公开(公告)号：US20110027971A1

公开(公告)日：2011-02-03

申请号：US12906534

申请日：2010-10-18

申请人： Fumitsugu FUKUYO ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

发明人： Fumitsugu FUKUYO ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

IPC分类号： H01L21/268 ,  B23K26/00

CPC分类号： H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

摘要翻译： 一种激光束加工方法和激光束加工装置，其能够切割工件而不产生在工件表面上的预定切割线的定影和裂纹，其中脉冲激光束照射在工件的预定切割线上 在导致多光子吸收的条件下并且具有与工件内部对准的凝聚点的工作表面，并且沿着预定的切割线沿着预定的切割线沿着预定的切割线移动凝聚点而在工件内部形成改质区域 由此，可以用相当小的力通过从修改区域开始沿着预定切割线的工作而切割工件，并且因为辐射的脉冲激光束几乎不被吸收到工件的表面上，所以表面不熔合 即使形成了修改区域。

公开(公告)号：US07825350B2

公开(公告)日：2010-11-02

申请号：US11101543

申请日：2005-04-08

申请人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

发明人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

IPC分类号： B23K26/00

CPC分类号： H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

公开(公告)号：US07777772B2

公开(公告)日：2010-08-17

申请号：US10582332

申请日：2004-12-06

申请人： Norio Kurita ,  Naoki Uchiyama

发明人： Norio Kurita ,  Naoki Uchiyama

IPC分类号： B41J2/44 ,  B23K26/02

CPC分类号： B23K26/043 ,  B23K26/04 ,  B23K26/042 ,  B23K26/703

摘要： In the laser processing apparatus 1, a laser head 13 is held and cooled by a cooling jacket 11, and thus can be operated stably. Also, even if the emitting direction of laser light L fluctuates when replacing the laser head 13 because of its damage or the like, a regulator 15 can adjusts the position and inclination of the cooling jacket 11 with respect to an optical system main part 4, so that the emitting direction of the laser light L can coincide with the optical axis of the optical system main part 4. Thus, the laser processing apparatus 1 can easily correct the fluctuation in the laser light emitting direction among the laser heads 13.

摘要翻译： 在激光加工装置1中，激光头13由冷却套11保持并冷却，能够稳定地工作。 此外，即使由于激光头损坏等而更换激光头13时激光的发射方向波动，调节器15也可以调整冷却套11相对于光学系统主体部4的位置和倾斜度， 使得激光L的发射方向与光学系统主体部分4的光轴重合。因此，激光加工装置1可以容易地校正激光头13之间的激光发射方向的波动。

公开(公告)号：US20100136766A1

公开(公告)日：2010-06-03

申请号：US12601090

申请日：2008-05-23

申请人： Takeshi Sakamoto ,  Hideki Shimoi ,  Naoki Uchiyama

发明人： Takeshi Sakamoto ,  Hideki Shimoi ,  Naoki Uchiyama

IPC分类号： H01L21/78

CPC分类号： B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  H01L21/67132 ,  H01L21/78

摘要： An object to be processed is reliably cut along a line to cut. An object to be processed is irradiated with laser light while locating a converging point at the object, so as to form a modified region in the object along a line to cut. The object formed with the modified region is subjected to an etching process utilizing an etching liquid exhibiting a higher etching rate for the modified region than for an unmodified region, so as to etch the modified region. This can etch the object selectively and rapidly along the line to cut by utilizing a higher etching rate in the modified region.

摘要翻译： 待切割的物体沿切割线可靠切割。 在将会聚点定位在物体的同时用激光照射待处理物体，以沿着切割线在物体中形成改质区域。 用改性区域形成的物体经受蚀刻处理，利用对修饰区域表现出比对于未改性区域更高的蚀刻速率的蚀刻液体，以蚀刻修饰区域。 这可以通过在改质区域中利用较高的蚀刻速率沿切割线选择性地和快速地蚀刻物体。

公开(公告)号：US20100054999A1

公开(公告)日：2010-03-04

申请号：US12515950

申请日：2007-07-10

申请人： Naoki Uchiyama ,  Naoki Matsuda ,  Kazuki Yoshimura ,  Kenji Kato

发明人： Naoki Uchiyama ,  Naoki Matsuda ,  Kazuki Yoshimura ,  Kenji Kato

IPC分类号： G01N21/77 ,  G01N21/78

CPC分类号： G01N21/7703 ,  G01N21/783 ,  G01N2021/7773 ,  Y10T436/22

摘要： A hydrogen sensor includes a thin film layer formed on a top surface of a planar optical transmission medium, and a catalyst layer formed on a top surface of the thin film layer. A first interface is created between the planar optical transmission medium and the thin film layer. A substrate is joined to a bottom surface of the planar optical transmission medium so that a second interface is created between the planar optical transmission medium and the substrate. On entering a first end portion of the planer optical transmission medium, light from a light source is spread by an entrance section, and the spread light is transmitted inside the planar optical transmission medium to a second end portion by being reflected by the first and second interfaces alternately. Light exiting from the second end portion is transmitted to an optical sensor by an exit light-collecting section. If the thin film layer is hydrogenated by the catalyst layer contacted by hydrogen, the amount of light reflected from the first interface reduces. Hydrogen gas is detected by the optical sensor detecting such reduction in the amount of light.

摘要翻译： 氢传感器包括形成在平面光传输介质的顶表面上的薄膜层和形成在薄膜层的顶表面上的催化剂层。 在平面光传输介质和薄膜层之间产生第一界面。 基板被接合到平面光传输介质的底表面，使得在平面光传输介质和基板之间产生第二界面。 在进入平面光传输介质的第一端部分时，来自光源的光由入射部分扩展，并且扩散光在平面光传输介质内传播到第二端部，被第一和第二反射 接口交替。 从第二端部出射的光通过出射光收集部传送到光学传感器。 如果薄膜层被氢接触的催化剂层氢化，则从第一界面反射的光量减少。 通过光学传感器检测到氢气被检测到光量的减少。

公开(公告)号：US20090236324A1

公开(公告)日：2009-09-24

申请号：US12282698

申请日：2007-03-06

申请人： Fumitsugu Fukuyo ,  Etsuji Ohmura ,  Kenshi Fukumitsu ,  Masayoshi Kumagai ,  Kazuhiro Atsumi ,  Naoki Uchiyama

发明人： Fumitsugu Fukuyo ,  Etsuji Ohmura ,  Kenshi Fukumitsu ,  Masayoshi Kumagai ,  Kazuhiro Atsumi ,  Naoki Uchiyama

IPC分类号： B23K26/38

CPC分类号： B23K26/53 ,  B23K26/0622 ,  B23K26/0853 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  C03B33/0222 ,  C03B33/037 ,  H01L21/78

摘要： An object to be processed 1 is irradiated with laser light L with a standard pulse waveform, so as to form a molten processed region 131, which has a larger size in the thickness direction of the object 1 and is easy to generate a fracture 24 in the thickness direction of the object 1, within a silicon wafer 111, and with laser light L with a retarded pulse waveform, so as to form a molten processed region 132, which has a smaller size in the thickness direction of the object 1 and is hard to generate the fracture 24 in the thickness direction of the object 1, within a silicon wafer 112.

摘要翻译： 用标准脉冲波形的激光L对被处理物体1进行照射，形成在物体1的厚度方向上具有较大尺寸的熔融处理区域131，容易产生骨折24 物体1的厚度方向，硅晶片111内，以及具有延迟脉冲波形的激光L，形成在物体1的厚度方向上具有较小尺寸的熔融处理区域132，并且为 在硅晶片112内难以在物体1的厚度方向上产生裂缝24。

公开(公告)号：US07592238B2

公开(公告)日：2009-09-22

申请号：US11106648

申请日：2005-04-15

申请人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

发明人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

IPC分类号： H01L21/78 ,  H01L21/82

CPC分类号： H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

公开(公告)号：US20090135425A1

公开(公告)日：2009-05-28

申请号：US12293267

申请日：2007-02-15

申请人： Naoki Uchiyama

发明人： Naoki Uchiyama

IPC分类号： G01N21/77

CPC分类号： G01N21/77 ,  G01M3/20 ,  G01M3/38 ,  G01N21/55 ,  G01N21/59

摘要： In a hydrogen gas detection device, light emitted from a light source is irradiated onto a hydrogen sensor whose reflectance (optical reflectance) varies upon contact with hydrogen gas, and the light transmitted through the hydrogen sensor or reflected by a reflective film of the hydrogen sensor is received by an optical sensor. On the basis of the signal output from the optical sensor and indicative of the amount of light received, the hydrogen gas detection device detects leakage of hydrogen gas.

摘要翻译： 在氢气检测装置中，将从光源射出的光照射到与氢气接触时反射率（光反射率）变化的氢传感器，透过氢传感器的光或氢传感器的反射膜反射的光 被光学传感器接收。 基于从光学传感器输出的信号并指示接收的光量，氢气检测装置检测氢气的泄漏。

公开(公告)号：US20070125757A1

公开(公告)日：2007-06-07

申请号：US10548412

申请日：2003-03-12

申请人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

发明人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

IPC分类号： B23K26/38

CPC分类号： C03B33/091 ,  B23K26/0604 ,  B23K26/0624 ,  B23K26/40 ,  B23K26/53 ,  B23K26/60 ,  B23K2101/40 ,  B23K2103/50 ,  B28D1/221 ,  B28D5/0011 ,  C03B33/023 ,  Y02P40/57

摘要： A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region 7 formed by multiphoton absorption forms a cutting start region 8 within an object to be processed 1 along a line to cut 5. Thereafter, the object 1 is irradiated with laser light L2 absorbable by the object 1 along the line to cut 5, so as to generate fractures 24 from the cutting start region 8 acting as a start point, whereby the object 1 can accurately be cut along the line to cut 5. Expanding an expandable film 19 having the object 1 secured thereto separates individual chips 25 from each other, which can further improve the reliability in cutting the object 1 along the line to cut 5.

摘要翻译： 提供了一种能够沿着切割线精密切割待处理物体的激光加工方法。 通过多光子吸收形成的改质区域7沿着切割线5在待处理物体1内形成切割开始区域8。 此后，对象物1照射由物体1沿着切割线5吸收的激光L 2，从作为起点的切割起始区域8产生裂缝24，由此能够精确地切割物体1 沿线切割5。 扩大其固定物体1的可膨胀膜19将各个芯片25彼此分开，这可以进一步提高沿着切割线5切割物体1的可靠性。

公开(公告)号：US20070084726A1

公开(公告)日：2007-04-19

申请号：US11581553

申请日：2006-10-16

申请人： Naoki Uchiyama ,  Hiroyuki Matsumoto

发明人： Naoki Uchiyama ,  Hiroyuki Matsumoto

IPC分类号： G01N27/26

CPC分类号： G01N21/77 ,  G01N2021/7773 ,  Y10T436/175383 ,  Y10T436/22

摘要： A hydrogen gas visualization device comprises a hydrogen sensor having a thin film layer formed on the surface of a substrate and a catalyst layer formed on the surface of the thin film layer which, when contacted by hydrogen gas contained in an atmosphere, hydrogenates the thin film layer and thereby changes the optical reflectance of the thin film layer, and one or more sensor faces provided with the hydrogen sensor. The hydrogen gas visualization device visualizes, on the sensor faces, the distribution of hydrogen gas contained in the atmosphere contacting the hydrogen sensor and thereby visualizes the existence and flow of the hydrogen gas.

摘要翻译： 氢气可视化装置包括具有在基板表面上形成的薄膜层的氢传感器和形成在薄膜层表面上的催化剂层，当与大气中包含的氢气接触时，将薄膜 从而改变薄膜层的光学反射率和设置有氢传感器的一个或多个传感器面。 氢气可视化装置在传感器面上显示了与氢传感器接触的气氛中所含的氢气的分布，从而使氢气的存在和流动显现。