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公开(公告)号：US20090236324A1
公开(公告)日：2009-09-24
申请号：US12282698
申请日：2007-03-06
申请人： Fumitsugu Fukuyo , Etsuji Ohmura , Kenshi Fukumitsu , Masayoshi Kumagai , Kazuhiro Atsumi , Naoki Uchiyama
发明人： Fumitsugu Fukuyo , Etsuji Ohmura , Kenshi Fukumitsu , Masayoshi Kumagai , Kazuhiro Atsumi , Naoki Uchiyama
IPC分类号： B23K26/38
CPC分类号： B23K26/53 , B23K26/0622 , B23K26/0853 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , C03B33/0222 , C03B33/037 , H01L21/78
摘要： An object to be processed 1 is irradiated with laser light L with a standard pulse waveform, so as to form a molten processed region 131, which has a larger size in the thickness direction of the object 1 and is easy to generate a fracture 24 in the thickness direction of the object 1, within a silicon wafer 111, and with laser light L with a retarded pulse waveform, so as to form a molten processed region 132, which has a smaller size in the thickness direction of the object 1 and is hard to generate the fracture 24 in the thickness direction of the object 1, within a silicon wafer 112.
摘要翻译： 用标准脉冲波形的激光L对被处理物体1进行照射，形成在物体1的厚度方向上具有较大尺寸的熔融处理区域131，容易产生骨折24 物体1的厚度方向，硅晶片111内，以及具有延迟脉冲波形的激光L，形成在物体1的厚度方向上具有较小尺寸的熔融处理区域132，并且为 在硅晶片112内难以在物体1的厚度方向上产生裂缝24。
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公开(公告)号：US08890027B2
公开(公告)日：2014-11-18
申请号：US12282698
申请日：2007-03-06
申请人： Fumitsugu Fukuyo , Etsuji Ohmura , Kenshi Fukumitsu , Masayoshi Kumagai , Kazuhiro Atsumi , Naoki Uchiyama
发明人： Fumitsugu Fukuyo , Etsuji Ohmura , Kenshi Fukumitsu , Masayoshi Kumagai , Kazuhiro Atsumi , Naoki Uchiyama
CPC分类号： B23K26/53 , B23K26/0622 , B23K26/0853 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , C03B33/0222 , C03B33/037 , H01L21/78
摘要： An object to be processed 1 is irradiated with laser light L with a standard pulse waveform, so as to form a molten processed region 131, which has a larger size in the thickness direction of the object 1 and is easy to generate a fracture 24 in the thickness direction of the object 1, within a silicon wafer 111, and with laser light L with a retarded pulse waveform, so as to form a molten processed region 132, which has a smaller size in the thickness direction of the object 1 and is hard to generate the fracture 24 in the thickness direction of the object 1, within a silicon wafer 112.
摘要翻译： 用标准脉冲波形的激光L对被处理物体1进行照射，形成在物体1的厚度方向上具有较大尺寸的熔融处理区域131，容易产生骨折24 物体1的厚度方向，硅晶片111内，以及具有延迟脉冲波形的激光L，形成在物体1的厚度方向上具有较小尺寸的熔融处理区域132，并且为 在硅晶片112内难以在物体1的厚度方向上产生裂缝24。
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公开(公告)号：US07547613B2
公开(公告)日：2009-06-16
申请号：US11106657
申请日：2005-04-15
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
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公开(公告)号：US20050173387A1
公开(公告)日：2005-08-11
申请号：US11101543
申请日：2005-04-08
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
IPC分类号： B28D5/00 , B23K26/073 , B23K26/38 , B23K101/40 , C03B33/023 , C03B33/08 , C03B33/10 , C03C23/00 , G02F1/1368 , H01L21/301 , B23K26/14 , B23K26/16 , G01B9/02
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
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公开(公告)号：US20100176100A1
公开(公告)日：2010-07-15
申请号：US12686039
申请日：2010-01-12
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
IPC分类号： B23K26/04 , B23K26/073 , B23K26/38
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
摘要翻译： 一种激光束加工方法和激光束加工装置，其能够切割工件而不产生在工件表面上的预定切割线的定影和裂纹，其中脉冲激光束照射在工件的预定切割线上 在导致多光子吸收的条件下并且具有与工件内部对准的凝聚点的工作表面，并且沿着预定的切割线沿着预定的切割线沿着预定的切割线移动凝聚点而在工件内部形成改质区域 由此，可以用相当小的力通过从修改区域开始沿着预定切割线的工作而切割工件，并且因为辐射的脉冲激光束几乎不被吸收到工件的表面上，所以表面不熔合 即使形成了修改区域。
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公开(公告)号：US20050189330A1
公开(公告)日：2005-09-01
申请号：US11106644
申请日：2005-04-15
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
IPC分类号： B28D5/00 , B23K26/073 , B23K26/38 , B23K101/40 , C03B33/023 , C03B33/08 , C03B33/10 , C03C23/00 , G02F1/1368 , H01L21/301 , B23K26/40
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
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公开(公告)号：US20050181581A1
公开(公告)日：2005-08-18
申请号：US11106643
申请日：2005-04-15
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
IPC分类号： B28D5/00 , B23K26/073 , B23K26/38 , B23K101/40 , C03B33/023 , C03B33/08 , C03B33/10 , C03C23/00 , G02F1/1368 , H01L21/301 , H01L21/78 , H01L21/46 , G01B9/02
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
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公开(公告)号：US07592238B2
公开(公告)日：2009-09-22
申请号：US11106648
申请日：2005-04-15
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
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公开(公告)号：US20070125757A1
公开(公告)日：2007-06-07
申请号：US10548412
申请日：2003-03-12
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
IPC分类号： B23K26/38
CPC分类号： C03B33/091 , B23K26/0604 , B23K26/0624 , B23K26/40 , B23K26/53 , B23K26/60 , B23K2101/40 , B23K2103/50 , B28D1/221 , B28D5/0011 , C03B33/023 , Y02P40/57
摘要： A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region 7 formed by multiphoton absorption forms a cutting start region 8 within an object to be processed 1 along a line to cut 5. Thereafter, the object 1 is irradiated with laser light L2 absorbable by the object 1 along the line to cut 5, so as to generate fractures 24 from the cutting start region 8 acting as a start point, whereby the object 1 can accurately be cut along the line to cut 5. Expanding an expandable film 19 having the object 1 secured thereto separates individual chips 25 from each other, which can further improve the reliability in cutting the object 1 along the line to cut 5.
摘要翻译： 提供了一种能够沿着切割线精密切割待处理物体的激光加工方法。 通过多光子吸收形成的改质区域7沿着切割线5在待处理物体1内形成切割开始区域8。 此后，对象物1照射由物体1沿着切割线5吸收的激光L 2，从作为起点的切割起始区域8产生裂缝24，由此能够精确地切割物体1 沿线切割5。 扩大其固定物体1的可膨胀膜19将各个芯片25彼此分开，这可以进一步提高沿着切割线5切割物体1的可靠性。
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公开(公告)号：US08685838B2
公开(公告)日：2014-04-01
申请号：US10548412
申请日：2003-03-12
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
IPC分类号： H01L21/00
CPC分类号： C03B33/091 , B23K26/0604 , B23K26/0624 , B23K26/40 , B23K26/53 , B23K26/60 , B23K2101/40 , B23K2103/50 , B28D1/221 , B28D5/0011 , C03B33/023 , Y02P40/57
摘要： A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region 7 formed by multiphoton absorption forms a cutting start region 8 within an object to be processed 1 along a line to cut 5. Thereafter, the object 1 is irradiated with laser light L2 absorbable by the object 1 along the line to cut 5, so as to generate fractures 24 from the cutting start region 8 acting as a start point, whereby the object 1 can accurately be cut along the line to cut 5. Expanding an expandable film 19 having the object 1 secured thereto separates individual chips 25 from each other, which can further improve the reliability in cutting the object 1 along the line to cut 5.
摘要翻译： 提供了一种能够沿着切割线精密切割待处理物体的激光加工方法。 通过多光子吸收形成的改质区域7沿着切割线5在待处理物体1内形成切割开始区域8.此后，对象物1照射被检体1沿着切断线5吸收的激光L2 ，以便从作为起始点的切割起始区域8产生裂缝24，由此物体1可以沿着切割线5精确地切割。扩大固定有物体1的可膨胀膜19将各个芯片25从 彼此进一步提高沿着切割线5切割物体1的可靠性。
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