摘要:
Initialization of a semiconductor device can be efficiently performed, which transmits and receives data through wireless communication. The semiconductor device includes an antenna, a power source circuit, a circuit which uses a DC voltage generated by the power source circuit as a power source voltage, and a resistor. The antenna includes a pair of terminals and receives a wireless signal (a modulated carrier wave). The power source circuit includes a first terminal and a second terminal and generates a DC voltage between the first terminal and the second terminal by using a received wireless signal (the modulated carrier wave). The resistor is connected between the first terminal and the second terminal. In this manner, the semiconductor device and the wireless communication system can transmit and receive data accurately.
摘要:
To reduce current consumption in a frequency-division circuit, particularly in a multistage frequency-division circuit, in a multistage frequency-division circuit, an inputted signal has a higher frequency in a preceding stage, and an inputted signal has a lower frequency in a following stage. Thus, placement is performed preferentially from the basic cell corresponding to the frequency-division circuit into which a signal having a higher frequency is inputted, and then wiring connection is performed. In other words, the layout of a plurality of basic cells corresponding to a multistage frequency-division circuit is performed so that, as compared to a wiring into which a signal having a lower frequency is inputted, a wiring into which a signal having a higher frequency is inputted has a shorter wiring length and has less intersection with other wirings, so that parasitic capacitance and parasitic resistance of the wiring are reduced.
摘要:
A semiconductor device includes a memory portion, a logic portion, and a plurality of signal lines for electrically connecting the memory portion and the logic portion. In the case where a transfer rate between the semiconductor device and a communication device is α [bps], a first clock frequency generated in the logic portion is Kα [Hz] (K is an integer of 1 or more), the number of reading signal lines of the plurality of signal lines is n (n is an integer of 2 or more), and a second clock frequency generated in the logic portion is Lα/n [Hz] (L is any integer satisfying L/n
摘要翻译:半导体器件包括用于电连接存储器部分和逻辑部分的存储器部分,逻辑部分和多条信号线。 在半导体器件和通信器件之间的传输速率为α[bps]的情况下,在逻辑部分中产生的第一时钟频率为Kα[Hz](K为1以上的整数),读取次数 多条信号线的信号线为n(n为2以上的整数),在逻辑部分生成的第二时钟频率为Lα/ n [Hz](L为满足L / n
摘要:
A demodulation signal is generated by provision of a demodulation signal generation circuit to the semiconductor device capable of wireless communication and by obtainment of a difference between voltages having opposite polarities by the demodulation signal generation circuit. Alternatively, a plurality of demodulation signal generation circuits and a selective circuit which selects a demodulation signal generation circuit depending on characteristics of a received signal are provided, where operation of a second demodulation signal generation circuit stops when a first demodulation signal generation circuit is operated. The selective circuit includes an inverter circuit, a flip-flop circuit, and a selector circuit. When the second demodulation signal generation circuit has a comparator and the like, power consumption thereof is reduced.
摘要:
In manufacturing a semiconductor device, static electricity is generated while contact holes are formed in an interlayer insulating film by dry etching. Damage to a pixel region or a driving circuit region due to travel of the static electricity generated is prevented. Gate signal lines are spaced apart from each other above a crystalline semiconductor film. Therefore a first protective circuit is not electrically connected when contact holes are opened in an interlayer insulating film. The static electricity generated during dry etching for opening the contact holes moves from the gate signal line, damages a gate insulating film, passes the crystalline semiconductor film, and again damages the gate insulating film before it reaches the gate signal line. As the static electricity generated during the dry etching damages the first protective circuit, the energy of the static electricity is reduced until it loses the capacity of damaging a driving circuit TFT. The driving circuit TFT is thus prevented from suffering electrostatic discharge damage.
摘要:
An object of the present invention is to provide a CRC circuit with more simple structure and low power consumption. The CRC circuit includes a first shift register to a p-th shift register, a first EXOR to a (p−1)th EXOR, and a switching circuit. A data signal, a select signal, and an output of a last stage of the p-th shift register are inputted to the switching circuit, and the switching circuit switches a first signal or a second signal in response to the select signal to be outputted.
摘要:
According to the invention, a plurality of semiconductor devices which are required to have conformance are formed from crystalline semiconductor films having uniform crystallinity on the same line, and a semiconductor circuit in which variation between semiconductor devices is small can be provided, and a semiconductor integrated circuit having high conformance can be provided. The invention is characterized in that, in a part or whole of thin film transistors which configure an analog circuit such as a current mirror circuit, a differential amplifier circuit, or an operational amplifier, in which high conformance is required for semiconductor devices included therein, channel forming regions have crystalline semiconductor films on the same line. High conformance can be expected for an analog circuit which has the crystalline semiconductor films on the same line formed using the invention as the channel forming regions of the thin film transistors. That is, the invention is characterized in that, among the thin film transistors which configures the analog circuit, the channel forming regions of the thin film transistors having at least the same polarity are formed on the same line.
摘要:
Among transistors used in an analog circuit portion of the semiconductor device, particularly in a high frequency circuit, a power supply circuit, and a data demodulation circuit, and transistors used in a digital circuit portion (logic circuit portion), a gate length of a transistor in the analog circuit portion is not less than a gate length of a transistor in the digital circuit portion. As a result, when an excess voltage is supplied, voltage in the analog circuit with a long gate length is suppressed to prevent the damage of elements such as transistors in the digital circuit portion to which a signal is inputted from the analog circuit.
摘要:
The present invention has an object to provide a semiconductor device, an ID tag, in which delay of signal transmission with conductive layers is controlled. In addition, the other object is that a design method of such a semiconductor device is provided.A semiconductor device of the invention comprises a plurality of conductive layers, a plurality of first element groups each of which selects one among the conductive layers and a plurality of second element groups each of which amplifies a signal each transmitted from the conductive layers. Each of the second element groups is disposed between the first element groups. Stated another way, the first element group and the second element group are disposed alternately. The delay of the signal transmission with the plurality of conductive layers is controlled because a load by a parasitic capacitance is reduced due to the above feature.
摘要:
In a semiconductor device including a digital circuit portion and an analog circuit portion having a capacitor portion provided over a substrate, the capacitor portion is provided with a first wiring, a second wiring and a plurality of blocks each having a plurality of capacitor elements. Further, each the plurality of capacitor elements provided in each block has a semiconductor film having a first impurity region and a plurality of second impurity regions provided apart with the first impurity region interposed therebetween, and a conductive film provided over the first impurity region with an insulating film therebetween. A capacitor is formed from the first impurity region, the insulating film, and the conductive film.