Abstract:
A lighting device for emitting direct light and indirect light, includes a first transparent light panel comprising at least one organic light emitting device, the first transparent light panel emitting direct light and indirect light during operation thereof; and at least a second transparent light panel comprising at least one organic light emitting device, the second transparent light panel emitting direct light and indirect light during operation thereof, the second transparent light panel being positioned so that at least a portion of indirect light emitted from the first transparent light is transmitted through the second transparent light panel and at least a portion of direct light emitted from the second transparent light panel is transmitted through the first transparent light panel, wherein the first transparent light panel is controllable independently from the second transparent light panel to control a ratio of direct light to indirect light emitted by the lighting device. Other aspects are described and claimed.
Abstract:
A first device and methods for manufacturing the first device are provided. The first device may comprise a flexible substrate and at least one organic light emitting device (OLED) disposed over the flexible substrate. The first device may have a flexural rigidity between 10−1 Nm and 10−6 Nm, and the ratio of the critical strain energy release rate to the material density factor for the first device may be greater than 0.05 J m/Kg.
Abstract:
A method of forming microelectronic systems on a flexible substrate includes depositing (typically sequentially) on a first side of the flexible substrate at least one organic thin film layer, at least one electrode and at least one thin film encapsulation layer over the at least one organic thin film layer and the at least one electrode, wherein depositing the at least one organic thin film layer, depositing the at least one electrode and depositing the at least one thin film encapsulation layer each occur under vacuum and wherein no physical contact of the at least one organic thin film layer or the at least one electrode with another solid material occurs prior to depositing the at least one thin film encapsulation layer.
Abstract:
Systems and methods for the design and fabrication of OLEDs, including high-performance large-area OLEDs, are provided. Variously described fabrication processes may be used to deposit and pattern bus lines with a smooth profile and a gradual sidewall transition. Such smooth profiles may, for example, reduce the probability of electrical shorting at the bus lines. Accordingly, in certain circumstances, an insulating layer may no longer be considered essential, and may be optionally avoided altogether. In cases where an insulating layer is not used, further enhancements in the emissive area and shelf life of the device may be achieved as well. According to aspects of the invention, bus lines such as those described herein may be deposited, and patterned, using vapor deposition such as vacuum thermal evaporation (VTE) through a shadow mask, and may avoid multiple photolithography steps. Other vapor deposition systems and methods may include, among others, sputter deposition, e-beam evaporation and chemical vapor deposition (CVD). A final profile of the bus line may substantially correspond to the profile as deposited.
Abstract:
A novel thin film encapsulated OLED panel architecture and a method for making the panels with improved shelf life is disclosed. The OLED panel consists of a plurality of OLED pixels; each OLED pixel is individually hermetically sealed and isolated from its neighboring pixels. The organic stack of the OLED pixel is contained within its own hermetically sealed structure, achieved by making the structure on a barrier coated substrate and using a first barrier material as the grid and a second barrier for encapsulating the entire OLED pixel. The first barrier material provides the edge seal while the second barrier disposed over the pixel provides protection from top down moisture diffusion. By isolating and hermetically sealing individual pixels; any damage such as moisture and oxygen ingress due to defects or particles, delamination, cracking etc. can be effectively contained within the pixel thereby protecting other pixels in the panel.
Abstract:
Devices, components and fabrication methods are provided for improving the efficiency of OLED displays. An outcoupling component such as a microlens array (MLA) is attached to an OLED, with a relatively small distance between the MLA and the OLED. Cross-talk and back scattering are reduced by the use of colored lenses, focusing layers, and other methods.
Abstract:
In some embodiments, a first product is provided. The first product may include a substrate, a device having a device footprint disposed over the substrate, and a barrier film disposed over the substrate and substantially along a side of the device footprint. The barrier film may comprise a mixture of a polymeric material and non-polymeric material. The barrier film may have a perpendicular length that is less than or equal to 3.0 mm from the side of the device footprint.
Abstract:
A method of forming microelectronic systems on a flexible substrate includes depositing a plurality of layers on one side of the flexible substrate. Each of the plurality of layers is deposited from one of a plurality of sources. A vertical projection of a perimeter of each one of the plurality of sources does not intersect the flexible substrate. The flexible substrate is in motion during the depositing the plurality of layers via a roll to roll feed and retrieval system.
Abstract:
A flexible AMOLED display is disclosed including an OLED stack having an anode layer, a cathode layer and an organic light emitting layer between the anode layer and the cathode layer. A backplane includes a substrate, a plurality of bus lines, and a thin film transistor array. A permeation barrier layer is positioned between the OLED stack and the backplane, and a plurality of vias connect the OLED anode layer to the backplane thin film transistor array. In one embodiment, a neutral plane of the AMOLED display crosses the permeation barrier. In one embodiment, the thickness of at least a portion of the bus lines is greater than the thickness of the cathode layer. A method of increasing the flexibility of an AMOLED display is disclosed. A method of assembling a flexible AMOLED display under a processing temperature of less than 200 degrees Celsius is also disclosed.
Abstract:
A flexible AMOLED display is disclosed including an OLED stack having an anode layer, a cathode layer and an organic light emitting layer between the anode layer and the cathode layer. A backplane includes a substrate, a plurality of bus lines, and a thin film transistor array. A permeation barrier layer is positioned between the OLED stack and the backplane, and a plurality of vias connect the OLED anode layer to the backplane thin film transistor array. In one embodiment, a neutral plane of the AMOLED display crosses the permeation barrier. In one embodiment, the thickness of at least a portion of the bus lines is greater than the thickness of the cathode layer. A method of increasing the flexibility of an AMOLED display is disclosed. A method of assembling a flexible AMOLED display under a processing temperature of less than 200 degrees Celsius is also disclosed.