公开(公告)号：US5217811A

公开(公告)日：1993-06-08

申请号：US944026

申请日：1992-09-11

Applicant: Robert W. Filas ,  Bertrand H. Johnson ,  Ching-Ping Wong

Inventor： Robert W. Filas ,  Bertrand H. Johnson ,  Ching-Ping Wong

IPC: C08K5/5419

CPC classification number: C08K5/5419 ,  Y10T428/31663

Abstract: Devices are described in which certain crosslinked silicone polymers are incorporated. These polymers have various functions such as encapsulating agents, surface protective agents or agents to index match optical components (e.g. optical fiber, optical waveguide, etc.) to other optical devices or articles. The polymer is a vinyl-terminated dimethyldiphenylsiloxane copolymer crosslinked with tri- or tetrafunctional silanes in the presence of a platinum catalyst. The phenyl group content of the crosslinked silicone copolymer is adjusted to change the index of refraction of the polymer to the optimum for the particular application contemplated. Polymer preparation procedures are described which yield good optical quality for the polymer as well as optimum physical and chemical properties.

公开(公告)号：US4720741A

公开(公告)日：1988-01-19

申请号：US878717

申请日：1986-06-26

Applicant: Theodore F. Schaaf ,  Ching-Ping Wong

Inventor： Theodore F. Schaaf ,  Ching-Ping Wong

IPC: H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/30 ,  H01L23/06

CPC classification number: H01L23/296 ,  H01L2924/0002 ,  Y10T428/239 ,  Y10T428/31663

Abstract: In an electronic device assembly comprising at least one circuit element an encapsulant therefor, wherein the encapsulant comprises a silicone resin characterized in that subsequent to the curing of said encapsulant, the resin is coated with a fine inorganic powder such as fumed or fused silica which essentially eliminates static charge and tackiness of the surface.

公开(公告)号：US4604144A

公开(公告)日：1986-08-05

申请号：US774674

申请日：1985-09-11

Applicant: Ching-Ping Wong

Inventor： Ching-Ping Wong

IPC: C23G1/10 ,  H05K3/26 ,  H05K3/28 ,  C23G1/02 ,  C23G1/14

CPC classification number: H05K3/26 ,  C23G1/103 ,  H05K2203/0786 ,  H05K2203/0789 ,  H05K2203/122 ,  H05K3/284

Abstract: In a method of cleaning a circuit board having a silicone encapsulated hybrid integrated circuit thereon, subsequent to aqueous solder flux residue removal with an ionic detergent, the board is cleaned with a low molecular weight organic acid such as formic, acetic or oxalic acid.

Abstract translation: 在清洗其上具有硅树脂封装的混合集成电路的电路板的方法中，在用离子洗涤剂除去水性助焊剂残余物之后，用低分子量有机酸如甲酸，乙酸或草酸清洗该板。

公开(公告)号：US4255481A

公开(公告)日：1981-03-10

申请号：US79000

申请日：1979-09-26

Applicant: Donald Dinella ,  Ching-Ping Wong

Inventor： Donald Dinella ,  Ching-Ping Wong

IPC: B32B15/08 ,  G03F1/00 ,  H05K3/00 ,  H05K3/18 ,  B32B27/00

CPC classification number: B32B15/08 ,  G03F1/50 ,  H05K3/0002 ,  H05K3/185 ,  Y10T428/24917 ,  Y10T428/26 ,  Y10T428/266 ,  Y10T428/31544

Abstract: A mask for selectively transmitting therethrough a desired light radiant energy is disclosed. The mask comprises a stress-relieved, essentially dimensionally stable base, comprising a copolymer of tetrafluoroethylene and hexafluoropropylene, which is capable of transmitting therethrough the light radiant energy. A blocking film is deposited on at least a portion of the base for blocking the transmission of the light radiant energy through the portion of the base.

Abstract translation: 公开了一种用于选择性地透过其所需的光辐射能的掩模。 掩模包括应力消除的基本上尺寸稳定的基底，其包含四氟乙烯和六氟丙烯的共聚物，其能够透射光辐射能。 阻挡膜沉积在基底的至少一部分上，用于阻挡光辐射能通过基底部分的透射。

公开(公告)号：US4200668A

公开(公告)日：1980-04-29

申请号：US939607

申请日：1978-09-05

Applicant: Paul D. Segal ,  Ching-Ping Wong

Inventor： Paul D. Segal ,  Ching-Ping Wong

IPC: C03C17/06 ,  G03F1/72 ,  B05D3/06

CPC classification number: G03F1/72 ,  C03C17/06 ,  C03C2217/252 ,  C03C2217/26 ,  C03C2217/261 ,  C03C2218/11 ,  C03C2218/355 ,  Y10T428/24331

Abstract: A method of repairing pin holes in a defective photomask such as one comprising a patterned chromium film on a glass substrate comprises depositing an adhesion promoting film such as siloxane on the surface of the photomask, then depositing a solvent soluble layer such as a photoresist layer over the adhesion promoting layer, a window is then formed through the layers and underlying photomask in the area of the pin hole by burning through these layers by means of a laser. The exposed areas of the window are etched and a metallic film is deposited over the exposed surfaces. Finally, the photomask is treated with solvent for removing the solvent soluble photoresist which also causes the metal film deposited thereon to be removed in all areas except the area of the window.

Abstract translation: 在玻璃基板上包括图案化铬膜的缺陷光掩模修复针孔的方法包括在光掩模的表面上沉积粘附促进膜如硅氧烷，然后将诸如光致抗蚀剂层的溶剂可溶层沉积在 然后通过用激光烧穿这些层，在针孔的区域中通过层和底层光掩模形成粘合促进层，窗口。 蚀刻窗口的暴露区域，并在暴露的表面上沉积金属膜。 最后，用溶剂处理光掩模以除去溶剂可溶性光致抗蚀剂，这也使得沉积在其上的金属膜在除了窗口区域之外的所有区域中被除去。