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公开(公告)号：US07992738B2
公开(公告)日：2011-08-09
申请号：US11422818
申请日：2006-06-07
申请人： Xiang Gao , Jianping Li
发明人： Xiang Gao , Jianping Li
CPC分类号： B65D19/02 , B65D2519/00024 , B65D2519/00059 , B65D2519/00164 , B65D2519/00233 , B65D2519/00701 , B65D2519/0096 , B65D2519/0097
摘要： A pallet container is used to transfer loose cargoes including frame members. The frame member has a rail connected to two posts. Each post is mounted with a nesting. The pallet container has a base frame which is formed by beams; a pair of first side frames and a pair of second side frames respectively formed by the base frame and post members of the invention. Each post member comprising a first post, provided at a corner of the base frame; a second post, spaced from the first post and mounted to the base frame by a reinforced plate, in which a cavity is provided. The pallet container equipped with the post member can be stable to load the frame member by inserting the second post of the present invention into the post of the loaded frame member.
摘要翻译： 托盘容器用于运输包括框架构件在内的松散货物。 框架构件具有连接到两个柱的导轨。 每个帖子都装有一个嵌套。 托盘容器具有由梁形成的基架; 分别由本发明的基架和柱构件形成的一对第一侧框架和一对第二侧框架。 每个柱构件包括设置在基架的角部的第一柱; 第二柱，与第一柱间隔开，并通过加强板安装到基架上，其中设置有空腔。 配备有柱构件的托盘容器可以通过将本发明的第二柱插入装载的框架构件的柱中来稳定地装载框架构件。
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62.发明授权Wafer level package for very small footprint and low profile white LED devices 有权晶圆级封装，占地面积小，白色LED器件低公开(公告)号：US07718449B2
公开(公告)日：2010-05-18
申请号：US11588551
申请日：2006-10-27
申请人： Xiang Gao , Michael Sackrison
发明人： Xiang Gao , Michael Sackrison
IPC分类号： H01L21/00
CPC分类号： H01L33/0079 , H01L25/0753 , H01L33/505 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： A surface mount LED package having a tight footprint and small vertical image size is fabricated by a method comprising: forming light emitting diode chips each having a substrate and a plurality of layers configured to emit electroluminescence responsive to electrical energizing; forming electrical vias in a sub mount, the electrical vias passing from a front side of the sub-mount to a back-side of the sub-mount; flip chip bonding the light emitting diode chips on the front-side of the sub mount such that each light emitting diode chip electrically contacts selected electrical vias; thinning or removing the substrates of the flip-chip bonded light emitting diode chips; and after the thinning, disposing a phosphor over the flip chip bonded light emitting diode chips.
摘要翻译： 通过以下方法制造具有紧密占地面积和小垂直图像尺寸的表面贴装LED封装，其包括：形成各自具有基板的发光二极管芯片和被配置为响应于电激励发射电致发光的多个层; 在副安装座中形成电气通孔，所述电气通孔从所述副安装座的前侧穿过所述副安装座的后侧; 将发光二极管芯片的倒装芯片接合在子安装座的前侧，使得每个发光二极管芯片电接触所选择的电气通孔; 减薄或去除倒装芯片接合的发光二极管芯片的基板; 并且在变薄之后，在倒装芯片粘结的发光二极管芯片上设置荧光体。
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公开(公告)号：US07667236B2
公开(公告)日：2010-02-23
申请号：US10588473
申请日：2004-12-22
IPC分类号： H01L27/15
CPC分类号： H01L33/382 , H01L33/20 , H01L33/62 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01079 , H01L2924/12041 , H01L2224/05599
摘要： A light emitting device (A) includes a semiconductor die (100). The semiconductor die includes: an epitaxial structure (120) arranged on a substrate (160), the epitaxial structure forming an active light generating region (140) between a first layer (120n) on a first side of the active region and having a first conductivity type, and a second layer (120p) on a second side of the active region and having a second conductivity type, the second side of the active region being opposite the first side of the active region and the second conductivity type being different that the first conductivity type; a first contact (180n) in operative electrical communication with the active region via the first layer in the epitaxial structure, the first contact being arranged on a side of the epitaxial structure opposite the substrate; a second contact (180p) in operative electrical communication with the active region via the second layer in the epitaxial structure, the second contact being arranged on a side of the epitaxial structure opposite the substrate; a first contact trace corresponding to the first contact and defined at a surface thereof distal from the substrate, the first trace including at least one area designated for bonding (320n); and, a second contact trace corresponding the second contact and defined at a surface thereof distal from the substrate, the second trace including at least one area (320p) designated for bonding. Suitably, the first contact trace is substantially enclosed within the second contact trace.
摘要翻译： 发光器件（A）包括半导体管芯（100）。 所述半导体管芯包括：布置在衬底（160）上的外延结构（120），所述外延结构在所述有源区的第一侧上的第一层（120n）之间形成有源光产生区（140），并且具有第一 导电类型和在有源区的第二侧上的第二层（120p），并具有第二导电类型，有源区的第二面与有源区的第一侧相反，第二导电类型不同于 第一导电类型; 通过外延结构中的第一层与有源区域电连通的第一接触（180n），第一接触件布置在与衬底相对的外延结构的一侧上; 通过外延结构中的第二层与有源区域电连通的第二触点（180p），第二触点布置在与衬底相对的外延结构的一侧上; 第一接触迹线对应于第一接触并限定在其远离基底的表面，第一迹线包括指定用于接合的至少一个区域（320n）; 以及对应于所述第二接触并限定在其远离所述衬底的表面的第二接触迹线，所述第二迹线包括指定用于接合的至少一个区域（320p）。 适当地，第一接触迹线基本上封闭在第二接触迹线内。
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公开(公告)号：US20090226100A1
公开(公告)日：2009-09-10
申请号：US11744925
申请日：2007-05-07
申请人： Xiang Gao , Visvanathan Ramesh , Terrance E. Boult
发明人： Xiang Gao , Visvanathan Ramesh , Terrance E. Boult
IPC分类号： G06K9/62
CPC分类号： G06K9/325 , G06K9/6217
摘要： The present invention provides a technique for automated selection of a parameterized operator sequence to achieve a pattern classification task. A collection of labeled data patterns is input and statistical descriptions of the inputted labeled data patterns are then derived. Classifier performance for each of a plurality of candidate operator/parameter sequences is determined. The optimal classifier performance among the candidate classifier performances is then identified. Performance metric information, including, for example, the selected operator sequence/parameter combination, will be outputted. The operator sequences selected can be chosen from a default set of operators, or may be a user-defined set. The operator sequences may include any morphological operators, such as, erosion, dilation, closing, opening, close-open, and open-close.
摘要翻译： 本发明提供一种用于自动选择参数化运算符序列以实现模式分类任务的技术。 输入标记数据模式的集合，然后导出输入的标记数据模式的统计描述。 确定多个候选操作员/参数序列中的每一个的分类器性能。 然后识别候选分类器性能中的最优分类器性能。 将输出包括例如所选择的操作员序列/参数组合的性能度量信息。 选择的操作员序列可以从默认操作符集中选择，或者可以是用户定义的集合。 运算符序列可以包括任何形态学运算符，例如侵蚀，扩张，关闭，打开，闭合和开 - 关。
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公开(公告)号：US07285801B2
公开(公告)日：2007-10-23
申请号：US10817603
申请日：2004-04-02
IPC分类号： H01L33/00
CPC分类号： H01L27/153 , H01L33/20 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A light emitting semiconductor device die (10, 110, 210, 310) includes an electrically insulating substrate (12, 112). First and second spatially separated electrodes (60, 62, 260, 262, 360, 362) are disposed on the electrically insulating substrate. The first and second electrodes define an electrical current flow direction directed from the first electrode to the second electrode. A plurality of light emitting diode mesas (30, 130, 130′, 230, 330) are disposed on the substrate between the first and second spatially separated electrodes. Electrical series interconnections (50, 150, 250, 350) are disposed on the substrate between neighboring light emitting diode mesas. Each series interconnection carries electrical current flow between the neighboring mesas in the electrical current flow direction.
摘要翻译： 发光半导体器件管芯（10,110,210,310）包括电绝缘衬底（12,112）。 第一和第二空间分离的电极（60,62,260,262,360,362）设置在电绝缘基板上。 第一和第二电极限定从第一电极指向第二电极的电流流动方向。 多个发光二极管台面（30,130,130'，230,330）设置在第一和第二空间分离的电极之间的衬底上。 在相邻的发光二极管台面之间的基板上设置电气串联互连（50,150,250,350）。 每个串联互连在电流流动方向上在相邻台面之间承载电流。
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公开(公告)号：US20070004088A1
公开(公告)日：2007-01-04
申请号：US11482363
申请日：2006-07-07
申请人： Michael Sackrison , Xiang Gao , Bryan Shelton , Ivan Eliashevich
发明人： Michael Sackrison , Xiang Gao , Bryan Shelton , Ivan Eliashevich
IPC分类号： H01L21/00
CPC分类号： H01L33/0095 , H01L21/78 , H01L2924/0002 , H01L2924/00
摘要： In a light emitting package fabrication process, a plurality of light emitting chips (10) are attached on a sub-mount wafer (14). The attached light emitting chips (10) are encapsulated. Fracture-initiating trenches (30, 32) are laser cut into the sub-mount wafer (14) between the attached light emitting chips (10) using a laser. The sub-mount wafer (14) is fractured along the fracture initiating trenches (30, 32).
摘要翻译： 在发光封装制造工艺中，多个发光芯片（10）安装在子安装晶片（14）上。 附着的发光芯片（10）被封装。 使用激光将断裂引发沟槽（30,32）激光切割到附接的发光芯片（10）之间的子安装晶片（14）中。 子安装晶片（14）沿断裂引发沟槽（30,32）断裂。
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公开(公告)号：US20060030125A1
公开(公告)日：2006-02-09
申请号：US10911052
申请日：2004-08-04
申请人： Michael Sackrison , Xiang Gao , Bryan Shelton , Ivan Eliashevich
发明人： Michael Sackrison , Xiang Gao , Bryan Shelton , Ivan Eliashevich
IPC分类号： H01L21/78
CPC分类号： H01L33/0095 , H01L21/78 , H01L2924/0002 , H01L2924/00
摘要： In a light emitting package fabrication process, a plurality of light emitting chips (10) are attached on a sub-mount wafer (14). The attached light emitting chips (10) are encapsulated. Fracture-initiating trenches (30, 32) are laser cut into the sub-mount wafer (14) between the attached light emitting chips (10) using a laser. The sub-mount wafer (14) is fractured along the fracture initiating trenches (30, 32).
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公开(公告)号：US20050259847A1
公开(公告)日：2005-11-24
申请号：US11046717
申请日：2005-01-31
申请人： Yakup Genc , Yanghai Tsin , Cuneyt Akinlar , Anurag Mittal , Xiang Gao
发明人： Yakup Genc , Yanghai Tsin , Cuneyt Akinlar , Anurag Mittal , Xiang Gao
CPC分类号： G06T7/251 , G06T7/12 , G06T7/194 , G06T7/579 , G06T2207/10016 , G06T2207/20036 , G06T2207/30164
摘要： A system and method for tracking parcels on a planar surface is provided. The method comprising: acquiring an image of the parcel located on the planar surface; determining edges of the parcel; projecting the edges onto the planar surface; determining which edges belong to each side of the parcel; calculating a cost function associated with the edges belonging to each side of the parcel; searching the edges belonging to each side of the parcel to find edges having a lowest cost; and constructing a matching configuration of the parcel using the edges having the lowest cost.
摘要翻译： 提供了一种用于在平面上跟踪包裹的系统和方法。 该方法包括：获取位于平面上的包裹的图像; 确定包裹的边缘; 将边缘投影到平面上; 确定哪些边缘属于包裹的每一侧; 计算与属于包裹每一侧的边缘相关联的成本函数; 搜索属于包裹每一边的边缘来查找成本最低的边缘; 以及使用具有最低成本的边缘构建包裹的匹配配置。
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公开(公告)号：US11805953B2
公开(公告)日：2023-11-07
申请号：US17206627
申请日：2021-03-19
申请人： Xiang Gao
IPC分类号： A47L11/283 , A47L9/00 , A47L9/14 , A47L9/28 , A47L11/40
CPC分类号： A47L11/283 , A47L9/009 , A47L9/1409 , A47L9/2873 , A47L9/2894 , A47L11/4005 , A47L11/4027 , A47L11/4038 , A47L11/4061 , A47L11/4066 , A47L11/4083 , A47L11/4088 , A47L11/4091 , A47L2201/022 , A47L2201/04
摘要： A floor mopping machine includes a casing and a motor. A partition plate is arranged at a middle of the casing, and a battery is arranged at a side of the partition plate. A first support roller is provided at an end of the battery away from the motor, and a second support roller is provided at an end of the first support roller away from the battery. A set of second pressure rollers are arranged between the first support roller and the second support roller, and a set of third pressure rollers are arranged between the first support roller and a driving roller.
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公开(公告)号：US09093954B2
公开(公告)日：2015-07-28
申请号：US13964119
申请日：2013-08-12
申请人： Wanfu Ye , Xiang Gao , Dongpeng Hou
发明人： Wanfu Ye , Xiang Gao , Dongpeng Hou
摘要： A BASK demodulator includes a signal modifying circuit and a low pass filter (LPF) that couples an amplifier to an output of the modifying circuit. The modifying circuit includes a signal scaling circuit, a rectifying circuit and an AC coupling circuit. A signal shaping circuit couples an output of the amplifier to an output of the demodulator. The signal scaling circuit scales an input BASK modulated signal to provide an unclipped scaled and biased alternating signal that alternates about a bias voltage at a minimum carrier frequency. The rectifying circuit rectifies the unclipped signal to provide a partially rectified signal that is decoupled by the AC coupling circuit to provide a clipped scaled and biased alternating signal. The LPF removes the signal from the clipped scaled and biased alternating signal to provide a demodulated signal, which then is amplified by the amplifier and shaped by the shaping circuit.
摘要翻译： BASK解调器包括将放大器耦合到修改电路的输出的信号修正电路和低通滤波器（LPF）。 修正电路包括信号缩放电路，整流电路和AC耦合电路。 信号整形电路将放大器的输出耦合到解调器的输出。 信号缩放电路对输入的BASK调制信号进行缩放以提供在最小载波频率上绕偏置电压交替的未切割的定标和偏置交替信号。 整流电路对未剪切信号进行整流，以提供由AC耦合电路解耦的部分整流信号，以提供限幅和偏置的交替信号。 LPF从被裁剪和偏置的交替信号中去除信号以提供解调信号，然后被放大器放大并由整形电路成形。
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