公开(公告)号：US20030106494A1

公开(公告)日：2003-06-12

申请号：US10246627

申请日：2002-09-19

Inventor： Seung-Woo Lee ,  Min-Gyoo Lim

IPC: B05C011/00 ,  C23C016/00 ,  G01M003/02 ,  B01D047/00

CPC classification number: C23C16/52 ,  C23C16/4401

Abstract: A gas supplying apparatus of a system for fabricating semiconductor devices is tested for clogs. The gas supplying apparatus includes a carrier gas supplying device for supplying at least one carrier gas, and a plurality of reactive gas supplying devices connected in parallel to the carrier gas supplying device. The reactive gas supplying devices gasify the reactive gas carried by the carrier gas. A wafer, on which a desired layer is to be formed, is situated in a process chamber into which the reactive gas is supplied from the reactive gas supplying devices. The gas supplying apparatus also includes pressure detecing devices for detecting the pressure of the carrier gas near each of the reactive gas supplying devices. The carrier gas is supplied under a predetermined pressure to the reactive gas supplying devices. The reactive gas supplying device to be tested for clogs is rendered operational while the other reactive gas supplying devices are shut down. The pressure of the carrier gas near an outlet of the carrier gas supplying device is compared to the pressure of the carrier gas near an inlet of the reactive gas supplying device being tested to determine if the device is clogged.

Abstract translation: 测试用于制造半导体器件的系统的气体供应装置的堵塞。 气体供给装置包括用于供给至少一种载气的载气供给装置和与载气供给装置并联连接的多个反应气体供给装置。 反应气体供给装置气化由载气携带的反应性气体。 要在其上形成所需层的晶片位于处理室中，从反应气体供应装置供应反应气体。 气体供给装置还包括用于检测每个反应气体供给装置附近的载气的压力的压力检测装置。 将载气以预定压力供给到反应气体供给装置。 待测试堵塞的反应气体供给装置在其他反应气体供给装置被关闭的状态下工作。 将载气供给装置的出口附近的载气的压力与被测试的反应气体供给装置的入口附近的载气的压力进行比较，以确定装置是否堵塞。

公开(公告)号：US20030097983A1

公开(公告)日：2003-05-29

申请号：US10298932

申请日：2002-11-19

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takahiro Kitano ,  Norihisa Koga ,  Toshichika Takei ,  Yoshiyuki Kawafuchi

IPC: B05C011/00

CPC classification number: H01L21/6715 ,  B05B13/041 ,  B05C5/0208 ,  B05C11/1013

Abstract: A substrate is horizontally held by a substrate holding portion freely movable in the Y-direction, and a nozzle portion is provided above and opposing the substrate, and movable in X-direction corresponding to the coating liquid feeding region of the substrate. A discharge opening is formed at a lower end of the nozzle portion, and a channel connecting the discharge opening with a coating liquid feed tube coupled to an upper end of the nozzle portion is formed within the discharge opening. At the midstream of the channel, a liquid pool portion larger in diameter than the discharge opening is formed, the inside of which is provided with a filtering member formed by porous bodies blocking the channel. The filtering member forms a pressure loss portion, which absorbs pulsation occurring at the coating liquid feed tube before it reaches the discharge opening.

Abstract translation: 基板由能够沿Y方向自由移动的基板保持部水平保持，并且在基板的上方并且与基板相对设置有喷嘴部，并且能够在与基板的涂布液供给区域对应的X方向上移动。 在喷嘴部的下端形成有排出口，在喷出口内形成有将排出口与与喷嘴部的上端连结的涂液供给管连结的流路。 在通道的中部，形成直径大于排出口的液体池部分，其内部设置有由堵塞通道的多孔体形成的过滤构件。 过滤构件形成压力损失部分，其在到达排出口之前吸收在涂液供给管处发生的脉动。

公开(公告)号：US20030061989A1

公开(公告)日：2003-04-03

申请号：US10231073

申请日：2002-08-30

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Masaki Kamimura ,  Takashi Nakao

IPC: B05C011/00 ,  C23C016/00

CPC classification number: H01L21/67253 ,  C23C16/46 ,  C23C16/52 ,  H01L21/67248

Abstract: A semiconductor device manufacturing system is disclosed, which comprises a film forming device including a film forming chamber and a heater, the film forming chamber configured to accommodate a substrate and form a film on the substrate, the heater configured to heat the substrate, a temperature controller including a temperature detector and a heater controller, the temperature detector configured to detect a temperature of at least one of inside and outside the film forming chamber, the heater controller configured to control the heater to heat the substrate at a predetermined temperature according to the temperature detected by the temperature detector, and a system controller including a film formation end time determining device configured to determine an end time of the film formation, before the temperature detected by the temperature detector is substantially constant and after the substrate is heated by the heater.

Abstract translation: 公开了一种半导体器件制造系统，其包括：成膜装置，其包括成膜室和加热器，所述成膜室被配置为容纳衬底并在所述衬底上形成膜，所述加热器构造成加热所述衬底，温度 控制器，其包括温度检测器和加热器控制器，所述温度检测器被配置为检测成膜室内部和外部中的至少一个的温度，所述加热器控制器被配置为控制加热器以根据 由温度检测器检测的温度，以及包括成膜结束时间确定装置的系统控制器，其被配置为在由温度检测器检测到的温度基本上恒定之前以及在基板被加热器加热之后确定成膜的结束时间 。

公开(公告)号：US20030047135A1

公开(公告)日：2003-03-13

申请号：US10216009

申请日：2002-08-09

Inventor： Markku Kansakoski ,  Markku Mantyla ,  Jussi Tenhunen

IPC: B05C011/00

CPC classification number: G01N21/3563 ,  G01N21/359 ,  G01N2021/8427

Abstract: The invention relates to a method and an apparatus for measuring a coating from paper or board. The measurement is carried out by one detector at different times or by two detectors simultaneously. IR radiation directed at the coating and radiation emerging from the coating are chopped synchronously in blocks. A wavelength band sensitive and insensitive to the absorption are bandpass filtered and measured in both the MIR and NIR region. The absorption strength is measured in a digital signal processing block by comparing the radiation sensitive to absorption to the radiation insensitive to absorption, and the amount of each coating component is determined in the digital signal processing block on the basis of the absorption strength.

Abstract translation: 本发明涉及一种用于从纸或纸板测量涂层的方法和装置。 测量由不同时间的一个检测器或两个检测器同时进行。 针对涂层的IR辐射和从涂层出射的辐射以块状同步切碎。 敏感且对吸收不敏感的波长带在MIR和NIR区域进行带通滤波和测量。 通过将对吸收敏感的辐射与对吸收不敏感的辐射进行比较，在数字信号处理块中测量吸收强度，并且基于吸收强度在数字信号处理块中确定每个涂层组分的量。

公开(公告)号：US20030044220A1

公开(公告)日：2003-03-06

申请号：US10273065

申请日：2002-10-17

Inventor： John Vito

IPC: B05C011/00

CPC classification number: A47L1/08 ,  B05B11/00 ,  B05B11/0005 ,  B05B11/3057

Abstract: A squeegee with squeegee handle and remote spraying device, includes a squeegee section having an enclosed container for holding liquid, a sprayer head, which is in connection with the squeegee section, and a surface extending in a lengthwise direction. The enclosed container has a threaded neck. The sprayer head has a threaded cap adapted for engaging the threaded neck, as well as a dispensing means for dispensing the liquid. The dispensing means includes a trigger being in connection with a conduit, a nozzle at an end of the sprayer head, and pressure inducing means for inducing a pressure change in the conduit so as to draw spraying agent into the conduit and out of the nozzle. The conduit extends through the threaded cap and into the enclosed container. There is also a squeegee blade attached to the sprayer head and being nearly perpendicular to the surface of said enclosed container. In preferred embodiments, an extended handle further includes a plurality of sections in which each section extends to allow for longer reaching range.

Abstract translation: 具有刮墨手柄和远程喷涂装置的刮板包括具有用于保持液体的封闭容器的刮板部分，与刮板部分连接的喷头，以及沿长度方向延伸的表面。 封闭的容器具有螺纹颈部。 喷雾头具有适于接合螺纹颈部的螺纹盖以及用于分配液体的分配装置。 分配装置包括与导管连接的触发器，在喷雾器头部的端部处的喷嘴以及用于在导管中引起压力变化的压力引导装置，以便将喷涂剂吸入导管并从喷嘴出来。 导管延伸穿过螺纹盖并进入封闭的容器。 还有一个连接在喷雾头上并且几乎垂直于所述封闭容器表面的刮刀。 在优选实施例中，延伸手柄还包括多个部分，其中每个部分延伸以允许更长的到达范围。

公开(公告)号：US20030019427A1

公开(公告)日：2003-01-30

申请号：US09912495

申请日：2001-07-24

Applicant: Applied Materials, Inc.

Inventor： Steve Ghanayem ,  Daniel A. Carl ,  John T. Boland ,  Cary Ching ,  Zheng Yuan

IPC: B05C011/00

CPC classification number: H01L21/02129 ,  C23C16/401 ,  H01L21/02271 ,  H01L21/02337 ,  H01L21/02362 ,  H01L21/31051 ,  H01L21/31625

Abstract: A method and apparatus for forming an in situ stabilized high concentration borophosphosilicate glass film on a semiconductor wafer or substrate. In an embodiment, the method starts by providing the substrate into a chamber. The method continues by providing a silicon source, an oxygen source, a boron source and a phosphorous source into the chamber to form a high concentration borophosphosilicate glass layer on the substrate. The method further includes reflowing the high concentration borophosphosilicate glass layer formed on the substrate.

Abstract translation: 一种用于在半导体晶片或衬底上形成原位稳定化的高浓度硼磷硅酸盐玻璃膜的方法和装置。 在一个实施例中，该方法通过将衬底提供到腔室中而开始。 该方法通过将硅源，氧源，硼源和磷源提供到室中以在衬底上形成高浓度硼磷硅酸盐玻璃层来继续。 该方法还包括回流形成在基底上的高浓度硼磷硅酸盐玻璃层。

公开(公告)号：US20030010286A1

公开(公告)日：2003-01-16

申请号：US10233746

申请日：2002-09-03

Inventor： Thomas Nowak ,  Jules Gordon ,  Kevin Avery ,  David Thurlow

IPC: B05C011/00

CPC classification number: H01L21/67126 ,  B29C39/10 ,  B29C39/24 ,  B29C39/42

Abstract: The present invention provides a method and apparatus for dispensing materials onto a substrate. In one embodiment, a dispensing system includes a controller, a vacuum source in electrical communication with the controller, the vacuum source applying a vacuum to at least a portion of the substrate in response to an instruction from the controller, an injector in electrical communication with the controller, the injector comprising a valve in communication with a pressure source and a material port in communication with a material source, the valve permitting material from the material source to be dispensed onto a substrate in accordance with an instruction from the controller. In one embodiment, the dispensing system also includes a trap in communication with the vacuum source, where the trap substantially prevents excessive material dispensed by the injector from contacting the vacuum source.

公开(公告)号：US20030003607A1

公开(公告)日：2003-01-02

申请号：US09946503

申请日：2001-09-06

Inventor： Akira Kagoshima ,  Hideyuki Yamamoto ,  Shoji Ikuhara ,  Toshio Masuda ,  Hiroyuki Kitsunai ,  Junichi Tanaka ,  Natsuyo Morioka ,  Kenji Tamaki

IPC: H01L021/66 ,  G01R031/26 ,  B05C011/00

CPC classification number: H01L22/20 ,  G05B19/41875 ,  G05B2219/45031 ,  H01J37/32935 ,  H01L22/26 ,  Y02P90/20 ,  Y02P90/22

Abstract: A plasma processing control system and method which can suppress influences caused by disturbances. The control system includes a plasma processor for performing processing operation over a sample accommodated within a vacuum processing chamber, a sensor for monitoring process parameters during processing operation of the plasma processor, a processed-result estimation model for estimating a processed result on the basis of a monitored output of the sensor and a preset processed-result prediction equation, and an optimum recipe calculation model for calculating correction values of processing conditions on the basis of an estimated result of the processed-result estimation model in such a manner that the processed result becomes a target value. The plasma processor is controlled on the basis of a recipe generated by the optimum recipe calculation model.

Abstract translation: 一种可以抑制由干扰引起的影响的等离子体处理控制系统和方法。 控制系统包括：等离子体处理器，用于对容纳在真空处理室内的样品执行处理操作，用于在等离子体处理器的处理操作期间监视处理参数的传感器，用于基于等离子体处理器估计处理结果的处理结果估计模型 传感器的监视输出和预设处理结果预测方程，以及用于基于处理结果估计模型的估计结果计算处理条件的校正值的最佳配方计算模型，使得处理结果 成为目标值。 基于由最佳配方计算模型生成的配方来控制等离子体处理器。

公开(公告)号：US20020166504A1

公开(公告)日：2002-11-14

申请号：US10029165

申请日：2001-12-20

Inventor： Cheol Joon Yoo

IPC: B05C011/00

CPC classification number: H01L21/67051 ,  B08B1/00 ,  B29C45/14655 ,  B29C45/1753 ,  H01L21/67046

Abstract: An apparatus for cleaning a mold die set includes a pair of brushes, a pair of vacuum holes, and multiple nozzles. One of the brushes is positioned to scrub a first surface of the mold die set, and the other of the brushes is positioned to scrub a second surface of the mold die set to separate a residue from the first and second surfaces of the mold die set. The vacuum holes receives the separated residue from the first and second surfaces of the mold die set, and through the nozzles, a parting compound is provided to coat the first and second surfaces of the mold die set. The apparatus further includes multiple air holes through which air is blown to the first and second surfaces of the mold die set. An apparatus for semiconductor manufacturing includes a mold die set having a first surface and a second surface and a mold die set cleaner that can remove a residue from the first and second surfaces of the mold die set and coat a parting compound on the first and second surfaces.

Abstract translation: 用于清洁模具模具的装置包括一对刷子，一对真空孔和多个喷嘴。 刷子中的一个定位成擦拭模具模具的第一表面，并且另一个刷子被定位成擦拭模具模具的第二表面，以将残留物与模具模具的第一和第二表面分离 。 真空孔从模具模具的第一和第二表面接收分离的残留物，并且通过喷嘴，提供分开化合物以涂覆模具模具的第一和第二表面。 该装置还包括多个气孔，空气通过该空气吹送到模具模具的第一和第二表面。 一种用于半导体制造的设备包括具有第一表面和第二表面的模具模具和模具模具清洁器，其可以从模具模具的第一和第二表面去除残留物并在第一和第二表面上涂覆分离化合物 表面。

公开(公告)号：US20020157606A1

公开(公告)日：2002-10-31

申请号：US09890535

申请日：2001-07-30

Inventor： Lutz Kampmann

IPC: B05C011/00

CPC classification number: C23C14/505 ,  C23C14/564

Abstract: In an apparatus (S) for coating bottles (F), comprising a coating station (A) which contains at least one section of a conveyor track (G) for bottle conveying bodies (T), comprising a bottle holder (H) in each conveying body (T), comprising covering elements (E) which are associated with the conveying bodies and which can be moved between passive and covering positions, and comprising a bottle detector (P) which cooperates with a covering element displacement apparatus (V), the covering elements (E) are disposed directly on the conveying bodies (T) and are aligned towards the bottle holders (H).

Abstract translation: 在用于涂布瓶（F）的装置（S）中，包括涂覆站（A），其包含用于瓶子输送体（T）的输送轨道（G）的至少一个部分，每个部分包括每个 输送体（T），其包括与输送体相关联并且可以在被动和覆盖位置之间移动的覆盖元件（E），并且包括与覆盖元件位移设备（V）配合的瓶检测器（P） 覆盖元件（E）直接设置在输送体（T）上并朝向瓶子保持架（H）对准。