Abstract:
A combined assembly of a fixing base and an angled heat pipe includes a fixing base and heat pipes. The fixing base has a plate body. The bottom surface of the plate body is formed with opening trough. An end of the opening trough is provided with a through hole penetrating through the plate body. The opening trough is formed with an enlarging portion. The width of the enlarging portion is larger than that of a mouth of the opening trough. The heat-releasing end penetrates out of the through hole, and the heat-absorbing end is accommodated in the opening trough. A portion of the heat-absorbing end abuts against the inner wall of the opening trough, while the exposed portion thereof is flush with the bottom surface of the fixing base.
Abstract:
An image-processing unit for an image sensor is provided. The image-processing unit comprises a plurality of photodiodes arranged inside the image sensor. The photodiodes have different sensing area according to its location. Typically, the sensing area of the photodiodes increases from the center toward the periphery. Therefore, the attenuation of sensitivity caused by a larger incident angle away from the central region can be compensated to enhance image quality.
Abstract:
A method for fabricating salicide devices over a substrate is described. The substrate has a gate structure pair in which a first gate structure comprises a first gate and a first stuffed film located on the first gate, and a second gate structure comprises a second gate and a second stuffed film located on the first gate. A first spacer is formed on the sidewall of the first gate structure. A second spacer is formed at the sidewall of the second gate structure. The first and the second stuffed films are removed. The second spacer is etched back so as to form a third spacer lower than the second gate. Salicide layers are formed upon the first and the second gates.
Abstract:
A circuit capable of automatically calibrating a resonant frequency of an antenna includes the antenna, a switch, a conversion unit, a count comparator, and a capacitor array. The switch is coupled to the antenna for being turned on and turned off according to a pulse. The antenna is used for generating the resonant frequency according to on and off of the switch. The conversion unit is coupled to the antenna for generating a clock according to a signal with the resonant frequency. The count comparator is coupled to the conversion unit for counting a number generated by a reference clock during a period of the clock, and comparing the pulse number with a predetermined value to generate an adjustment signal. The capacitor array is used for adjusting capacitance of the capacitor array according to the adjustment signal.
Abstract:
A resistance regulating balance board includes a disc body disposed onto a semispherical base. A resistance member is disposed inside the semispherical base. An elastic component and a locking member are disposed inside a containing chamber within the resistance member. A screw rod passes through the disc body, the semispherical base and the elastic component to engage with the locking member so that a user can rotate the screw rod to regulate a resistance value generated between the resistance member and the semispherical base to change the magnitude of motion resistance of the balance board, thereby achieving optimum exercise and balancing effects.
Abstract:
A heat dissipating structure of a lightweight lamp cup 10 made of a porous material includes a containing cavity 11 at an end of the lamp cup 10, a lamp holder 30 at another end of the containing cavity 11, a metal hood 60 sheathed with the lamp holder 30 and covered onto an external side of the lamp cup 10, a heat conduction medium 50 between the lamp cup 10 and the metal hood 60, and a light emitting unit 20 contained in the containing cavity 11 of the lamp cup 10, such that the heat produced by the light emitting unit 20 can be conducted form the lamp cup 10 to the metal hood 60 and dissipated from the metal hood 60 to the outside.
Abstract:
An active heat dissipating LED illumination lamp includes a substrate holder, at least one LED illumination assembly, a plurality of heat pipes and a heat sink module. The LED illumination assembly is installed on a side of the substrate holder, and the heat pipes and the heat sink module are installed on the other side of the substrate holder, and a plurality of first diversion channels is formed between the heat pipes, and each heat dissipating fin has at least one ventilation hole occupying 12%˜60% of the total area to form a second diversion channel, and a second interval is defined between the bottom of the heat sink module and the substrate holder. When the heat generated by the LED illumination assembly is provided for performing heat conduction, the heat is guided actively to the second diversion channel to perform heat convection.
Abstract:
A wind guider of integrated circuit heat dissipation structure includes a first connecting portion, wide-guiding pipes, a second connecting portion and wind-guiding holes. The first connecting portion is connected to heat-dissipating fins. The wide-guiding pipes are integrally connected to the first connecting portion. The second connecting portion is integrally connected to the wide-guiding pipes. A heat-dissipating fan is mounted in the second connecting portion. The second connecting portion is not in parallel to the first connecting portion. The wide-guiding holes run through the first connecting portion, the wide-guiding pipes and the second connecting portion. Since the second connecting portion is not in parallel to the first connecting portion, a cooling airflow generated by the heat-dissipating fan in the second connecting portion can blow to a region corresponding to the heat-dissipating fins. Thus, the cooling airflow blows to the hottest portion of the heat-dissipating fins directly, thereby improving the cooling efficiency and lowering the temperature of the integrated circuit.
Abstract:
A heat-dissipating fin of a large area is made of a metallic sheet and has a fin body. An outer edge of one side of the fin body extends to form a sheet-like expanding portion. The expanding portion is bent and overlapped on the fin body to obtain the heat-dissipating fin. A heat sink includes a plurality of heat-dissipating fins and a heat-conducting element, which is formed by means of penetrating the respective heat-dissipating fins with a condensing section of the heat-conducting element.
Abstract:
The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of the heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved.