公开(公告)号：US20180183522A1

公开(公告)日：2018-06-28

申请号：US15388564

申请日：2016-12-22

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Emanuel Cohen ,  Sasha N. Oster ,  Telesphor Kamgaing

IPC: H04B10/2525 ,  H04B10/2575 ,  H04L25/03 ,  H04J14/00

CPC classification number: H04L25/03834 ,  H04B10/90 ,  H04L25/03343

Abstract: Embodiments of the present disclosure may relate to a transmitter that includes a baseband dispersion compensator to perform baseband dispersion compensation on an input signal. Embodiments may also include a receiver that includes a radio frequency (RF) dispersion compensator to perform RF dispersion compensation. Embodiments may also include a dielectric waveguide coupled with the transmitter and the receiver, the dielectric waveguide to convey the RF signal from the transmitter to the receiver. Other embodiments may be described and/or claimed.

公开(公告)号：US09960849B1

公开(公告)日：2018-05-01

申请号：US15388383

申请日：2016-12-22

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Emanuel Cohen

IPC: H04B10/00 ,  H04B10/2575 ,  H04J14/00

CPC classification number: H04B10/2575

Abstract: Embodiments of the present disclosure may relate to a transmitter to transmit a radio frequency (RF) signal to a receiver via a dielectric waveguide where the transmitter includes a plurality of mixers to generate modulated RF signals and a combiner to combine the modulated RF signals. Embodiments may also include a receiver to receive, from a dielectric waveguide, a RF signal where the receiver includes a splitter to split the RF signal into a plurality of signal paths, a plurality of filters, and a plurality of demodulators. Embodiments may also include a dielectric waveguide communication apparatus that may include the transmitter and the receiver. Other embodiments may be described and/or claimed.

公开(公告)号：US20180097269A1

公开(公告)日：2018-04-05

申请号：US15282086

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Sasha Oster ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Johanna M. Swan ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/16 ,  G06F1/18

CPC classification number: H01P3/122 ,  G06F1/182 ,  H01P3/14 ,  H01P3/16 ,  H01P11/006

Abstract: An apparatus comprises a plurality of waveguides, wherein the waveguides include a dielectric material; an outer shell; and a supporting feature within the outer shell, wherein the waveguides are arranged separate from each other within the outer shell by the supporting feature.

公开(公告)号：US20250112188A1

公开(公告)日：2025-04-03

申请号：US18478923

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Qiang Yu ,  Adel Elsherbini ,  Tushar Kanti Talukdar ,  Thomas L. Sounart

IPC: H01L23/00 ,  H01L21/683 ,  H01L23/538 ,  H01L25/00 ,  H01L25/18

Abstract: Methods of selectively transferring integrated circuit (IC) components between substrates, and devices and systems formed using the same, are disclosed herein. In one embodiment, a first substrate with a release layer and a layer of IC components over the release layer is received, and a second substrate with one or more adhesive areas is received. The layer of IC components may include one or more antennas, interconnects, inductors, capacitors, or transformers. The first substrate is partially bonded to the second substrate, such that a subset of IC components on the first substrate are bonded to the adhesive areas on the second substrate. The first substrate is then separated from the second substrate, and the subset of IC components bonded to the second substrate are separated from the first substrate and remain on the second substrate.

公开(公告)号：US12183961B2

公开(公告)日：2024-12-31

申请号：US17403571

申请日：2021-08-16

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/16 ,  H01P3/12 ,  H01P11/00 ,  H01Q9/04 ,  H04L67/10

Abstract: A method of forming a waveguide comprises forming an elongate waveguide core including a dielectric material; and arranging a conductive sheet around an outside surface of the dielectric core to produce a conductive layer around the waveguide core.

公开(公告)号：US11437693B2

公开(公告)日：2022-09-06

申请号：US16764600

申请日：2017-12-30

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Kenneth Shoemaker ,  Erich N. Ewy ,  Adel A. Elsherbini ,  Johanna M. Swan

IPC: H01P3/16 ,  H04B3/54

Abstract: Embodiments include a waveguide bundle, a dielectric waveguide, and a vehicle. The waveguide bundle includes dielectric waveguides, where each dielectric waveguide has a dielectric core and a conductive coating around the dielectric core. The waveguide bundle also has a power delivery layer formed around the dielectric waveguides, and an insulating jacket enclosing the waveguide bundle. The waveguide bundle may also include the power deliver layer as a braided shield, where the braided shield provides at least one of a DC and an AC power line. The waveguide bundle may further have one of the dielectric waveguides provide a DC ground over their conductive coatings, where the AC power line does not use the braided shield as reference or ground. The waveguide bundle may include that the power delivery layer is separated from the dielectric waveguides by a braided shield, where the power delivery layer is a power delivery braided foil.

公开(公告)号：US11367708B2

公开(公告)日：2022-06-21

申请号：US16714502

申请日：2019-12-13

Applicant: Intel Corporation

Inventor： Vijay K. Nair ,  Georgios C. Dogiamis ,  Telesphor Kamgaing

IPC: H01L25/065 ,  H01L23/66 ,  H01L25/10 ,  H01L23/538 ,  H01L23/552 ,  H01L23/64 ,  H01L23/00 ,  H01Q1/38

Abstract: Embodiments of the invention include a microelectronic device that includes a transceiver coupled to a first substrate and a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. An interposer substrate can provide a spacing between the first and second substrates.

公开(公告)号：US11335651B2

公开(公告)日：2022-05-17

申请号：US15773033

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Vijay K. Nair ,  Javier A. Falcon ,  Shawna M. Liff ,  Yoshihiro Tomita

IPC: H01L23/66 ,  H01L23/48 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  H01L25/10 ,  H01L25/16

Abstract: Embodiments of the invention include a microelectronic device that includes a first silicon based substrate having compound semiconductor components. The microelectronic device also includes a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US11223524B2

公开(公告)日：2022-01-11

申请号：US16152280

申请日：2018-10-04

Applicant: Intel Corporation

Inventor： Shawna M. Liff ,  Adel A. Elsherbini ,  Sasha N. Oster ,  Feras Eid ,  Georgios C. Dogiamis ,  Thomas L. Sounart ,  Johanna M. Swan

IPC: H01L41/04 ,  H04L12/24 ,  H01H57/00 ,  H01L41/047 ,  H01L41/187 ,  A61B5/0205 ,  A61B5/00 ,  H01L41/09 ,  A61B5/024 ,  A61B5/021 ,  A61B5/08 ,  A61B5/145 ,  H01H37/00

Abstract: Embodiments of the invention include a physiological sensor system. According to an embodiment the sensor system may include a package substrate, a plurality of sensors formed on the substrate, a second electrical component, and an encryption bank formed along a data transmission path between the plurality of sensors and the second electrical component. In an embodiment the encryption bank may include a plurality of portions that each have one or more switches integrated into the package substrate. In an embodiment each sensor transmits data to the second electrical component along different portions of the encryption bank. In some embodiments, the switches may be piezoelectrically actuated. In other embodiments the switches may be actuated by thermal expansion. Additional embodiments may include tri- or bi-stable mechanical switches.

公开(公告)号：US11206008B2

公开(公告)日：2021-12-21

申请号：US16648115

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Feras Eid ,  Vijay K. Nair ,  Johanna M. Swan

IPC: H03H9/05 ,  H03H9/10 ,  H03H9/13 ,  H03H9/52 ,  H03H9/54

Abstract: Embodiments of the invention include an acoustic wave resonator (AWR) module. In an embodiment, the AWR module may include a first AWR substrate and a second AWR substrate affixed to the first AWR substrate. In an embodiment, the first AWR substrate and the second AWR substrate define a hermetically sealed cavity. A first AWR device may be positioned in the cavity and formed on the first AWR substrate, and a second AWR device may be positioned in the cavity and formed on the second AWR substrate. In an embodiment, a center frequency of the first AWR device is different than a center frequency of the second AWR device. In additional embodiment of the invention, the AWR module may be integrated into a hybrid filter. The hybrid filter may include an AWR module and other RF passive devices embedded in a packaging substrate.