公开(公告)号：US20130122737A1

公开(公告)日：2013-05-16

申请号：US13677941

申请日：2012-11-15

Applicant: Panduit Corp.

Inventor： Robert E. Fransen ,  Michael K. Yuan ,  Satish I. Patel

IPC: H01R4/24

CPC classification number: H01R4/2416 ,  H01R4/2445 ,  H01R12/73 ,  H01R13/506 ,  H01R13/6272 ,  H01R13/6461 ,  H01R13/648 ,  H01R13/6585 ,  H01R13/6658 ,  H01R24/64 ,  H01R27/00 ,  H01R29/00 ,  H01R2107/00

Abstract: The present invention generally relates to network connectors, and more particularly, to apparatuses, systems, and methods associated with network jacks having compatibility with more than one plug and corresponding plugs. In one embodiment, the present invention is a jack having multiple printed circuit boards, wherein each circuit board is used for connection to a particular style of a plug. In one embodiment, the jack according to the present invention is compatible with an RJ45 plug.

Abstract translation: 本发明一般涉及网络连接器，更具体地，涉及与具有与多于一个插头和相应插头兼容的网络插孔相关联的装置，系统和方法。 在一个实施例中，本发明是具有多个印刷电路板的插座，其中每个电路板用于连接到特定形式的插头。 在一个实施例中，根据本发明的千斤顶与RJ45插头兼容。

公开(公告)号：US20240039202A1

公开(公告)日：2024-02-01

申请号：US18378695

申请日：2023-10-11

Applicant: Panduit Corp.

Inventor： Benjamin S. Novak ,  Satish I. Patel ,  Roman J. Churnovic

IPC: H01R13/506 ,  H01R13/659 ,  H01R31/06

CPC classification number: H01R13/506 ,  H01R13/659 ,  H01R31/06 ,  H01R24/84

Abstract: An electrical coupler has first and second housing halves and first and second contacts retained within the first and second housing halves. Wherein the first housing half is identical to the second housing half and the first contact is identical to the second contact.

公开(公告)号：US11710910B2

公开(公告)日：2023-07-25

申请号：US17271889

申请日：2019-09-05

Applicant: Panduit Corp.

Inventor： Benjamin S. Novak ,  Satish I. Patel ,  Sean W. Lenz

IPC: H01R4/2433 ,  H01R13/502 ,  H01R13/58 ,  H01R24/64

CPC classification number: H01R4/2433 ,  H01R13/502 ,  H01R13/5825 ,  H01R13/5829 ,  H01R24/64 ,  H01R2201/04

Abstract: A communication connector has an outer housing with an opening, a shielding wrap at least partially enclosing the outer housing, and a contact carrier assembly configured to be interested into the opening of the outer housing. The contact carrier assembly at least partially encloses at least two contacts each with an insulation displacement contact (IDC). The contact carrier assembly also has an integrated wire cap that utilizes a hinge feature to press cable conductors of a cable into their respective IDCs.

公开(公告)号：US11705681B2

公开(公告)日：2023-07-18

申请号：US17445429

申请日：2021-08-19

Applicant: Panduit Corp.

Inventor： Satish I. Patel

IPC: H01R13/60 ,  H01R24/64 ,  H01R11/11 ,  H01R13/58 ,  H01R13/50

CPC classification number: H01R24/64 ,  H01R11/11 ,  H01R13/501 ,  H01R13/5829

Abstract: A connector has a plug housing and a termination cap housing assembly pivotably attached to the plug housing. The termination cap housing assembly has a pair of contacts secured thereto such that pivoting the termination cap housing assembly to the plug housing terminates the contacts to a pair of wires inserted into the plug housing.

公开(公告)号：US20230057001A1

公开(公告)日：2023-02-23

申请号：US17445429

申请日：2021-08-19

Applicant: Panduit Corp.

Inventor： Satish I. Patel

IPC: H01R24/64 ,  H01R13/50 ,  H01R13/58 ,  H01R11/11

Abstract: A connector has a plug housing and a termination cap housing assembly pivotably attached to the plug housing. The termination cap housing assembly has a pair of contacts secured thereto such that pivoting the termination cap housing assembly to the plug housing terminates the contacts to a pair of wires inserted into the plug housing.

公开(公告)号：US11165202B2

公开(公告)日：2021-11-02

申请号：US16730281

申请日：2019-12-30

Applicant: Panduit Corp.

Inventor： Satish I. Patel ,  Roman J. Churnovic ,  Jean de Dieu Muntangana

IPC: H01R13/646 ,  H01R13/6464 ,  H01R24/64 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6469

Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

公开(公告)号：US20210242623A1

公开(公告)日：2021-08-05

申请号：US17155460

申请日：2021-01-22

Applicant: Panduit Corp.

Inventor： Satish I. Patel ,  Roman J. Churnovic ,  Vytas J. Vaitkus ,  Robert E. Fransen

IPC: H01R13/58 ,  H01R13/506

Abstract: A modular communications plug is disclosed having a simplified design that allows for more efficient termination of a cable into the plug. The plug includes modular components that are applicable to different applications.

公开(公告)号：US20190074647A1

公开(公告)日：2019-03-07

申请号：US16177607

申请日：2018-11-01

Applicant: Panduit Corp.

Inventor： Joshua A. Valenti ,  Satish I. Patel ,  Robert E. Fransen ,  Michael B. Verbeek

IPC: H01R24/64

Abstract: The present invention generally relates to the field of telecommunication, and more particularly, to the field of connectors such as plugs and/or jacks used to interconnect electronic equipment. In an embodiment, the present invention is a shielded RJ45 network jack with an inter-jack connection method that has an electrical disengagement point outside of any electrical mating points, while still allowing for a relatively short distance to compensation from the plug/jack mating interface.

公开(公告)号：US20180351303A1

公开(公告)日：2018-12-06

申请号：US16102289

申请日：2018-08-13

Applicant: Panduit Corp.

Inventor： Jason O'Young ,  Satish I. Patel ,  Joshua A. Valenti ,  Paul W. Wachtel ,  Robert E. Fransen ,  Andrew Ciezak ,  Michael B. Verbeek

IPC: H01R13/6461 ,  H01R13/6582 ,  H01R13/639 ,  H01R24/64 ,  H01R13/6581 ,  H01R12/62 ,  H01R13/627 ,  H01R13/6466 ,  H01R107/00 ,  H01R13/6469

CPC classification number: H01R13/6461 ,  H01R12/62 ,  H01R13/6272 ,  H01R13/639 ,  H01R13/6466 ,  H01R13/6469 ,  H01R13/6581 ,  H01R13/6582 ,  H01R24/64 ,  H01R2107/00

Abstract: Embodiments of the present invention relate to the field of telecommunication, and more specifically, to communication connectors such as, for example, shielded plug and jack connectors. In an embodiment, the present invention is a communication jack that includes a housing and a front sled assembly having a plurality of plug interface contacts (PICs), the front sled assembly being moveable along a horizontal plane of the communication jack between a first position and a second position, the first position being different from the second position.

公开(公告)号：US10050384B2

公开(公告)日：2018-08-14

申请号：US15469903

申请日：2017-03-27

Applicant: Panduit Corp.

Inventor： Satish I. Patel ,  Roman J. Churnovic ,  Jean De Dieu Mutangana

IPC: H01R13/6464 ,  H01R24/64 ,  H01R13/6461

Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.