LIGHTING DEVICES INCLUDING TRANSPARENT ORGANIC LIGHT EMITTING DEVICE LIGHT PANELS AND HAVING INDEPENDENT CONTROL OF DIRECT TO INDIRECT LIGHT
    61.
    发明申请
    LIGHTING DEVICES INCLUDING TRANSPARENT ORGANIC LIGHT EMITTING DEVICE LIGHT PANELS AND HAVING INDEPENDENT CONTROL OF DIRECT TO INDIRECT LIGHT 有权
    照明装置,包括透明有机发光装置的轻型面板,并具有直接对间接灯的独立控制

    公开(公告)号:US20140334146A1

    公开(公告)日:2014-11-13

    申请号:US13888844

    申请日:2013-05-07

    Abstract: A lighting device for emitting direct light and indirect light, includes a first transparent light panel comprising at least one organic light emitting device, the first transparent light panel emitting direct light and indirect light during operation thereof; and at least a second transparent light panel comprising at least one organic light emitting device, the second transparent light panel emitting direct light and indirect light during operation thereof, the second transparent light panel being positioned so that at least a portion of indirect light emitted from the first transparent light is transmitted through the second transparent light panel and at least a portion of direct light emitted from the second transparent light panel is transmitted through the first transparent light panel, wherein the first transparent light panel is controllable independently from the second transparent light panel to control a ratio of direct light to indirect light emitted by the lighting device. Other aspects are described and claimed.

    Abstract translation: 用于发射直接光和间接光的照明装置包括:第一透明光板,包括至少一个有机发光器件,第一透明光板在其操作期间发射直射光和间接光; 以及至少第二透明光板,其包括至少一个有机发光器件,所述第二透明光板在其操作期间发射直接光和间接光,所述第二透明光板被定位成使得至少一部分间接光从 第一透明光透射通过第二透明光板,并且从第二透明光板发射的直射光的至少一部分透射通过第一透明光板,其中第一透明光板独立于第二透明光 控制由照明装置发射的直接光与间接光的比例。 描述和要求保护其他方面。

    Flexible Lighting Devices
    62.
    发明申请
    Flexible Lighting Devices 审中-公开
    柔性照明设备

    公开(公告)号:US20140248727A1

    公开(公告)日:2014-09-04

    申请号:US14202430

    申请日:2014-03-10

    Abstract: A first device and methods for manufacturing the first device are provided. The first device may comprise a flexible substrate and at least one organic light emitting device (OLED) disposed over the flexible substrate. The first device may have a flexural rigidity between 10−1 Nm and 10−6 Nm, and the ratio of the critical strain energy release rate to the material density factor for the first device may be greater than 0.05 J m/Kg.

    Abstract translation: 提供了用于制造第一装置的第一装置和方法。 第一器件可以包括柔性衬底和设置在柔性衬底上的至少一个有机发光器件(OLED)。 第一装置可以具有在10-1Nm至10-6Nm之间的弯曲刚度,并且临界应变能释放速率与第一装置的材料密度因子的比可以大于0.05Jm / Kg。

    MANUFACTURING FLEXIBLE ORGANIC ELECTRONIC DEVICES
    63.
    发明申请
    MANUFACTURING FLEXIBLE ORGANIC ELECTRONIC DEVICES 审中-公开
    制造柔性有机电子器件

    公开(公告)号:US20140166989A1

    公开(公告)日:2014-06-19

    申请号:US13716435

    申请日:2012-12-17

    Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing (typically sequentially) on a first side of the flexible substrate at least one organic thin film layer, at least one electrode and at least one thin film encapsulation layer over the at least one organic thin film layer and the at least one electrode, wherein depositing the at least one organic thin film layer, depositing the at least one electrode and depositing the at least one thin film encapsulation layer each occur under vacuum and wherein no physical contact of the at least one organic thin film layer or the at least one electrode with another solid material occurs prior to depositing the at least one thin film encapsulation layer.

    Abstract translation: 在柔性衬底上形成微电子系统的方法包括在柔性衬底的第一侧上沉积(通常顺序地)至少一个有机薄膜层,至少一个电极和至少一个有机薄膜封装层上的至少一个薄膜封装层 薄膜层和所述至少一个电极,其中沉积所述至少一个有机薄膜层,沉积所述至少一个电极并沉积所述至少一个薄膜封装层,每个都在真空下进行,并且其中至少一个 一个有机薄膜层或至少一个具有另一固体材料的电极在沉积至少一个薄膜封装层之前发生。

    PROCESS FOR FABRICATING METAL BUS LINES FOR OLED LIGHTING PANELS
    64.
    发明申请
    PROCESS FOR FABRICATING METAL BUS LINES FOR OLED LIGHTING PANELS 有权
    用于制造OLED照明面板的金属总线的工艺

    公开(公告)号:US20140091282A1

    公开(公告)日:2014-04-03

    申请号:US13788321

    申请日:2013-03-07

    Abstract: Systems and methods for the design and fabrication of OLEDs, including high-performance large-area OLEDs, are provided. Variously described fabrication processes may be used to deposit and pattern bus lines with a smooth profile and a gradual sidewall transition. Such smooth profiles may, for example, reduce the probability of electrical shorting at the bus lines. Accordingly, in certain circumstances, an insulating layer may no longer be considered essential, and may be optionally avoided altogether. In cases where an insulating layer is not used, further enhancements in the emissive area and shelf life of the device may be achieved as well. According to aspects of the invention, bus lines such as those described herein may be deposited, and patterned, using vapor deposition such as vacuum thermal evaporation (VTE) through a shadow mask, and may avoid multiple photolithography steps. Other vapor deposition systems and methods may include, among others, sputter deposition, e-beam evaporation and chemical vapor deposition (CVD). A final profile of the bus line may substantially correspond to the profile as deposited.

    Abstract translation: 提供了用于设计和制造OLED的系统和方法,包括高性能大面积OLED。 可以使用各种描述的制造工艺来沉积和模拟具有平滑轮廓和逐渐侧壁转变的总线。 这样的平滑轮廓可以例如降低在总线线路处短路的可能性。 因此,在某些情况下,绝缘层可能不再被认为是必要的,并且可以完全可选地避免。 在不使用绝缘层的情况下,也可以实现装置的发射面积和保存期限的进一步增强。 根据本发明的方面,可以使用诸如真空热蒸发(VTE)之类的气相沉积通过荫罩来沉积和图案化这样描述的总线,并且可以避免多个光刻步骤。 其他气相沉积系统和方法可以包括溅射沉积,电子束蒸发和化学气相沉积(CVD)。 总线的最终配置文件可以基本上对应于保存的配置文件。

    Edge barrier film for electronic devices

    公开(公告)号:US11075357B2

    公开(公告)日:2021-07-27

    申请号:US15899651

    申请日:2018-02-20

    Abstract: In some embodiments, a first product is provided. The first product may include a substrate, a device having a device footprint disposed over the substrate, and a barrier film disposed over the substrate and substantially along a side of the device footprint. The barrier film may comprise a mixture of a polymeric material and non-polymeric material. The barrier film may have a perpendicular length that is less than or equal to 3.0 mm from the side of the device footprint.

    Method of increasing the flexibility of an AMOLDED display, a flexible display, and a product

    公开(公告)号:US10811633B2

    公开(公告)日:2020-10-20

    申请号:US16693508

    申请日:2019-11-25

    Abstract: A flexible AMOLED display is disclosed including an OLED stack having an anode layer, a cathode layer and an organic light emitting layer between the anode layer and the cathode layer. A backplane includes a substrate, a plurality of bus lines, and a thin film transistor array. A permeation barrier layer is positioned between the OLED stack and the backplane, and a plurality of vias connect the OLED anode layer to the backplane thin film transistor array. In one embodiment, a neutral plane of the AMOLED display crosses the permeation barrier. In one embodiment, the thickness of at least a portion of the bus lines is greater than the thickness of the cathode layer. A method of increasing the flexibility of an AMOLED display is disclosed. A method of assembling a flexible AMOLED display under a processing temperature of less than 200 degrees Celsius is also disclosed.

    Flexible AMOLED Display
    70.
    发明申请

    公开(公告)号:US20200161584A1

    公开(公告)日:2020-05-21

    申请号:US16693508

    申请日:2019-11-25

    Abstract: A flexible AMOLED display is disclosed including an OLED stack having an anode layer, a cathode layer and an organic light emitting layer between the anode layer and the cathode layer. A backplane includes a substrate, a plurality of bus lines, and a thin film transistor array. A permeation barrier layer is positioned between the OLED stack and the backplane, and a plurality of vias connect the OLED anode layer to the backplane thin film transistor array. In one embodiment, a neutral plane of the AMOLED display crosses the permeation barrier. In one embodiment, the thickness of at least a portion of the bus lines is greater than the thickness of the cathode layer. A method of increasing the flexibility of an AMOLED display is disclosed. A method of assembling a flexible AMOLED display under a processing temperature of less than 200 degrees Celsius is also disclosed.

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