公开(公告)号：US08436691B2

公开(公告)日：2013-05-07

申请号：US12620558

申请日：2009-11-17

申请人： Po-Chuan Hsieh ,  Yu-Chang Pai ,  Shou-Kuo Hsu

发明人： Po-Chuan Hsieh ,  Yu-Chang Pai ,  Shou-Kuo Hsu

IPC分类号： H01P3/08 ,  H01P1/203

CPC分类号： H01P1/2039 ,  H01P3/085

摘要： A signal transmission apparatus includes two circuit layers. First and second ground sheets each has a rectangular area are arranged in the two circuit layers respectively. A third ground sheet is arranged between the two circuit layers. A differential pair includes a transmission line arranged between the first and third ground sheets and a transmission line arranged between the second and third ground sheets. The first to third ground sheets have same electric potential. Projections of the two rectangular areas on a surface where the third ground sheet in only have one common border with the third ground sheet. The third ground sheet is formed by extending the common border along a signal transmission direction. The differential pair includes a number of section pairs each composed of two sections arranged in the two transmission lines symmetrically. Every two adjacent section pairs are equivalent to a capacitor and an inductor.

摘要翻译： 信号传输装置包括两个电路层。 分别在两个电路层中布置有具有矩形区域的第一和第二接地片。 第三接地片布置在两个电路层之间。 差动对包括布置在第一和第三接地片之间的传输线和布置在第二和第三接地片之间的传输线。 第一至第三接地片具有相同的电位。 在第三接地片与第三接地片只有一个共同边界的表面上的两个矩形区域的投影。 第三接地片通过沿着信号传输方向延伸公共边界而形成。 差分对包括多个部分对，每个部分对由两个对称布置在两个传输线中的部分组成。 每两个相邻的部分对相当于一个电容和一个电感。

公开(公告)号：US08384491B2

公开(公告)日：2013-02-26

申请号：US12620559

申请日：2009-11-17

申请人： Po-Chuan Hsieh ,  Hsiao-Yun Su ,  Yu-Chang Pai ,  Shou-Kuo Hsu

发明人： Po-Chuan Hsieh ,  Hsiao-Yun Su ,  Yu-Chang Pai ,  Shou-Kuo Hsu

IPC分类号： H01P3/08

CPC分类号： H01Q13/08

摘要： A signal transmission apparatus includes two circuit layers. First and second ground sheets are arranged in the two circuit layers respectively. A third ground sheet is arranged between the two circuit layers. A differential pair includes a transmission line arranged between the first and third ground sheets and a transmission line arranged between the second and third ground sheets. The first to third ground sheets have same electric potential. Projections of the first and second ground sheets on the third ground sheet superpose a border of the third ground sheet. The third ground sheet is formed by extending the border along a signal transmission direction. A vertical distance between the first and second transmission lines is twice as each of a vertical distance from the first ground sheet to the first transmission line and a vertical distance from the second ground sheet to the second transmission line.

摘要翻译： 信号传输装置包括两个电路层。 第一和第二接地片分别布置在两个电路层中。 第三接地片布置在两个电路层之间。 差动对包括布置在第一和第三接地片之间的传输线和布置在第二和第三接地片之间的传输线。 第一至第三接地片具有相同的电位。 第三接地片上的第一和第二接地片的投影叠加第三接地片的边界。 第三接地片是沿着信号传输方向延伸边界而形成的。 第一和第二传输线之间的垂直距离是从第一接地片到第一传输线的垂直距离以及从第二接地片到第二传输线的垂直距离的两倍。

公开(公告)号：US08283574B2

公开(公告)日：2012-10-09

申请号：US13031617

申请日：2011-02-22

申请人： Yung-Chieh Chen ,  Cheng-Hsien Lee ,  Po-Chuan Hsieh ,  Shou-Kuo Hsu ,  Shin-Ting Yen ,  Dan-Chen Wu ,  Jia-Chi Chen

发明人： Yung-Chieh Chen ,  Cheng-Hsien Lee ,  Po-Chuan Hsieh ,  Shou-Kuo Hsu ,  Shin-Ting Yen ,  Dan-Chen Wu ,  Jia-Chi Chen

IPC分类号： H05K1/11

CPC分类号： H05K1/0251 ,  H05K1/0225 ,  H05K1/0295 ,  H05K1/0298 ,  H05K1/113

摘要： A printed circuit board (PCB) with compound via includes a substrate and a pair of through holes passing through the substrate. The substrate includes a signal layer which is the top layer of the substrate, a first reference layer adjacent to the signal layer, and a second reference layer not adjacent to the signal layer. A first and a second pair of pads are mounted on the signal layer. Each of the through holes extends through the first pair of pads such that the through hole and the first pair of pads jointly form a compound via. A first reserved opening is formed on the first reference layer and corresponds to the first and the second pair of pads and the compound via. A second reserved opening is formed on the second reference layer and surrounds the through hole thereon.

摘要翻译： 具有复合通孔的印刷电路板（PCB）包括基板和穿过基板的一对通孔。 衬底包括作为衬底的顶层的信号层，与信号层相邻的第一参考层和不与信号层相邻的第二参考层。 第一和第二对焊盘安装在信号层上。 每个通孔延伸穿过第一对垫，使得通孔和第一对垫共同形成复合通孔。 第一保留开口形成在第一参考层上，并且对应于第一和第二对焊盘和复合通孔。 第二保留开口形成在第二参考层上并围绕其上的通孔。

公开(公告)号：US20120197583A1

公开(公告)日：2012-08-02

申请号：US13290143

申请日：2011-11-07

申请人： HSIEN-CHUAN LIANG ,  SHEN-CHUN LI ,  PO-CHUAN HSIEH ,  YU-CHANG PAI ,  SHOU-KUO HSU

发明人： HSIEN-CHUAN LIANG ,  SHEN-CHUN LI ,  PO-CHUAN HSIEH ,  YU-CHANG PAI ,  SHOU-KUO HSU

IPC分类号： G06F19/00

CPC分类号： G01R31/2801 ,  G01R31/2812 ,  G01R31/2834

摘要： A method of testing a printed circuit board (PCB) acquires test points from a wiring diagram of the PCB. Frequency domain tested items for each test point and a standard value of each frequency domain tested item are preset. A distance between a preset fiducial point and each test point is computed to create a testing order of the test points according to the distances. The frequency domain tested items of each test point are computed according to the testing order. A pass or a failure of each test point is displayed according to a determination of if each of the computed frequency domain tested items within the corresponding standard value, and a test result of the PCB is output according to the passes or the failures.

摘要翻译： 测试印刷电路板（PCB）的方法从PCB接线图获取测试点。 每个测试点的频域测试项目和每个频域测试项目的标准值都是预设的。 计算预设基准点与每个测试点之间的距离，以根据距离创建测试点的测试顺序。 每个测试点的频域测试项目根据测试顺序计算。 根据是否根据通过或故障输出每个计算出的频域测试项目在相应的标准值内以及PCB的测试结果的确定来显示每个测试点的通过或失败。

公开(公告)号：US20120005388A1

公开(公告)日：2012-01-05

申请号：US12880155

申请日：2010-09-13

申请人： Po-Chuan HSIEH ,  Chien-Hung LIU ,  Yu-Chang PAI

发明人： Po-Chuan HSIEH ,  Chien-Hung LIU ,  Yu-Chang PAI

IPC分类号： G06F13/00 ,  G06F12/00

CPC分类号： G06F13/409 ,  G06F3/061 ,  G06F3/0626 ,  G06F3/0658 ,  G06F3/0683

摘要： An exemplary high speed data storage system includes hard disks, a first control panel, a second control panel and a midplane interconnected between each of the first and second control panels and the hard disks. Each of the first and second control panels includes a control chip and a connector. First and second printed circuit wires corresponding to the hard disks are layered on the first and second control panels for electrically connecting the control chip with the connector, respectively. The first printed circuit wires of the first control panel and the second printed circuit wires of the second control panel are arranged symmetrically with respect to each other, and an order of stacking circuit layers of the first printed circuit wires of the first control panel is the reverse of an order of stacking of circuit layers of the second printed circuit wires of the second control panel.

摘要翻译： 示例性的高速数据存储系统包括硬盘，第一控制面板，第二控制面板和互连在第一和第二控制面板和硬盘中的每一个之间的中间面板。 第一和第二控制面板中的每一个包括控制芯片和连接器。 分别对应于硬盘的第一和第二印刷电路线分别在第一和第二控制面板上分别用于将控制芯片与连接器电连接。 第一控制面板的第一印刷电路布线和第二控制面板的第二印刷电路布线相对于彼此对称布置，第一控制面板的第一印刷电路布线的层叠电路层的顺序为 第二控制面板的第二印刷电路线的电路层的层叠顺序相反。

公开(公告)号：US20110320183A1

公开(公告)日：2011-12-29

申请号：US12906126

申请日：2010-10-17

申请人： PO-CHUAN HSIEH ,  YU-CHANG PAI ,  CHIEN-HUNG LIU

发明人： PO-CHUAN HSIEH ,  YU-CHANG PAI ,  CHIEN-HUNG LIU

IPC分类号： G06F17/50

CPC分类号： G06F17/5036

摘要： A computing device and a method determines port relationships of a differential transmission line of a circuit board according to an original scattering parameters file, which records scattering parameter values measured from ports of the differential transmission line under different signal frequencies. The computing device generates a new scattering parameters file matching a scattering parameters model predefined for the differential transmission line according to the determined port relationships. Design of the differential transmission line is analyzed to determine if the differential transmission line is qualified according to the new scattering parameters file and the scattering parameters model.

摘要翻译： 计算装置和方法根据原始散射参数文件来确定电路板的差分传输线的端口关系，原始散射参数文件记录在不同信号频率下从差分传输线的端口测量的散射参数值。 计算装置根据所确定的端口关系，生成与差分传输线预定义的散射参数模型匹配的新的散射参数文件。 分析差分传输线的设计，根据新的散射参数文件和散射参数模型，确定差分传输线是否合格。

公开(公告)号：US20110299263A1

公开(公告)日：2011-12-08

申请号：US12855903

申请日：2010-08-13

申请人： Yu-Chang Pai ,  Po-Chuan Hsieh ,  Chien-Hung Liu ,  Shou-Kuo Hsu

发明人： Yu-Chang Pai ,  Po-Chuan Hsieh ,  Chien-Hung Liu ,  Shou-Kuo Hsu

IPC分类号： H05K9/00

CPC分类号： H05K9/0041

摘要： An enclosure includes a plate. The plate defines a number of through holes. A hollow shield extends from the edges bounding each through hole. A top side of the shield opposite to the plate is smaller than a bottom side of the shield which is connected to the edges of the through hole. The enclosure can better shield electromagnetic interference (EMI) from the electronic device.

摘要翻译： 外壳包括一个板。 该板限定了多个通孔。 中空的护罩从每个通孔的边缘延伸。 屏蔽件与板的相对的顶侧小于屏蔽件的底部侧，该底部侧连接到通孔的边缘。 外壳可以更好地屏蔽电子设备的电磁干扰（EMI）。

公开(公告)号：US20110298341A1

公开(公告)日：2011-12-08

申请号：US12859283

申请日：2010-08-19

申请人： Chien-Hung Liu ,  Yu-Chang Pai ,  Po-Chuan Hsieh ,  Shou-Kuo Hsu

发明人： Chien-Hung Liu ,  Yu-Chang Pai ,  Po-Chuan Hsieh ,  Shou-Kuo Hsu

IPC分类号： H05K5/02

CPC分类号： H05K9/0086

摘要： An enclosure of an electronic device includes a plate. The plate defines a number of through holes with a number of shields. Each shield includes a tab apart from the plate. At least two spaced connection pieces connect the tab to a corresponding through hole in such a way that the tab is substantially aligned with and spaced from the corresponding through hole.

摘要翻译： 电子设备的外壳包括板。 该板限定了多个具有多个屏蔽的通孔。 每个护罩包括一个离开板的突出部分。 至少两个间隔开的连接件将突片连接到对应的通孔，使得突出部基本上与相应的通孔对准并与之隔开。

公开(公告)号：US20110297438A1

公开(公告)日：2011-12-08

申请号：US12868687

申请日：2010-08-25

申请人： PO-CHUAN HSIEH ,  YU-CHANG PAI ,  CHIEN-HUNG LIU

发明人： PO-CHUAN HSIEH ,  YU-CHANG PAI ,  CHIEN-HUNG LIU

IPC分类号： H05K7/20 ,  H05K9/00

CPC分类号： H05K9/0041

摘要： An enclosure of an electronic device includes a ventilation plate. The ventilation plate is a grid including a number of crisscrossed connection bars and a number of through holes defined by the connection bars. A tab is formed at each of the connection bars bounding each of the through holes. The tabs are substantially angled from a plane of the grid to elongate a path electromagnetic signals must travel to pass through the ventilation plate. The enclosure with the shields can shield the electronic device from EMI.

摘要翻译： 电子设备的外壳包括通风板。 通风板是包括多个十字交叉的连接杆和由连接杆限定的多个通孔的格栅。 每个连接条形成在每个通孔上的突片。 突片从网格的平面基本成角度，以延长电磁信号必须行进以通过通风板的路径。 带屏蔽的外壳可以屏蔽电子设备免受EMI影响。

公开(公告)号：US20110266046A1

公开(公告)日：2011-11-03

申请号：US12841125

申请日：2010-07-21

申请人： PO-CHUAN HSIEH ,  YU-CHANG PAI ,  CHIEN-HUNG LIU ,  SHOU-KUO HSU

发明人： PO-CHUAN HSIEH ,  YU-CHANG PAI ,  CHIEN-HUNG LIU ,  SHOU-KUO HSU

IPC分类号： H05K9/00

CPC分类号： H05K9/0041 ,  H05K9/0024

摘要： An enclosure of an electronic device includes a plate. The plate defines a number of through holes. A number of shields extend from the plate corresponding to the through holes. Each shield extends outwards from the outer surface of the plate, surrounding and partly covering a corresponding through hole. The enclosure with the shields can shield the electronic device from EMI.

摘要翻译： 电子设备的外壳包括板。 该板限定了多个通孔。 多个屏蔽件从对应于通孔的板延伸。 每个护罩从板的外表面向外延伸，围绕并部分覆盖相应的通孔。 带屏蔽的外壳可以屏蔽电子设备免受EMI影响。