公开(公告)号：USD453172S1

公开(公告)日：2002-01-29

申请号：US29139783

申请日：2001-04-06

Applicant: James Cheng

Designer： James Cheng

公开(公告)号：US06274426B1

公开(公告)日：2001-08-14

申请号：US09257830

申请日：1999-02-25

Applicant: Yu-Hua Lee ,  James (Cheng-Ming) Wu ,  Min-Hsiung Chiang

Inventor： Yu-Hua Lee ,  James (Cheng-Ming) Wu ,  Min-Hsiung Chiang

IPC: H01L218242

CPC classification number: H01L21/76831 ,  H01L21/31116 ,  H01L21/3212 ,  H01L21/76802 ,  H01L21/76897 ,  H01L27/10855 ,  H01L28/91

Abstract: A process for fabricating a crown shaped, capacitor structure, in a SAC opening, featuring a silicon nitride spacer, located on the walls of a bottom portion of the SAC opening, has been developed. The process features forming a SAC opening in a thick silicon oxide layer, then repairing, or filling, seams or voids, that may be present in the thick silicon oxide layer, at the perimeter of the SAC opening, via formation of a silicon nitride spacer on the sides of the SAC opening. Subsequent processing features: the isotropic removal of a top portion of the silicon nitride spacer; the formation of a polysilicon storage node structure, in the SAC opening; and the recessing of a top portion of the thick silicon oxide layer, resulting in exposure of additional polysilicon storage node, surface area.

Abstract translation: 已经开发了一种用于制造位于SAC开口的底部的壁上的具有氮化硅间隔物的SAC开口中的冠状电容器结构的方法。 该工艺特征是在厚的氧化硅层中形成SAC开口，然后通过形成氮化硅间隔物在SAC开口的周边处形成可能存在于厚氧化硅层中的或者填充接缝或空隙 在SAC开幕的两边。 随后的处理特征：氮化硅间隔物的顶部的各向同性去除; 形成多晶硅存储节点结构，在SAC开放; 并且厚的氧化硅层的顶部凹陷，导致额外的多晶硅存储节点的曝光，表面积。

公开(公告)号：USD442321S1

公开(公告)日：2001-05-15

申请号：US29116924

申请日：2000-01-12

Applicant: Robert James Cheng

Designer： Robert James Cheng

公开(公告)号：USD441775S1

公开(公告)日：2001-05-08

申请号：US29122671

申请日：2000-05-02

Applicant: James Cheng

Designer： James Cheng

公开(公告)号：US4672351A

公开(公告)日：1987-06-09

申请号：US719128

申请日：1985-04-02

Applicant: James Cheng

Inventor： James Cheng

IPC: H01H71/04 ,  H01H73/14 ,  H01H73/30 ,  H01H61/00 ,  H01H71/18

CPC classification number: H01H73/14 ,  H01H71/04 ,  H01H73/30

Abstract: A base body with a big cavity in its center, a frame body encased in the cavity and retained therein by the ends of the shorter legs of the U-shaped contact plates is disclosed. During an overload condition, overheating causes a spring engaging the clipper plate to expand, which frees the frame body from the shorter legs of the contact plates and the frame body is ejected upward by a coil spring inside the frame body. The frame body is detained in the cavity of base body when freed from the shorter legs of the contact plates by engagement between flanges on frame body and the ends of the longer legs of the U-shaped contact plates, and an LED trouble indicator is used to indicate the overload condition.

Abstract translation: 公开了一种在其中心具有大空腔的基体，包围在空腔中并被U形接触板的较短腿的端部保持在其中的框架体。 在过载状态下，过热会导致与挡板平行的弹簧膨胀，从而使框架体从接触板的较短的腿部松开，并且框体通过框体内的螺旋弹簧向上弹出。 通过框架体上的法兰与U形接触板的较长的腿部的接合，通过接合从触点板的较短的腿部脱离，框架主体被扣留在基体的空腔中，并且使用LED故障指示器 以指示过载状况。

公开(公告)号：US12125608B2

公开(公告)日：2024-10-22

申请号：US18220405

申请日：2023-07-11

Applicant: James Cheng Lee

Inventor： James Cheng Lee

IPC: H01B11/00 ,  H01B7/18 ,  H05K9/00

CPC classification number: H01B11/002 ,  H01B7/18 ,  H05K9/0098

Abstract: The present invention provides a differential paired cable with compensation functions, including: a first wire; a second wire; a first insulating layer; a second insulating layer; a ground wire; and a shielding layer. By controlling at least one of a length difference between the first insulating layer and the second insulating layer exposed outside of the shielding layer to be greater than 0.1 mm, a diameter difference between the first wire and the second wire to be greater than 0.005 mm, and a length difference between a welding portion of the first wire and a welding portion of the second wire to be greater than 0.05 mm, a signal transmission rate of one of the first wire and the second wire is compensated, so as to reduce an intra pair skew of the differential paired cable.

公开(公告)号：US20240321481A1

公开(公告)日：2024-09-26

申请号：US18393879

申请日：2023-12-22

Applicant: James Cheng Lee

Inventor： James Cheng Lee

IPC: H01B3/44 ,  B29C48/154 ,  C08J7/04 ,  B29K27/12

CPC classification number: H01B3/445 ,  B29C48/154 ,  C08J7/0427 ,  B29K2027/12 ,  C08J2327/18

Abstract: A method for producing a cable by covering with polytetrafluoroethylene and extrusion molding with a perfluoroalkoxy compound, including: covering an outer surface of a conductor with an insulation layer; and extrusion molding a skin layer on an outer surface of the insulation layer to form a cable. The insulation layer and the skin layer are made of polytetrafluoroethylene and a perfluoroalkoxy compound, respectively. The perfluoroalkoxy compound and polytetrafluoroethylene both have high temperature resistance, good electronic signal transmitting performance, and non-bonding surface, etc., and the perfluoroalkoxy compound has a Shore hardness of 60 to 70D, which can impart the skin layer a certain hardness, and is suitable for being extrusion molded on the outer surface of the insulation layer made of polytetrafluoroethylene, so as to support the insulation layer and prevent the insulation layer from being deformed. Therefore, the perfluoroalkoxy compound is the most suitable material for the skin layer.

公开(公告)号：US11791062B2

公开(公告)日：2023-10-17

申请号：US17880196

申请日：2022-08-03

Applicant: James Cheng Lee

Inventor： James Cheng Lee

IPC: H01B7/00 ,  H01B7/02 ,  H01B7/18 ,  H01B11/00

CPC classification number: H01B7/0009 ,  H01B7/0216 ,  H01B7/1805 ,  H01B11/002

Abstract: A cable with a non-circular ground wire is provided, including two wires, two ground wires, and an insulating tape; wherein the inner sides of the wires are in contact with each other; the ground wires are respectively arranged on two opposite sides of the wires; each ground wire at least includes a first side surface, a second side surface, and a third side surface; the first and second side surfaces respectively contact the outer surfaces of the two wires, and the shapes of the first side surface and the second side surface respectively correspond to the shapes of the outer surfaces of the two wires; the insulating tape covers the outer surfaces of the wires and the third sides of the ground wires. Thereby, the mechanical properties of the cable of the present invention, such as small impedance variation of high-frequency signal transmission, transmission stability, structural flexibility and bending, can be significantly improved.

公开(公告)号：US11631509B2

公开(公告)日：2023-04-18

申请号：US17548781

申请日：2021-12-13

Applicant: James Cheng Lee

Inventor： James Cheng Lee

IPC: H01B13/10 ,  B29C53/80 ,  B29C53/56 ,  B29K27/18 ,  B29L31/34

Abstract: A double-layer longitudinal wrapping mold is disclosed, including a base, a first longitudinal wrapping structure, a first pressing structure, a second longitudinal wrapping structure, a second pressing structure and a first necking structure. The first longitudinal wrapping structure is disposed on the base and has a first guide hole, a first outer layer wrapping hole and an inner layer wrapping hole. The first pressing structure is disposed on the base and has a first pressing hole and a second outer layer wrapping tape hole. The second longitudinal wrapping structure is disposed on the base and has a second guide hole and a third outer layer wrapping tape hole. The second pressing structure is disposed on the base and has a second pressing hole and a fourth outer layer wrapping tape hole. The first necking structure is disposed on the base and has a necking hole.

公开(公告)号：US20220223322A1

公开(公告)日：2022-07-14

申请号：US17548781

申请日：2021-12-13

Applicant: James Cheng Lee

Inventor： James Cheng Lee

IPC: H01B13/10 ,  B29C53/80 ,  B29C53/56

Abstract: A double-layer longitudinal wrapping mold is disclosed, including a base, a first longitudinal wrapping structure, a first pressing structure, a second longitudinal wrapping structure, a second pressing structure and a first necking structure. The first longitudinal wrapping structure is disposed on the base and has a first guide hole, a first outer layer wrapping hole and an inner layer wrapping hole. The first pressing structure is disposed on the base and has a first pressing hole and a second outer layer wrapping tape hole. The second longitudinal wrapping structure is disposed on the base and has a second guide hole and a third outer layer wrapping tape hole. The second pressing structure is disposed on the base and has a second pressing hole and a fourth outer layer wrapping tape hole. The first necking structure is disposed on the base and has a necking hole.