摘要:
A coordinate measuring machine (1) for measuring structures (3) on a substrate (2) including a measurement table (20) movable in the X-coordinate direction and in the Y-coordinate direction, a measurement objective (9), at least one laser interferometer (24) for determining the position of the measurement table (20) and the measurement objective (9) wherein the measurement table (20), the measurement objective (9) and the at least one laser interferometer (24) are arranged in a vacuum chamber (50).
摘要:
A system for determining positions of structures on a substrate is disclosed. The system includes a plurality of stations enclosed by a housing. At least one of the stations inside the housing is designed to be movable. The housing is provided with a filter fan unit generating an air flow in the housing. Air-directing elements are provided in the housing so that an invariable flow may be achieved irrespective of the at least one movable station.
摘要:
A method and a coordinate measuring machine (1) are provided, wherein the non-linearities of an interferometer (24) can be corrected. A measuring stage (20) traversable in a plane (25a) is provided for measurement. The substrate (2) is placed in a measuring stage (20); wherein the position of the measuring stage (20) along each of the motion axes is determined by at least one interferometer (24) in each case. A computer (16) is provided for compensating the non-linearity inherent in each of the interferometers (24), wherein the position of the measuring stage (20) to be determined by the interferometers (24) is arranged along a trajectory (52, 60, 67) of the measuring stage (20), which is composed at least partially of components of the axes.
摘要:
A device for determining the position of a structure (3) on an object (2) in relation to a coordinate system is disclosed. The object (2) is placed on a measuring table (20) which is movable in one plane (25a), wherein a block (25) defines the plane (25a). At least one optical arrangement (40, 50) is provided for transmitted light illumination and/or reflected light illumination. The optical arrangement (40, 50) comprises an illumination apparatus (41, 51) for reflected light illumination and/or transmitted light illumination and at least one first or second optical element (9a, 9b), wherein at least part of the at least one optical element (9a, 9b) extends into the space (110) between the block (25) and an optical system support (100). The block (25) and/or the optical system support (100) separates the illumination apparatus (41, 51) spatially from the plane (25a) in which the measuring table (20) is movable.
摘要:
A method for acquiring high-resolution images of defects on the upper surface of the wafer edge is disclosed. For this purpose, first the position of at least one defect on the upper surface of the wafer edge is determined. The thus determined position of the defect is stored. Then the wafer is transferred into device for micro-inspection, in which the defect is examined more closely and imaged. The images acquired in the device for micro-inspection are deposited in a directory.
摘要:
A device for determining the position of a structure (3) on an object (2) in relation to a coordinate system is disclosed. The object (2) is placed on a measuring table (20) which is movable in one plane (25a), wherein a block (25) defines the plane (25a). At least one optical arrangement (40, 50) is provided for transmitted light illumination and/or reflected light illumination. The optical arrangement (40, 50) comprises an illumination apparatus (41, 51) for reflected light illumination and/or transmitted light illumination and at least one first or second optical element (9a, 9b), wherein at least part of the at least one optical element (9a, 9b) extends into the space (110) between the block (25) and an optical system support (100). The block (25) and/or the optical system support (100) separates the illumination apparatus (41, 51) spatially from the plane (25a) in which the measuring table (20) is movable.
摘要:
A method for correcting an error of the imaging system of a coordinate measuring machine is disclosed. The position of at least two different edges of at least one structure on a substrate is measured. The substrate may be automatically rotated into another orientation. Then the position of the at least two different edges of the at least one structure is measured on the rotated substrate. Based on the measurement data, a systematic error of the imaging system is eliminated.
摘要:
A method and an apparatus for inspecting a surface of a wafer disclosed. At least one incident-light illuminator is provided to illuminate an area of the surface of the wafer in a first and a second illumination mode, in particular a bright-field and a dark-field illumination. At least one image detector is provided to detect an image of the illuminated area. A storage device is used for storing values on the intensity and the color of an optimized illumination of each incident-light illumination mode.
摘要:
A means and a method for determining the spatial position of at least one moving element (9, 20) of a coordinate measuring machine (1) are disclosed. At least one laser interferometer (24) directs a measurement beam (23) to the moving element (9, 20). At least one laser interferometer directs a further measurement beam to the moving element to determine a rotation of the moving element (9, 20) around an X-coordinate direction or around a Y-coordinate direction or around a Z-coordinate direction.
摘要:
A method for correcting the measuring errors caused by the lens distortion of an objective in a coordinate measuring machine is disclosed. For a plurality of different types of structures, the lens distortion caused by an objective is determined in an image field of the objective. The position of a type of structure is determined in the image field of the objective by a measuring window. The correction of the lens distortion required for the type of structure to be measured is retrieved from the database as a function of the type of structure to be measured.