before to after sitting down.

    摘要翻译: 在具有连接到身体的身体和腿部的腿式移动机器人中,在其身体处设置座椅辅助件,以便能够坐在座椅上。 由此,可以减少机器人占用的空间,以减少储存和运输过程中的空间,并提高运输过程中的安全性。 另外,维护工作简化了,因为固定在就座状态是可能的。 此外,扩展了作品的范围以实现书桌等。 此外,当机器人就座时,座椅辅助装置设置在机器人的重心后方的位置。 因此,在座椅期间作用于机器人关于重心的时刻不会使机器人向后倾斜,因此机器人能够在坐下之后保持稳定的姿势。

    Legged mobile robot and control system thereof
    58.
    发明申请
    Legged mobile robot and control system thereof 失效
    有腿的移动机器人及其控制系统

    公开(公告)号:US20070193789A1

    公开(公告)日:2007-08-23

    申请号:US10593493

    申请日:2005-02-18

    IPC分类号: B62D51/06

    CPC分类号: B25J19/0091

    摘要: The legged mobile robot the foot comprises a foot main body connected to each leg, a toe provided at a fore end of the foot main body to be bendable with respect to the foot main body, and a bending angle holder capable of holding a bending angle of the toe in a bendable range of the toe. In addition, a legged mobile robot control system is configured to hold the bending angle of the toe at a first time point which is a liftoff time of the leg from a floor or earlier thereof, and to release the bending angle at a second time point after the leg has lifted off the floor to restore the toe to a initial position. With this, the bending angle at the time of liftoff can continue to be held after liftoff, whereby the robot can be prevented from becoming unstable owing to the toe contacting the floor immediately after liftoff. In addition, stability during tiptoe standing can be enhanced.

    摘要翻译: 腿式移动机器人脚包括连接到每个腿的脚本体,设置在脚主体的前端以相对于脚本体可弯曲的脚趾以及能够保持弯曲角度的弯曲角保持器 的脚趾在脚趾的可弯曲范围内。 此外,有腿的移动机器人控制系统被配置为在脚踏板的起始时间的第一时间点保持脚趾的弯曲角度,该第一时间点是从地板或更早的腿部起飞时间,并且在第二时间点释放弯曲角度 腿后抬起地板将脚趾恢复到初始位置。 由此,脱扣后的弯曲角度可以继续保持,由此能够防止机器人由于在起飞后立即接触地板而变得不稳定。 此外,可以提高脚尖站立时的稳定性。

    Method for producing phosphor having a high brightness
    59.
    发明授权
    Method for producing phosphor having a high brightness 失效
    具有高亮度的荧光体的制造方法

    公开(公告)号:US07011770B2

    公开(公告)日:2006-03-14

    申请号:US10805294

    申请日:2004-03-22

    IPC分类号: C09K11/59

    摘要: A method for producing a phosphor having a high brightness is described. The method for producing a phosphor having a high brightness, comprises steps of: contacting a luminescent material containing Si and/or Ge with an acid, separating solid from the acid, and drying an obtained solid.

    摘要翻译: 对具有高亮度的荧光体的制造方法进行说明。 具有高亮度的荧光体的制造方法包括以下步骤:使含有Si和/或Ge的发光材料与酸接触,从酸中分离固体,并干燥得到的固体。

    Method for producing silicate phosphor
    60.
    发明授权
    Method for producing silicate phosphor 失效
    硅酸盐荧光体的制造方法

    公开(公告)号:US06884367B2

    公开(公告)日:2005-04-26

    申请号:US10318146

    申请日:2002-12-13

    摘要: The object of the present invention is to provide a production method for a silicate phosphor having high brightness. This object is achieved by the method for producing a silicate phosphor comprising a step of calcining a mixture of metal compounds, wherein one of the metal compounds is silicon oxide having BET specific surface area of not less than 10 m2/g.

    摘要翻译: 本发明的目的是提供一种具有高亮度的硅酸盐荧光体的制造方法。 该目的通过生产硅酸盐荧光体的方法来实现,该方法包括煅烧金属化合物的混合物的步骤,其中一种金属化合物是BET比表面积不小于10m 2 / > / g。