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    Semiconductor package with package main body cooling structure using coolant, and semiconductor package assembly with the semiconductor package and coolant circulating structure
    61.
    发明授权
    Semiconductor package with package main body cooling structure using coolant, and semiconductor package assembly with the semiconductor package and coolant circulating structure 有权
    半导体封装采用封装主体冷却结构，采用冷却液，半导体封装组装具有半导体封装和冷却液循环结构

    公开(公告)号：US08405204B2

    公开(公告)日：2013-03-26

    申请号：US12274582

    申请日：2008-11-20

    申请人： Tsuyoshi Hasegawa

    发明人： Tsuyoshi Hasegawa

    IPC分类号： H01L23/34

    CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor package includes a main body having a semiconductor device accommodating portion accommodating a basic circuit including a semiconductor device, external connection terminal members protruding outside the main body, and a cooling structure reducing heat generated by the device from the main body. The cooling structure includes a coolant flowing portion including a coolant supply port to which coolant is supplied, a coolant moving space which is positioned adjacent to the accommodating portion and in which the coolant moves in a back side of the basic circuit of the accommodating portion, and a coolant discharge port which discharges the coolant from the moving space. The semiconductor package assembly includes a package support body which supports the package and which includes a coolant circulation structure supplying coolant to the flowing portion of the main body through the supply port and collecting the supplied coolant through the discharge port.

    摘要翻译： 半导体封装包括具有容纳包括半导体器件的基本电路的半导体器件容纳部分和在主体外部突出的外部连接端子部件的主体，以及减少由该器件从主体产生的热量的冷却结构。 冷却结构包括冷却剂流动部分，冷却剂流动部分包括供应冷却剂的冷却剂供应口，冷却剂移动空间，其位于与容纳部分相邻的位置，并且冷却剂在容纳部分的基本回路的后侧移动， 以及从移动空间排出冷却剂的冷却剂排出口。 半导体封装组件包括支撑封装的封装支撑体，其包括冷却剂循环结构，冷却剂循环结构通过供应端口向主体的流动部分供应冷却剂，并通过排出口收集供应的冷却剂。

    RECEPTION APPARATUS, RADIO COMMUNICATION METHOD, AND RADIO COMMUNICATION SYSTEM
    62.
    发明申请
    RECEPTION APPARATUS, RADIO COMMUNICATION METHOD, AND RADIO COMMUNICATION SYSTEM 有权
    接收装置，无线电通信方法和无线电通信系统

    公开(公告)号：US20130052958A1

    公开(公告)日：2013-02-28

    申请号：US13559758

    申请日：2012-07-27

    申请人： Tsuyoshi Hasegawa

    发明人： Tsuyoshi Hasegawa

    IPC分类号： H04B15/00

    CPC分类号： H04B7/0413 ,  H04B1/1081 ,  H04B7/0854

    摘要： A reception apparatus includes a plurality of reception antennas configured to receive transmission signals transmitted from a plurality of transmission antennas, a first interference processing section configured to perform a weighting processing of imparting a weight to reduce a multipath interference component corresponding to an intersymbol interference based on a multipath while leaving an inter-antenna interference component corresponding to an interference component imparted by a transmission signal from one transmission antenna on the transmission signal from another transmission antenna among the plurality of transmission antennas with respect to each of a plurality of reception signals received by the plurality of reception antennas, and a second interference processing section configured to remove the inter-antenna interference component with respect to each of the plurality of reception signals on which the weighting processing is performed.

    摘要翻译： 接收装置包括：多个接收天线，被配置为接收从多个发送天线发送的发送信号;第一干扰处理部，被配置为执行加权处理，所述加权处理分配权重以减少对应于符号间干扰的多径干扰成分，基于 相对于由多个发送天线中的每一个发送天线相对于由多个发送天线中的每一个接收的多个接收信号中的每一个接收到的来自一个发送天线的发送信号所赋予的干扰分量，对多个接收信号 所述多个接收天线，以及第二干扰处理部，被配置为相对于执行了所述加权处理的所述多个接收信号中的每一个去除所述天线间干扰分量。

    6,7-UNSATURATED-7-CARBAMOYL SUBSTITUTED MORPHINAN DERIVATIVE
    64.
    发明申请
    6,7-UNSATURATED-7-CARBAMOYL SUBSTITUTED MORPHINAN DERIVATIVE 有权
    6,7-不饱和的7-羧基取代的摩尔衍生物

    公开(公告)号：US20120135978A1

    公开(公告)日：2012-05-31

    申请号：US13308483

    申请日：2011-11-30

    申请人： Masanao INAGAKI ,  Shin-ichiro Hara ,  Nobuhiro Haga ,  Yoshinori Tamura ,  Yoshihisa Goto ,  Tsuyoshi Hasegawa

    发明人： Masanao INAGAKI ,  Shin-ichiro Hara ,  Nobuhiro Haga ,  Yoshinori Tamura ,  Yoshihisa Goto ,  Tsuyoshi Hasegawa

    IPC分类号： A61K31/485 ,  A61K31/5377 ,  A61K31/506 ,  A61P25/04 ,  A61K31/519 ,  C07D491/18 ,  A61P1/08 ,  A61P1/00 ,  C07D489/08 ,  C07D491/22

    CPC分类号： C07D489/08

    摘要： A novel compound which is useful as an agent for treating and/or preventing emesis, vomiting and/or constipation.A compound represented by the formula (I): wherein R1 and R2 are each independently hydrogen, optionally substituted lower alkyl, optionally substituted lower alkenyl, optionally substituted cycloalkyl, optionally substituted aryl etc., R3 is hydrogen, hydroxy, optionally substituted lower alkyl, optionally substituted lower alkenyl, optionally substituted lower alkynyl, optionally substituted lower alkoxy etc., R4 is hydrogen or lower alkyl, R5 is hydrogen, lower alkyl, cycloalkyl lower alkyl or lower alkenyl, or a pharmaceutically acceptably salt, or a solvate thereof is provided.

    摘要翻译： 可用作治疗和/或预防呕吐，呕吐和/或便秘的药剂的新型化合物。 由式（I）表示的化合物：其中R 1和R 2各自独立地为氢，任选取代的低级烷基，任选取代的低级烯基，任选取代的环烷基，任选取代的芳基等，R 3为氢，羟基，任选取代的低级烷基， 提供任选取代的低级烯基，任选取代的低级炔基，任选取代的低级烷氧基等，R4是氢或低级烷基，R5是氢，低级烷基，环烷基低级烷基或低级烯基，或其药学上可接受的盐或其溶剂化物 。

    Interlayer for laminated glass and laminated glass
    66.
    发明授权
    Interlayer for laminated glass and laminated glass 有权
    夹层玻璃和夹层玻璃夹层

    公开(公告)号：US08012612B2

    公开(公告)日：2011-09-06

    申请号：US11597894

    申请日：2006-01-31

    申请人： Tsuyoshi Hasegawa

    发明人： Tsuyoshi Hasegawa

    IPC分类号： B32B27/14

    CPC分类号： B32B17/10761 ,  B32B17/10339 ,  B32B17/10633 ,  B32B17/10788 ,  Y10T428/3163 ,  Y10T428/31935

    摘要： The present invention provides an interlayer for laminated glass which comprises at least one layer composed of an opaque ethylene-vinyl acetate copolymer resin composition or opaque polyvinyl acetal resin composition, and also provides the laminated glass using such interlayers. The interlayer for laminated glass and the laminated glass according to the present invention can offer excellent privacy protection.

    摘要翻译： 本发明提供一种夹层玻璃的中间层，其包含至少一层由不透明的乙烯 - 乙酸乙烯酯共聚物树脂组合物或不透明的聚乙烯醇缩醛树脂组合物构成的层，并且还使用这种夹层提供夹层玻璃。 根据本发明的层压玻璃和夹层玻璃的中间层可以提供优良的隐私保护。

    Semiconductor package
    67.
    发明授权
    Semiconductor package 有权
    半导体封装

    公开(公告)号：US07911794B2

    公开(公告)日：2011-03-22

    申请号：US12252072

    申请日：2008-10-15

    申请人： Tsuyoshi Hasegawa

    发明人： Tsuyoshi Hasegawa

    IPC分类号： H05K7/20

    CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor package includes a package main body having a base portion and a semiconductor device accommodating portion, electric terminals electrically connected to a semiconductor device in the accommodating portion and exposed to an outer surface, and a high heat transfer element disposed in the base portion to extend from a heat generation site corresponding position corresponding to a heat generating site of the semiconductor device to a position in an outside of the heat generation site corresponding position. The base portion is configured by bringing a plurality of thin plates in close contact with each other to bond them integrally, and the high heat transfer element includes at least one combination of fluid passage formed in the base portion and a heat transfer fluid sealed in the passage, or at least one heat pipe.

    摘要翻译： 半导体封装包括具有基部和半导体器件容纳部的封装主体，电连接到容纳部中的半导体器件并暴露于外表面的电端子，以及设置在基部中的高传热元件 从与半导体装置的发热部位对应的发热部位对应位置延伸到发热部位对应位置的外侧的位置。 通过使多个薄板彼此紧密接合以将它们一体地结合在一起而构成基部，并且高传热元件包括形成在基部中的流体通道和密封在基部中的传热流体的至少一种组合 通道或至少一个热管。

    Semiconductor package
    68.
    发明授权
    Semiconductor package 有权
    半导体封装

    公开(公告)号：US07868450B2

    公开(公告)日：2011-01-11

    申请号：US12186129

    申请日：2008-08-05

    申请人： Seiji Ito ,  Tsuyoshi Hasegawa

    发明人： Seiji Ito ,  Tsuyoshi Hasegawa

    IPC分类号： H01L23/34

    CPC分类号： H01L23/3735 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/3733 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor package includes a base plate having first and second surfaces both facing in opposite directions, and a plurality of anisotropic heat conducting members disposed in the base plate and spaced away from each other. A semiconductor element having a heat generating unit is mounted on the first surface, and the second surface is supported on a supporting member having a thermal conductivity. Each anisotropic heat conducting member has a sheet shape intersecting with the first and second surfaces, and orientates a direction of higher thermal conductivity than the thermal conductivity of the base plate in a direction from the first surface toward the second surface.

    摘要翻译： 半导体封装包括具有面向相反方向的第一表面和第二表面的基板和设置在基板中并彼此间隔开的多个各向异性导热构件。 具有发热单元的半导体元件安装在第一表面上，第二表面被支撑在具有导热性的支撑构件上。 每个各向异性导热构件具有与第一表面和第二表面相交的片状，并且在从第一表面朝向第二表面的方向上定向比基板的热导率高的导热性方向。

    Interference reduction receiving device and method thereof
    69.
    发明授权
    Interference reduction receiving device and method thereof 有权
    干扰减少接收装置及其方法

    公开(公告)号：US07733942B2

    公开(公告)日：2010-06-08

    申请号：US11700099

    申请日：2007-01-31

    申请人： Tsuyoshi Hasegawa

    发明人： Tsuyoshi Hasegawa

    IPC分类号： H04B1/00

    CPC分类号： H04B1/712 ,  H04B1/7103 ,  H04B2201/70707 ,  H04B2201/709727

    摘要： A receiving device and a receiving method enabling the high-speed and high-accuracy interference reducing process are provided. The interference reduction receiving device despreading digital signal at a plurality of timings, multiplying each of the signals after being despread by a weight and combining the signals, comprises an estimation unit estimating channel response vector having, as elements, channel estimation values corresponding to the respective timings based on the digital signal, a quantizing unit quantizing the digital signal in the vicinity of the respective timings, a signal correlation matrix generation unit generating a signal correlation matrix having, as the element, each signal correlation value calculated based on the respective quantized signals, and an weight calculating unit calculating the weight based on the channel response vector and the signal correlation matrix.

    摘要翻译： 提供了能够实现高速和高精度干扰降低处理的接收装置和接收方法。 所述干扰减少接收装置在多个定时解扩数字信号，将每个所述信号进行解扩后乘以权重并组合所述信号，所述估计单元估计信道响应向量，具有作为元素的信道估计值， 基于数字信号的定时，对各定时附近的数字信号进行量化的量化单元，产生信号相关矩阵的信号相关矩阵，该信号相关矩阵具有基于各量化信号计算出的各信号相关值的信号相关矩阵 以及权重计算单元，基于信道响应向量和信号相关矩阵来计算权重。

    MOBILE STATION AND BASE STATION
    70.
    发明申请
    MOBILE STATION AND BASE STATION 有权
    移动台和基地台

    公开(公告)号：US20100009636A1

    公开(公告)日：2010-01-14

    申请号：US12498602

    申请日：2009-07-07

    申请人： Tsuyoshi Hasegawa

    发明人： Tsuyoshi Hasegawa

    IPC分类号： H04B17/00 ,  H04M1/00

    CPC分类号： H04B17/0042 ,  H04B17/309 ,  H04L1/0015 ,  H04L1/06

    摘要： A mobile station provided with first and second antennas with a distance therebetween includes a reception quality measurement unit that measures, when the mobile station moves in a direction from a location of the first antenna toward a location of the second antenna, a reception quality of a radio signal provided by a base station via the second antenna; a notification unit that notifies the base station of the reception quality measured by the reception quality measurement unit; and a reception processing unit that performs a reception process of a radio signal that is transmitted by the base station, which performs adaptive modulation based on the reception quality notified by the reception unit, and is received by the first antenna.

    摘要翻译： 设置有第一和第二天线之间的距离的移动台包括：接收质量测量单元，其在移动台从第一天线的位置朝向第二天线的位置的方向移动时，测量接收质量的接收质量 无线电信号由基站经由第二天线提供; 通知单元，向所述基站通知由所述接收质量测量单元测量的接收质量; 以及接收处理单元，其执行由所述基站发送的无线电信号的接收处理，所述无线电信号基于由所述接收单元通知的接收质量执行自适应调制，并且由所述第一天线接收。