公开(公告)号：US07860357B2

公开(公告)日：2010-12-28

申请号：US12228102

申请日：2008-08-09

申请人： Hsiao-Wen Lee ,  Peter Zung ,  Tzu-Han Lin ,  Tzy-Ying Lin ,  Chia-Yang Chang ,  Chien-Pang Lin

发明人： Hsiao-Wen Lee ,  Peter Zung ,  Tzu-Han Lin ,  Tzy-Ying Lin ,  Chia-Yang Chang ,  Chien-Pang Lin

IPC分类号： G02B6/12

CPC分类号： H01L27/14618 ,  H01L21/76898 ,  H01L23/481 ,  H01L27/14683 ,  H01L2223/6622 ,  H01L2224/274 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/00

摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.

摘要翻译： 公开了一种光电器件芯片及其制造方法。 芯片包括器件基板，光学透明上基板和复合间隔层，其包括粘合材料和分散在所述粘合材料中的多个颗粒。 器件基板和上基板之间的距离由复合间隔层的厚度控制，使得该变化在光学系统的焦深范围内。

公开(公告)号：US07592680B2

公开(公告)日：2009-09-22

申请号：US11528461

申请日：2006-09-28

申请人： Hsiao-Wen Lee ,  Pai-Chun Peter Zung ,  Tzu-Han Lin

发明人： Hsiao-Wen Lee ,  Pai-Chun Peter Zung ,  Tzu-Han Lin

IPC分类号： H01L27/14

CPC分类号： H04N5/2254 ,  H04N5/2257

摘要： A wafer level image module includes a photo sensor for outputting an electrical signal upon receiving light, a lens set for focusing incident light onto the photo sensor, and an adjustment member disposed between the photo sensor and the lens set for controlling the distance between the photo sensor and the lens set to compensate the focus offset of the photo sensor for enabling the lens set to accurately focus the incident light onto the photo sensor in an in-focus manner so as to provide a high image quality.

摘要翻译： 晶片级图像模块包括用于在接收光时输出电信号的光传感器，用于将入射光聚焦到光传感器上的透镜组以及设置在光传感器和透镜组之间的调节构件，用于控制照片之间的距离 传感器和透镜设置以补偿光传感器的聚焦偏移，以使透镜组能够以聚焦方式精确地将入射光聚焦到光传感器上，从而提供高图像质量。

公开(公告)号：US20090174019A1

公开(公告)日：2009-07-09

申请号：US12356347

申请日：2009-01-20

申请人： Hsiao-Wen Lee

发明人： Hsiao-Wen Lee

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L27/14685 ,  H01L27/14603 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627

摘要： An image sensing device for receiving an incident light having an incident angle and photo signals formed thereby is provided. The image sensing device includes a micro prism and a micro lens for adjusting the incident angle and converging the incident light, respectively, a photo sensor for converting the photo signals into electronic signals, and an IC stacking layer for processing the electronic signals.

摘要翻译： 提供一种用于接收具有入射角的入射光和由此形成的光信号的图像感测装置。 图像感测装置包括微棱镜和微透镜，用于分别调节入射角度并会聚入射光，用于将光信号转换成电子信号的光传感器，以及用于处理电子信号的IC堆叠层。

公开(公告)号：US07519262B2

公开(公告)日：2009-04-14

申请号：US11796729

申请日：2007-04-27

申请人： Sheng-Lung Huang ,  Chia-Yao Lo ,  Kwang-Yao Huang ,  Shih-Yu Tu ,  Hsiao-Wen Lee ,  Sheng-Pan Huang ,  Sun-Bin Yin

发明人： Sheng-Lung Huang ,  Chia-Yao Lo ,  Kwang-Yao Huang ,  Shih-Yu Tu ,  Hsiao-Wen Lee ,  Sheng-Pan Huang ,  Sun-Bin Yin

IPC分类号： G02B6/02

CPC分类号： H01S3/06708 ,  G02B6/02 ,  H01S3/06716 ,  H01S3/06795

摘要： The present invention relates to a fiber having a core of crystal fiber doped with chromium and a glass cladding. The fiber has a gain bandwidth of more than 300 nm including 1.3 mm to 1.6 mm in optical communication, and can be used as light source, optical amplifier and tunable laser when being applied for optical fiber communication. The present invention also relates to a method of making the fiber. First, a chromium doped crystal fiber is grown by laser-heated pedestal growth (LHPG). Then, the crystal fiber is cladded with a glass cladding by codrawing laser-heated pedestal growth (CDLHPG). Because it is a high temperature manufacture process, the cladding manufactured by this method is denser than that by evaporation technique, and can endure relative high damage threshold power for the pumping light.

摘要翻译： 本发明涉及具有掺杂有铬的晶体纤维芯和玻璃包层的纤维。 该光纤在光通信中具有大于300nm的增益带宽，包括1.3mm至1.6mm，并且在用于光纤通信时可用作光源，光放大器和可调谐激光器。 本发明还涉及制造纤维的方法。 首先，通过激光加热基座生长（LHPG）生长掺杂铬的晶体光纤。 然后，通过编织激光加热底座生长（CDLHPG），晶体纤维用玻璃包层包覆。 由于是高温制造工艺，所以通过这种方法制造的包层比通过蒸发技术更密实，并且能承受相对较高的泵浦光损伤阈值功率。

公开(公告)号：US20090078855A1

公开(公告)日：2009-03-26

申请号：US12288257

申请日：2008-10-17

申请人： Chin-Chen Kuo ,  Wu-Chieh Liu ,  Hsiao-Wen Lee ,  Bii-Cheng Chang

发明人： Chin-Chen Kuo ,  Wu-Chieh Liu ,  Hsiao-Wen Lee ,  Bii-Cheng Chang

IPC分类号： H01L27/00

CPC分类号： H01L27/14627 ,  H01L27/14603 ,  H01L27/14685

摘要： The present invention provides an image sensor which comprises improved microlenses to cope with different optical requirements for oblique incident light or different components of light. In one embodiment, the image sensor comprises at least two microlenses having different radii of curvature. In another embodiment, the image sensor comprises at least one asymmetrical microlens.

摘要翻译： 本发明提供了一种图像传感器，其包括改进的微透镜以应对对于倾斜入射光或不同光分量的不同光学要求。 在一个实施例中，图像传感器包括具有不同曲率半径的至少两个微透镜。 在另一个实施例中，图像传感器包括至少一个非对称微透镜。

公开(公告)号：US20080303109A1

公开(公告)日：2008-12-11

申请号：US12228102

申请日：2008-08-09

申请人： Hsiao-Wen Lee ,  Peter Zung ,  Tzu-Han Lin ,  Tzy-Ying Lin ,  Chia-Yang Chang ,  Chien-Pang Lin

发明人： Hsiao-Wen Lee ,  Peter Zung ,  Tzu-Han Lin ,  Tzy-Ying Lin ,  Chia-Yang Chang ,  Chien-Pang Lin

IPC分类号： H01L31/0203

CPC分类号： H01L27/14618 ,  H01L21/76898 ,  H01L23/481 ,  H01L27/14683 ,  H01L2223/6622 ,  H01L2224/274 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/00

摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.

公开(公告)号：US20080225390A1

公开(公告)日：2008-09-18

申请号：US11717128

申请日：2007-03-13

申请人： Chia-Yang Chang ,  Teng-Sheng Chen ,  Hsiao-Wen Lee ,  Sheng-Shin Guo

发明人： Chia-Yang Chang ,  Teng-Sheng Chen ,  Hsiao-Wen Lee ,  Sheng-Shin Guo

IPC分类号： G02B27/42 ,  G02B3/00

CPC分类号： B29D11/00365

摘要： An optical microstructure plate and mold for fabricating the same is disclosed. The optical microstructure plate comprises a substrate. An optical microstructure element is formed on the substrate. A period alignment mark is disposed on the substrate to provide alignment for fabricating the optical microstructure element by a mold. A universal alignment mark is disposed on the substrate to provide alignment for bonding another plate therewith. Specifically, the mold comprises a concave within a mold substrate, a spoiler around the concave, and a buffer zone adjacent to the spoiler.

摘要翻译： 公开了一种用于制造它的光学微结构板和模具。 光学微结构板包括基底。 在基板上形成光学微结构元件。 周期对准标记设置在基板上以提供用于通过模具制造光学微结构元件的对准。 通用对准标记设置在基板上以提供用于将另一个板粘合的对准。 具体地，模具包括在模具基板内的凹部，围绕凹部的扰流板和与扰流板相邻的缓冲区域。

公开(公告)号：US20070166029A1

公开(公告)日：2007-07-19

申请号：US11653297

申请日：2007-01-16

申请人： Hsiao-Wen Lee ,  Tzu-Han Lin ,  Pai-Chun Peter Zung ,  Chien-Pang Lin

发明人： Hsiao-Wen Lee ,  Tzu-Han Lin ,  Pai-Chun Peter Zung ,  Chien-Pang Lin

IPC分类号： G03B17/00

CPC分类号： H04N5/2254 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/1469 ,  H01L2924/16195 ,  H04N5/2257

摘要： An image sensor module comprises an image sensor chip, at least one lens layer, and at least one bonding layer. The image sensor chip has an image capturing zone manufactured with an image capturing element, and a partition zone surrounding the image capturing zone. The at least one lens layer is stacked on the image sensor chip, having a transparent substrate and a lens mounted on the transparent substrate and adapted to focus the projected image onto the image capturing zone of the image sensor chip. The at least one bonding layer is arranged corresponding to the partition zone of the image sensor chip and bonded between the image sensor chip and the at least one lens layer, mixing of a glue agent and a plurality of spacer elements with which the height of each the spacer elements is determined to be the height of the bonding layer.

摘要翻译： 图像传感器模块包括图像传感器芯片，至少一个透镜层和至少一个结合层。 图像传感器芯片具有由图像捕获元件制造的图像捕获区域和围绕图像捕获区域的分隔区域。 至少一个透镜层堆叠在图像传感器芯片上，具有透明基板和安装在透明基板上的透镜，并且适于将投影图像聚焦到图像传感器芯片的图像捕获区域上。 所述至少一个接合层被布置成对应于图像传感器芯片的分隔区并且结合在图像传感器芯片和至少一个透镜层之间，胶粘剂与多个间隔元件的混合，每个 间隔元件被确定为接合层的高度。

公开(公告)号：US06496466B1

公开(公告)日：2002-12-17

申请号：US09520394

申请日：2000-03-08

申请人： Hsiao-Wen Lee ,  Li-Ding Wei

发明人： Hsiao-Wen Lee ,  Li-Ding Wei

IPC分类号： G11B700

CPC分类号： G11B7/13927 ,  G11B7/0956 ,  G11B7/1362

摘要： A folding mirror structure comprises a folding mirror, a piezoelectric film and electrodes attached to the surfaces of the piezoelectric film. The folding mirror is used for deflecting a laser beam. The piezoelectric film and electrodes are stacked in an interleaving manner and attached to the folding mirror. The surfaces of the electrodes have particular patterns for compensating the coma aberrations due to the tilt of an optical disc.

摘要翻译： 折叠镜结构包括折叠镜，压电膜和附着到压电膜表面的电极。 折叠镜用于偏转激光束。 压电膜和电极以交错方式堆叠并附接到折叠镜。 电极的表面具有用于补偿由于光盘的倾斜引起的彗形像差的特定图案。

公开(公告)号：US06333277B1

公开(公告)日：2001-12-25

申请号：US09725069

申请日：2000-11-29

申请人： Keng-Chu Lin ,  Hsiao-Wen Lee ,  Hou-Hung Chou ,  Yi-Wen Chen

发明人： Keng-Chu Lin ,  Hsiao-Wen Lee ,  Hou-Hung Chou ,  Yi-Wen Chen

IPC分类号： H01L2131

CPC分类号： H01L21/02129 ,  H01L21/02271 ,  H01L21/31625

摘要： A method for reducing non-homogenous density during forming process of borophosphosilicate glass layer, at least includes following basic steps: delivers an oxygen gas through a gas pipeline into a chamber, and also delivers a tetraethyl-orthosilicate gas, a tri-ethyl-borate gas and a tri-ethyl-phosphate gas through a reactant pipeline into a bypass pipeline to let the chamber is filled by only the oxygen gas, wherein the bypass pipeline is adjacent to the chamber; whenever flow of the oxygen gas in both the gas pipeline and the chamber is stable and flow of both the tetraethyl-orthosilicate gas, the tri-ethyl-borate gas and the tri-ethyl-phosphate gas in the reactant pipeline also is stable, closes the reactant pipeline and then delivers the tetraethyl-orthosilicate gas, the tri-ethyl-borate gas and the tri-ethyl-phosphate gas into the chamber; and performs at least a process to form a borophosphosilicate glass layer on a wafer that locates inside the chamber. Obviously, one essential characteristic of the method is reactants are delivered into chamber after flow of reactants are stable, and then non-homogenous density of borophosphosilicate glass layer that induced by unstable flow is effectively prevented.

摘要翻译： 一种在硼磷硅酸盐玻璃层形成过程中降低非均匀密度的方法至少包括以下基本步骤：将氧气通过气体管道输送到室中，并且还输送四乙基原硅酸盐气体，三乙基硼酸盐 气体和三乙基磷酸盐气体通过反应物管线进入旁路管道，以使腔室仅被氧气填充，其中旁路管道与腔室相邻; 只要气体管道和腔室中的氧气流都稳定，反应物管道中的四乙基原硅酸盐，三乙基硼酸盐气体和三乙基磷酸盐气体的流动也是稳定的，关闭 反应物管道，然后将四乙基原硅酸气体，三乙基硼酸盐气体和三乙基磷酸盐气体输送到室中; 并且至少执行在位于室内的晶片上形成硼磷硅酸盐玻璃层的工艺。 显然，该方法的一个基本特征是在反应物流动稳定后将反应物输送到室中，然后有效地防止了由不稳定流动引起的不均匀的硼磷硅酸盐玻璃层密度。