Abstract:
A method of testing a printed circuit board (PCB) acquires test points from a wiring diagram of the PCB. Frequency domain tested items for each test point and a standard value of each frequency domain tested item are preset. A distance between a preset fiducial point and each test point is computed to create a testing order of the test points according to the distances. The frequency domain tested items of each test point are computed according to the testing order. A pass or a failure of each test point is displayed according to a determination of if each of the computed frequency domain tested items within the corresponding standard value, and a test result of the PCB is output according to the passes or the failures.
Abstract:
In a method for verifying a printed circuit board (PCB) layout using a computing device, a PCB simulation file is obtained from a storage device of the computing device, and a PCB image is displayed on a display device according to the PCB simulation file. The PCB image includes multiple signal lines and switching voltage regulator nodes (SVRN). A SVRN to be checked is selected from the PCB image, and all signal lines around the SVRN are searched. The method calculates a layout distance between the selected SVRN and each of the searched signal lines, and generates a graphical window interface to position a signal line whose layout distance is equal to or less than the minimum distance. The method further modifies the layout of the positioned signal line to satisfy a layout design specification by increasing the layout distance to the minimum distance.
Abstract:
A computer determines a first origin of a first coordinate system of a PCB, and controls a robotic arm to position a probe above the first origin. Furthermore, the computer determines a second origin of a second coordinate system of the robotic arm, and determines displacement values from the first origin to a test point in controlling movements of the robotic arm in the second coordinate system. A graph representing the test point is recognized in an image of the PCB, pixel value differences between the graph center and the image center are determined and converted to displacement correction values for controlling the movements of the robotic arm and determining 3D coordinates of the test point. The robotic arm is moved along a Z-axis of the second coordinate system to precisely position the probe on the test point of the PCB.
Abstract:
An electronic device and a method for checking layout distance of a printed circuit board (PCB) including presetting a checking condition to determine a reference layer. A high speed signal path is selected from a PCB design file, and a layer where the selected high speed signal path is located can be determined A reference layer of the determined layer is determined according to the checking condition, and a split line of the reference layer is determined. A shortest distance between each segment of the selected high speed signal path and the split line is calculated. If the shortest distance between a segment and the split line is less than the standard distance, layout of the segment is determined to be invalid.
Abstract:
A printed circuit board (PCB) includes two layers, two signal transmission traces, and a vertical interconnect access (via). The signal transmission traces are respectively arranged on the layers. The signal transmission traces are electrically connected to each other through the via. A centerline of the via with a vertical line of the layers form an acute angle θ, the angle θ is less than cos−1[(Lv2−Lt2)/(Lv2+Lt2)]. Wherein Lt is loss of the two signal transmitting traces in a unit length, and Lv is loss of the via in a unit length.
Abstract:
A clamping mechanism for holding a workpiece includes an end executor, a driving member, and a contact member detachably mounted on the end executor. The end executor includes a plurality of claws arranged in matrix. The contact member includes a mounting board and a plurality of contact sleeves corresponding to the claws. The driving member is capable of driving the mounting board, moving the contact sleeves to extend the claws, and hold the workpiece.
Abstract:
A direct current compensation method for S-parameter rational functions reads S-parameters f(sk), which are generated at given frequency sk, from a storage unit. An S-parameter, which is generated at frequency sk=0 is supplemented into the S-parameters f(sk), upon the condition that there is no S-parameter which is generated at the frequency sk=0. An S-parameter ration function is generated according to the S-parameters f(sk). A DC level of the S-parameter rational function is compensated to generate a compensated S-parameter rational function.
Abstract:
An enclosure of an electronic device includes a plate. The plate defines a number of through holes. A number of shields extend from the plate corresponding to the through holes. Each shield extends outwards from the outer surface of the plate, surrounding and partly covering a corresponding through hole. The enclosure with the shields can shield the electronic device from EMI.
Abstract:
In a method and system for automatically generating a circuit diagram for a wiring design of a circuit board, a preset output format of wiring attributes of the wiring design for the circuit board is received. A board file is created. Initial parameters of the wiring design for the circuit board are preset. The wiring attributes of the wiring design are determined by simulating and analyzing the wiring design, and be backed up into a document. The wiring attributes are imported into the board file according to the preset output format. A circuit diagram is generated according to the wiring design and the initial parameters, and is adjusted using the wiring attributes in the board file.
Abstract:
A printed circuit board includes a signal plane and a reference plane. The signal plane includes a pad, a passive element mounted on the pad, and a signal transmission line electrically connected to the passive element via the pad. The reference plane provides a return path for a signal transmitted through the passive element and the signal transmission line. A void is defined in the reference plane corresponding to the passive element, to increase a length of the return path. A length of a first axis, perpendicular to the signal transmission line, of the void satisfies a following equation: W 1 ≈ 8 Wpad + 10 T 0.8 Wtrace + T , wherein Wpad is a width of the pad, Wtrace is a width of the transmission line, T is the height of the pad.
Abstract translation:印刷电路板包括信号平面和参考平面。 信号平面包括焊盘,安装在焊盘上的无源元件以及通过焊盘与无源元件电连接的信号传输线。 参考平面为通过无源元件和信号传输线传输的信号提供返回路径。 在对应于无源元件的参考平面中定义空隙,以增加返回路径的长度。 垂直于信号传输线的第一轴的长度满足以下等式:W 1≈8 Wpad + 10 T T W W W T T T + T,其中W pad是焊盘的宽度,Wtrace是 传输线的宽度,T是焊盘的高度。