Electronic Component
    61.
    发明申请

    公开(公告)号:US20170213623A1

    公开(公告)日:2017-07-27

    申请号:US15313939

    申请日:2015-05-20

    Applicant: EPCOS AG

    Abstract: An electronic component is disclosed. In an embodiment, the electronic component includes a plurality of functional layers arranged one on top of the other forming a stack, first inner electrodes, and second inner electrodes, each of the first and second inner electrodes arranged between two adjacent functional layers. The electronic component further includes a first outer contact electrically connected to the first inner electrodes and a second outer contact electrically connected to the second inner electrodes, wherein the functional layers are selected such that the first and second outer contacts are electrically conductively connected to one another via the functional layers both in a basic state and in a hot state of the electronic component, wherein a temperature of the hot state is higher than a temperature of the basic state, and wherein the electronic component is an NTC component.

    Electronic Component and Method for the Production Thereof

    公开(公告)号:US20170092394A1

    公开(公告)日:2017-03-30

    申请号:US15312503

    申请日:2015-05-18

    Applicant: EPCOS AG

    Abstract: An electronic component and a method for producing an electrical component are disclosed. In an embodiment, the electronic component includes a functional body having a first surface and a second surface, wherein the second surface faces away from the first surface, and a contact electrically linked to the first surface, the contact having an edge region and a central region, wherein the functional body has a first electrical resistance between the first surface and the second surface in a first functional body portion, which overlaps the edge region of the contact as viewed in a plan view of the electronic component, that is greater than a second electrical resistance between the first surface and the second surface in a second functional body portion, which overlaps the central region of the contact as viewed in a plan view of the electronic component.

    METHOD FOR PRODUCING A MULTI-LAYER COMPONENT AND MULTI-LAYER COMPONENT
    64.
    发明申请
    METHOD FOR PRODUCING A MULTI-LAYER COMPONENT AND MULTI-LAYER COMPONENT 审中-公开
    用于生产多层组件和多层组件的方法

    公开(公告)号:US20150123516A1

    公开(公告)日:2015-05-07

    申请号:US14407919

    申请日:2013-06-06

    Applicant: EPCOS AG

    Abstract: A method for producing a multilayer component (21) is specified, which involves providing a body having dielectric layers (3) arranged one above another and first and second electrically conductive layers (4, 84, 5, 85) arranged therebetween. The first conductive layers (4, 84) are connected to a first auxiliary electrode (6) and the second conductive layers (5, 85) are connected to a second auxiliary electrode (7). The body (1, 81) is introduced into a medium and a voltage is applied between the first and second auxiliary electrodes (6, 7) for producing a material removal. Furthermore, a multilayer component is specified, which has depressions (20) formed by an electrochemically controlled material removal.

    Abstract translation: 具体地说,提供一种制造多层部件(21)的方法,其特征在于,具备设置在彼此上下配置的电介质层(3)的主体以及配置在其间的第一和第二导电层(4,84,55)。 第一导电层(4,84)连接到第一辅助电极(6),第二导电层(5,85)连接到第二辅助电极(7)。 将主体(1,81)引入介质中,并且在第一和第二辅助电极(6,7)之间施加电压以产生材料去除。 此外,指定了具有通过电化学控制的材料去除形成的凹陷(20)的多层部件。

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