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    Work status prediction apparatus, method of predicting work status, and work status prediction program
    52.
    发明申请
    Work status prediction apparatus, method of predicting work status, and work status prediction program 审中-公开
    工作状态预测装置，预测工作状态的方法和工作状态预测程序

    公开(公告)号：US20050171834A1

    公开(公告)日：2005-08-04

    申请号：US11046513

    申请日：2005-01-28

    申请人： Takeshi Yokota ,  Shigeru Hasegawa ,  Makoto Kudoh ,  Kiyoshi Shimoda

    发明人： Takeshi Yokota ,  Shigeru Hasegawa ,  Makoto Kudoh ,  Kiyoshi Shimoda

    IPC分类号： G05B19/418 ,  G06Q10/00 ,  G06Q10/06 ,  G06Q10/10 ,  G06Q50/00 ,  G06Q50/04 ,  G06F17/60

    CPC分类号： G06Q10/00 ,  G06Q10/06312 ,  G06Q10/06314 ,  G06Q10/06315 ,  G06Q10/0637 ,  Y02P90/20

    摘要： To predict a future work status, a variation amount in working efficiency set according to progress of a work regarding the workload and a variation amount in a work resource are considered, and the working efficiency is compensated according compensation of a work resource amount. Data of variation patterns of the working efficiency and the number of workers are previously defined and stored. A variation pattern for each work is selected from the variation pattern data on the basis of a work schedule data stored in the work schedule data storing section. Variation of the workload resource, the workload, and the working efficiency are stored. The prediction result is displayed. Upon excess and lack in the prediction workload over the scheduled workload in a period may be transferred from that period to the next period and from the next to that period, respectively.

    摘要翻译： 为了预测未来的工作状态，考虑根据工作量的工作进度设定的工作效率的变化量和工作资源的变化量，根据工作资源量的补偿来补偿工作效率。 先前定义并存储了工作效率和工作人员数量变化模式的数据。 根据存储在工作调度数据存储部分中的工作调度数据，从变化模式数据中选择每个工作的变化模式。 存储工作负载资源的变化，工作负载和工作效率。 显示预测结果。 在一段时间内，由于预计工作负荷超出预期工作量，而且预计工作量不足，则可能会从该期间分别转移到下一个时期，也可能从下一个时期转移到该期间。

    Multi-chip press-connected type semiconductor device
    53.
    发明申请
    Multi-chip press-connected type semiconductor device 有权
    多芯片压接式半导体器件

    公开(公告)号：US20050087865A1

    公开(公告)日：2005-04-28

    申请号：US10926071

    申请日：2004-08-26

    申请人： Shigeru Hasegawa ,  Hideaki Kitazawa

    发明人： Shigeru Hasegawa ,  Hideaki Kitazawa

    IPC分类号： H01L23/051 ,  H01L23/36 ,  H01L23/492 ,  H01L25/07 ,  H01L25/18 ,  H01L27/04 ,  H01L29/78 ,  H01L23/02

    CPC分类号： H01L25/072 ,  H01L23/051 ,  H01L23/36 ,  H01L23/492 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/00

    摘要： A multi-chip press-connected type semiconductor device comprises: a plurality of active element chips to control an electric current flowing in one direction; a plurality of diode chips that transmit the current in a direction opposite to the current transmitting direction of said active element chip; and electrode plates for said active element chip and for said diode chip, said electrode plates pressing from above and under with said plurality of active element chips and said plurality of diode chips being interposed therebetween; wherein said diode chips are disposed in all of outermost peripheral chip positions with no-existence of other chips adjacent to at least one side of a chip in a chip disposing region, and are disposed in internal layout positions surrounded with the outermost peripheral chip positions, and said diode chips to be disposed in the internal layout positions are arranged in order of a total number of other chips from the smallest that exist adjacently to at least one of a side and a vertex of a chip.

    摘要翻译： 多芯片压接型半导体器件包括：多个有源元件芯片，用于控制沿一个方向流动的电流; 多个二极管芯片，其在与所述有源元件芯片的当前发送方向相反的方向上传输电流; 以及用于所述有源元件芯片和所述二极管芯片的电极板，所述电极板通过所述多个有源元件芯片从所述多个有源元件芯片和所述多个二极管芯片的上下按压; 其中所述二极管芯片设置在所有最外周芯片位置，在芯片布置区域中不存在与芯片的至少一侧相邻的其它芯片，并且被布置在被最外周芯片位置包围的内部布局位置， 并且要布置在内部布局位置的所述二极管芯片按照与芯片的侧面和顶点中的至少一个相邻存在的最小的其他芯片的总数的顺序排列。