Misalignment-tolerant methods for fabricating multiplexing/demultiplexing architectures
    51.
    发明申请
    Misalignment-tolerant methods for fabricating multiplexing/demultiplexing architectures 有权
    制造复用/解复用架构的不对准方法

    公开(公告)号:US20050245057A1

    公开(公告)日:2005-11-03

    申请号:US10837416

    申请日:2004-04-30

    CPC分类号: H01L27/0207

    摘要: This disclosure relates to misalignment-tolerant processes for fabricating multiplexing/demultiplexing architectures. One process enables fabricating a multiplexing/demultiplexing architecture at a tolerance greater than a pitch of conductive structures with which the architecture is capable of communicating. Another process can enable creation of address elements and conductive structures having substantially identical widths.

    摘要翻译: 本公开涉及用于制造复用/解复用架构的不对准容错过程。 一个过程使得能够以比架构能够通信的导电结构的间距更大的公差制造复用/解复用架构。 另一个过程可以创建具有基本上相同宽度的地址元素和导电结构。

    Method of manufacturing an emitter
    54.
    发明授权
    Method of manufacturing an emitter 失效
    制造发射体的方法

    公开(公告)号:US06703252B2

    公开(公告)日:2004-03-09

    申请号:US10066149

    申请日:2002-01-31

    IPC分类号: H01L2166

    摘要: A method is disclosed for creating an emitter having a flat cathode emission surface: First a protective layer that is conductive is formed on the flat cathode emission surface. Then an electronic lens structure is created over the protective layer. Finally, the protective layer is etched to expose the flat cathode emission surface.

    摘要翻译: 公开了一种用于产生具有平坦的阴极发射表面的发射体的方法:首先在平坦的阴极发射表面上形成导电的保护层。 然后在保护层上形成电子透镜结构。 最后,蚀刻保护层以暴露平坦的阴极发射表面。