Abstract:
In various methods of performing program operations in phase change memory devices, selected memory cells are repeatedly programmed to obtain resistance distributions having desired characteristics such as adequate sensing margins.
Abstract:
A method of performing a program-suspend-read operation in a PRAM device comprises programming a write block comprising N unit program blocks in response to a program operation request, and suspending the program operation after programming M unit program blocks, where M is less than N, in response to a read operation request. The method further comprises executing the requested read operation, and then resuming the programming of the write data block and programming (N−M) remaining unit program blocks.
Abstract:
In one aspect, a non-volatile memory includes a phase-change memory cell array which includes a plurality of normal phase-change memory cells and a plurality of pseudo one-time-programmable (OTP) phase-change memory cells, a write driver which writes data into the normal and pseudo OTP phase-change memory cells of the phase-change memory cell array, and an OTP controller which selectively disables the write driver.
Abstract:
The present invention relates to an acryl-silicon rubber complex polymer and a method for the preparation and use of the same. More precisely, the present invention relates to an acryl-silicon rubber complex polymer which has a seed-core-shell structure wherein the vinyl monomer and hydrophilic monomer are cross-linked on the seed; the acryl-silicon complex IPN core having an IPN (interpenetrating network) structure in which silicon rubber particles are dispersed by being cross-linked to acryl rubber, in a continuous phase, is formed on the seed; and a shell prepared by graft-polymerization of C1˜C4 alkyl methacrylate to the acryl-silicon complex IPN core is formed on the core, and a method of preparation and use of the same. The acryl-silicon rubber complex polymer of the present invention has excellent impact resistance, weatherability and gloss, so that it can be effectively used as an impact modifier for vinyl chloride resin. The acryl-silicon complex IPN core has an IPN (interpenetrating network) structure formed by radical polymerization of acryl monomer and hydrosilyation of silicon rubber.
Abstract:
The present invention relates to acryl-silicone hybrid impact modifiers, the method of their manufacture, and vinyl chloride resin compositions containing the above. The acryl-silicone hybrid impact modifier of the present invention is comprised of a) 0.01 to 10 parts by weight of a seed obtained through emulsion copolymerization of vinyl monomers and hydrophilic monomers; b) 60 to 94 parts by weight of an acryl-silicone hybrid rubber core covering the seed in which a polyorganosiloxane rubber phase is dispersed locally onto the inner part and surface of the acrylic rubber core containing alkyl acrylate polymers of which alkyl group has 1 to 8 carbon atoms; and c) 6 to 40 parts by weight of a shell covering the above rubber core and containing alkyl methacrylate polymers of which alkyl group has 1 to 4 carbon atoms. Thermoplastic resins containing the above, particularly by being added to vinyl chloride resins, they have effects of granting superior impact resistance, weatherability, and high gloss.
Abstract:
A package map data outputting circuit of a semiconductor memory device embedded with a test circuit and a method for the same are provided. To improve the reliability of package map data and easily output a greater amount of the package map data, the package map data is stored to package map data registers at the wafer level and then output through the test circuit at the package level.
Abstract:
The present invention relates to a preparation method of a tungsten carbide sintered body for a friction stir welding tool used in a friction stir welding tool of a high melting point material such as steel, titanium and the like or a dissimilar material such as aluminum, magnesium-steel, titanium and the like. The preparation method comprises the following steps: filling a tungsten carbide (WC) powder in a mold made of a graphite material; mounting the mold filled with tungsten carbide powder in a chamber of a discharge plasma sintering apparatus; making a vacuum inside of the chamber; molding the tungsten carbide powder while maintaining a constant pressure inside the mold and increasing the temperature according to a set heat increase pattern until the temperature reaches a final target temperature; and cooling the inside of the chamber while maintaining the pressure pressurized in the mold after the molding step.
Abstract:
Disclosed is a pressurized hollow fiber membrane module that exhibits improved durability without deterioration in packing density and permeation flux. The pressurized hollow fiber membrane module includes a composite hollow fiber membrane comprising a tubular braid woven by yarns and a polymer film on the outer surface of the tubular braid. At least one of the yarns comprises a small-fineness filament and a medium-fineness filament. The small-fineness filament comprises first monofilaments having a fineness of 0.01 to 0.4 denier, the medium-fineness filament comprises second monofilaments having a fineness higher than 0.4 and lower than 3, and a ratio of thickness of the tubular braid to outer diameter thereof is 15 to 35%.
Abstract:
Disclosed is a crosslinked polymer nanoparticle containing composition, a method for preparing a copolymer using the composition, and a vinyl chloride resin with improved foam molding properties. Processing aid in according with the present invention, provides the effects of improved foam molding properties and processibility of a vinyl chloride resin, during a foam molding process upon being added to the vinyl chloride resin.
Abstract:
A nonvolatile memory device includes an array of resistive memory cells and a write driver, which is configured to drive a selected bit line in the array with a reset current pulse, which is responsive to a first external voltage input through a first terminal/pad of the memory device during a memory cell reset operation. The write driver is further configured to drive the selected bit line in sequence with a first set current pulse, which is responsive to the first external voltage, and a second set current pulse, which is responsive to a second external voltage input through a second terminal/pad of the memory device during a memory cell set operation.