Non-volatile semiconductor storage device and method of manufacturing the same
    63.
    发明授权
    Non-volatile semiconductor storage device and method of manufacturing the same 有权
    非易失性半导体存储装置及其制造方法

    公开(公告)号:US08338876B2

    公开(公告)日:2012-12-25

    申请号:US12555320

    申请日:2009-09-08

    IPC分类号: H01L29/788

    摘要: A non-volatile semiconductor storage device includes a plurality of memory strings each having a plurality of electrically rewritable memory cells connected in series. Each of the memory strings comprising: a first semiconductor layer including a columnar portion extending in a vertical direction with respect to a substrate; a plurality of first conductive layers formed to surround side surfaces of the columnar portions via insulation layers, and formed at a certain pitch in the vertical direction, the first conductive layers functioning as floating gates of the memory cells; and a plurality of second conductive layers formed to surround the first conductive layers via insulation layers, and functioning as control electrodes of the memory cells. Each of the first conductive layers has a length in the vertical direction that is shorter than a length in the vertical direction of each of the second conductive layers.

    摘要翻译: 非挥发性半导体存储装置包括多个存储串,每个存储串具有串联连接的多个电可重写存储单元。 每个存储器串包括:第一半导体层,包括相对于衬底在垂直方向上延伸的柱状部分; 多个第一导电层,经由绝缘层形成为围绕柱状部分的侧表面,并以垂直方向上的一定间距形成,第一导电层用作存储器单元的浮动栅极; 以及形成为经由绝缘层包围第一导电层并且用作存储单元的控制电极的多个第二导电层。 每个第一导电层在垂直方向上具有比每个第二导电层的垂直方向上的长度短的长度。

    Nonvolatile semiconductor memory device and method for manufacturing same
    64.
    发明授权
    Nonvolatile semiconductor memory device and method for manufacturing same 失效
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US08264031B2

    公开(公告)日:2012-09-11

    申请号:US12696544

    申请日:2010-01-29

    IPC分类号: H01L29/792

    摘要: A nonvolatile semiconductor memory device includes: a semiconductor substrate; a multilayer structure; a semiconductor pillar; a third insulating film; and a fourth insulating film layer. The a multilayer structure is provided on the semiconductor substrate and including a plurality of constituent multilayer bodies stacked in a first direction perpendicular to a major surface of the semiconductor substrate. Each of the plurality of constituent multilayer bodies includes an electrode film provided parallel to the major surface, a first insulating film, a charge storage layer provided between the electrode film and the first insulating film, and a second insulating film provided between the charge storage layer and the electrode film. The semiconductor pillar penetrates through the multilayer structure in the first direction. The third insulating film is provided between the semiconductor pillar and the electrode film. The fourth insulating film is provided between the semiconductor pillar and the charge storage layer.

    摘要翻译: 非易失性半导体存储器件包括:半导体衬底; 多层结构; 半导体柱; 第三绝缘膜; 和第四绝缘膜层。 多层结构设置在半导体衬底上,并且包括沿垂直于半导体衬底的主表面的第一方向堆叠的多个构成层叠体。 多个构成多层体中的每一个包括平行于主表面设置的电极膜,第一绝缘膜,设置在电极膜和第一绝缘膜之间的电荷存储层,以及设置在电荷存储层 和电极膜。 半导体柱沿第一方向穿透多层结构。 第三绝缘膜设置在半导体柱和电极膜之间。 第四绝缘膜设置在半导体柱和电荷存储层之间。

    Non-volatile semiconductor storage device and method of manufacturing the same
    65.
    发明授权
    Non-volatile semiconductor storage device and method of manufacturing the same 有权
    非易失性半导体存储装置及其制造方法

    公开(公告)号:US08237211B2

    公开(公告)日:2012-08-07

    申请号:US12556242

    申请日:2009-09-09

    IPC分类号: H01L29/788

    摘要: A non-volatile semiconductor storage device has a memory string including a plurality of electrically rewritable memory cells connected in series. The non-volatile semiconductor storage device also has a protruding layer formed to protrude upward with respect to a substrate. The memory string includes: a plurality of first conductive layers laminated on the substrate; a first semiconductor layer formed to penetrate the plurality of first conductive layers; and an electric charge storage layer formed between the first conductive layers and the first semiconductor layer, and configured to be able to store electric charges. Each of the plurality of first conductive layers includes: a bottom portion extending in parallel to the substrate; and a side portion extending upward with respect to the substrate along the protruding layer at the bottom portion. The protruding layer has a width in a first direction parallel to the substrate that is less than or equal to its length in a lamination direction.

    摘要翻译: 非易失性半导体存储装置具有串联连接的多个电可重写存储单元的存储串。 非挥发性半导体存储装置还具有形成为相对于基板向上突出的突出层。 存储器串包括:层叠在基板上的多个第一导电层; 形成为穿透所述多个第一导电层的第一半导体层; 以及形成在第一导电层和第一半导体层之间的电荷存储层,并且能够存储电荷。 多个第一导电层中的每一个包括:平行于基板延伸的底部; 以及沿底部的突出层相对于基板向上延伸的侧部。 该突出层在平行于基板的第一方向上的宽度小于或等于其在层叠方向上的长度。