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公开(公告)号:US09646925B2
公开(公告)日:2017-05-09
申请号:US14824125
申请日:2015-08-12
Applicant: International Business Machines Corporation
Inventor: Zhaoqing Chen , Matteo Cocchini , Rohan U. Mandrekar , Tingdong Zhou
IPC: H01L23/498 , H01L23/528 , H04B3/32 , H01P3/02 , H01P3/08 , H05K1/02 , H04B1/00
CPC classification number: H01L23/49838 , H01L23/528 , H01L23/66 , H01L2223/6627 , H01P3/02 , H01P3/026 , H01P3/081 , H04B1/00 , H04B3/32 , H05K1/0216 , H05K1/0245
Abstract: An electronic device including a plurality of interconnects are orthogonally arranged in a grid pattern and evenly spaced by a first distance, the plurality of interconnects include: a first conductor pair with conductors arranged next to each other in a first direction, the first direction is oriented diagonally relative to the orthogonal grid pattern, a second conductor pair with conductors arranged next to each other in a second direction substantially perpendicular to the first direction, each conductor of the second conductor pair is spaced by the first distance from each signal conductor of the first conductor pair, and a third conductor pair with conductors arranged next to each other in a third direction substantially parallel to the first direction, each conductors of the third conductor pair is spaced by the first distance from one of the signal elements of the second conductor pair.
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公开(公告)号:US09627787B2
公开(公告)日:2017-04-18
申请号:US15248652
申请日:2016-08-26
Applicant: International Business Machines Corporation
Inventor: Wiren D. Becker , William L. Brodsky , Matteo Cocchini , Michael A. Cracraft
CPC classification number: H01R12/737 , H01R12/526 , H01R12/7076 , H01R43/205 , H05K1/024 , H05K1/0243 , H05K1/112 , H05K1/113 , H05K1/141 , H05K2201/094 , H05K2201/10159
Abstract: A dual in-line memory module (DIMM) connector system is provided. The DIMM connector system includes a motherboard, a DIMM card and a connector by which the DIMM card is coupled with the motherboard. The motherboard includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, ground pads disposed proximate to signal pads, signal vias connected to distal edges of signal pads and shared antipads. The DIMM card includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, signal vias connected to distal edges of signal pads and shared antipads for respective pairs of signal vias.
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公开(公告)号:US20160149611A1
公开(公告)日:2016-05-26
申请号:US14824125
申请日:2015-08-12
Applicant: International Business Machines Corporation
Inventor: Zhaoqing Chen , Matteo Cocchini , Rohan U. Mandrekar , Tingdong Zhou
IPC: H04B3/32
CPC classification number: H01L23/49838 , H01L23/528 , H01L23/66 , H01L2223/6627 , H01P3/02 , H01P3/026 , H01P3/081 , H04B1/00 , H04B3/32 , H05K1/0216 , H05K1/0245
Abstract: An electronic device including a plurality of interconnects are orthogonally arranged in a grid pattern and evenly spaced by a first distance, the plurality of interconnects include: a first conductor pair with conductors arranged next to each other in a first direction, the first direction is oriented diagonally relative to the orthogonal grid pattern, a second conductor pair with conductors arranged next to each other in a second direction substantially perpendicular to the first direction, each conductor of the second conductor pair is spaced by the first distance from each signal conductor of the first conductor pair, and a third conductor pair with conductors arranged next to each other in a third direction substantially parallel to the first direction, each conductors of the third conductor pair is spaced by the first distance from one of the signal elements of the second conductor pair.
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公开(公告)号:US20250093383A1
公开(公告)日:2025-03-20
申请号:US18467894
申请日:2023-09-15
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Kyle Olson , Matteo Cocchini
IPC: G01R1/067
Abstract: A high-speed signal measurement system includes a printed circuit board and a measurement device. The printed circuit board includes a conductive pad. The measurement device is configured to be removably coupled to the printed circuit board. The measurement device is configured to establish an electrical connection between a conductive probe tip and the conductive pad. The measurement device includes a clamp movable between an open position in which the measurement device is configured to removably receive the conductive probe tip and a closed position in which the measurement device is configured to retain the conductive probe tip. The measurement device further includes a spring mechanism configured to exert a spring force to maintain the electrical connection between the conductive probe tip and the conductive pad when the measurement device is coupled to the printed circuit board and the clamp is in the closed position.
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公开(公告)号:US12207392B2
公开(公告)日:2025-01-21
申请号:US17933693
申请日:2022-09-20
Applicant: International Business Machines Corporation
Inventor: Matthew Doyle , David Clifford Long , Matteo Cocchini , Russell A. Budd , James Busby , Roger S. Krabbenhoft , Arthur J. Higby
Abstract: An electronic component includes a first trace configured to transmit a first signal and a second trace configured to transmit a second signal. The electronic component further includes a layer of conductive material separated from the first and second traces by a layer of insulative material. The electronic component further includes a first vertical wall formed in direct contact with the layer of conductive material. The electronic component further includes a second vertical wall formed in direct contact with the layer of conductive material. The second vertical wall is separated from the first vertical wall by a void, and the void extends between the first trace and the second trace.
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公开(公告)号:US12148276B2
公开(公告)日:2024-11-19
申请号:US17840662
申请日:2022-06-15
Applicant: International Business Machines Corporation
Inventor: Matthew Doyle , Jeffrey N. Judd , Timothy J. Tofil , Matteo Cocchini , Stuart Brett Benefield , Samuel R. Connor , Andrew Corbett
IPC: G08B13/16 , G06F18/2113
Abstract: According to one embodiment of the present invention, a computer-implemented method for autocorrelation based security monitoring and detection is disclosed. The computer-implemented method includes determining that input signal data transmitted to a white noise generator autocorrelates with itself at one or more time lags. The computer-implemented method further includes, responsive to determining that the input signal data transmitted to the white noise generator autocorrelates with itself at one or more time lags, determining whether an autocorrelation in the input signal data transmitted to the white noise generator matches one or more predetermined input signal data patterns associated with a known event or individual.
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公开(公告)号:US20230410617A1
公开(公告)日:2023-12-21
申请号:US17840662
申请日:2022-06-15
Applicant: International Business Machines Corporation
Inventor: Matthew Doyle , Jeffrey N. Judd , Timothy J. Tofil , Matteo Cocchini , Stuart Brett Benefield , Samuel R. Connor , Andrew Corbett
CPC classification number: G08B13/1672 , G06K9/623
Abstract: According to one embodiment of the present invention, a computer-implemented method for autocorrelation based security monitoring and detection is disclosed. The computer-implemented method includes determining that input signal data transmitted to a white noise generator autocorrelates with itself at one or more time lags. The computer-implemented method further includes, responsive to determining that the input signal data transmitted to the white noise generator autocorrelates with itself at one or more time lags, determining whether an autocorrelation in the input signal data transmitted to the white noise generator matches one or more predetermined input signal data patterns associated with a known event or individual.
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公开(公告)号:US20210159622A1
公开(公告)日:2021-05-27
申请号:US16692426
申请日:2019-11-22
Applicant: International Business Machines Corporation
Inventor: Matteo Cocchini , Michael Cracraft , Zachary Thomas Dreiss
Abstract: A multi-layer circuit board includes a first layer including a first trace, a second layer connected to the first layer and including a second trace, and a stubless interconnect positioned through the first layer and the second layer. The stubless interconnect includes a body that is electrically insulative, and a bridge trace that is electrically conductive and connected to the body, the bridge trace extending from the first trace to the second trace to electrically connect the first trace and the second trace.
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公开(公告)号:US10928426B2
公开(公告)日:2021-02-23
申请号:US16195040
申请日:2018-11-19
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Matteo Cocchini , Michael A. Cracraft
IPC: G01R19/165 , G01R19/00 , G01R1/20
Abstract: An apparatus and method for detecting transient voltage at an electrical component of a circuit board is provided. The apparatus including a circuit including a comparator and a latch, wherein a first input of the comparator is electrically coupled to the electrical component, and the comparator receives a threshold voltage at a second input, where the comparator outputs either a high signal or a low signal in response to both the first input and the second input, and an output of the comparator is electrically coupled to an input of the latch such that the latch outputs a high signal in response to receiving a high signal from the comparator, and an indicator electrically coupled to an output of the latch, and where the apparatus is mounted non-permanently to the circuit board to provide a non-permanent electrical coupling between the comparator and the electrical component.
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公开(公告)号:US10663486B2
公开(公告)日:2020-05-26
申请号:US15425042
申请日:2017-02-06
Applicant: International Business Machines Corporation
Inventor: Matteo Cocchini , Michael A. Cracraft , Khaalid P. J. McMillan , John G. Torok
Abstract: An apparatus includes a carrier base and one or more contact elements coupled to a portion of the carrier base. The one or more contact elements are configured to sense an electrical signal flowing through at least one electrical component in a circuitry under test. The first contact element of the one or more contact elements comprises a power sense conductor extending from a bottom surface of the first contact element toward a top surface of the first contact element and a ground conductor electrically isolated from the power sense conductor.
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