Abstract:
Methods and systems are described for enabling display system data transmission during use. An integrated circuit package includes input interface circuitry configured to receive an audio-video data stream having a video signal and timing information and timing extraction circuitry that can identify blanking patterns for the video signal. The package includes input processing circuitry for receiving audio-video signal and converting the audio-video data stream input into a low voltage differential signal (LVDS). The package includes a timing controller having timing extraction circuitry, a set of symbol buffers, a scheduler, and timing control circuitry. All configured to implement LVDS data transfer and in some implementation enable point to point data transfer from data buffers to associated column drivers.
Abstract:
This invention relates to switching power saving modes and rescheduling communication frames for various periods of a beacon interval (BI) defined under WGA Draft Specification 0.8 for the personal basic service set (PBSS) and infrastructure BSS to achieve further power savings and other advantages. Stations can be awake during a contention-based period (CBP) if it is in active state and can schedule frames during a service period (SP) to allow the assigned receiver to transmit to the assigned initiator. Stations in a group can schedule a group address frame to be sent during the CBP and group SP of a specific periodic BI. Stations in peer-to-peer connection may directly notify its peer stations of its power saving mode and wakeup schedule. Stations of an infrastructure basic service set (BSS) can also use the same power saving mechanism as stations of a PBSS noting a difference where each BI will be an access point's (AP's) awake BI.
Abstract:
Despite improvements in FinFETs and strained silicon devices, transistors continue to suffer performance degradation as device dimensions shrink. These include, in particular, leakage of charge between the semiconducting channel and the substrate. An isolated channel FinFET device prevents channel-to-substrate leakage by inserting an insulating layer between the channel (fin) and the substrate. The insulating layer isolates the fin from the substrate both physically and electrically. To form the isolated FinFET device, an array of bi-layer fins can be grown epitaxially from the silicon surface, between nitride columns that provide localized insulation between adjacent fins. Then, the lower fin layer can be removed, while leaving the upper fin layer, thus yielding an interdigitated array of nitride columns and semiconducting fins suspended above the silicon surface. A resulting gap underneath the upper fin layer can then be filled in with oxide to isolate the array of fin channels from the substrate.
Abstract:
Despite improvements in FinFETs and strained silicon devices, transistors continue to suffer performance degradation as device dimensions shrink. These include, in particular, leakage of charge between the semiconducting channel and the substrate. An isolated channel FinFET device prevents channel-to-substrate leakage by inserting an insulating layer between the channel (fin) and the substrate. The insulating layer isolates the fin from the substrate both physically and electrically. To form the isolated FinFET device, an array of bi-layer fins can be grown epitaxially from the silicon surface, between nitride columns that provide localized insulation between adjacent fins. Then, the lower fin layer can be removed, while leaving the upper fin layer, thus yielding an interdigitated array of nitride columns and semiconducting fins suspended above the silicon surface. A resulting gap underneath the upper fin layer can then be filled in with oxide to isolate the array of fin channels from the substrate.
Abstract:
An integrated circuit is configured for controlling automobile door lock motors. The circuit includes half-bridge driver circuits, with each half-bridge driver circuit having an output node configured to be coupled to a door lock motor. A control circuit is configured to control driver operation of the half-bridge driver circuits. A current regulator circuit senses current sourced by or sunk by at least one of the half-bridge circuits. The control circuit responds to the current regulator circuit and the sensed current by controlling the driver operation to provide for a regulated current to be sourced by or sunk by said half-bridge circuit. The control circuit further controls the half-bridge driver circuits to enter a tri-state mode in order to support the making of BEMF measurements on the motor.
Abstract:
Disclosed herein is a microfluidic jetting device having a piezoelectric member positioned above a displaceable membrane. A voltage is applied across the piezoelectric member causing deformation of the piezoelectric member. The deformation of the piezoelectric member results in a displacement of the membrane, which is formed above a cavity. Displacement of the membrane creates pressure to jet or eject liquid from the cavity and suction liquid into the cavity through ports or apertures formed in the in membrane.
Abstract:
A semiconductor device having a gate positioned in a recess between the source region and a drain region that are adjacent either side of the gate electrode. A channel region is below a majority of the source region as well as a majority of the drain region and the entire gate electrode.
Abstract:
A graded SiGe sacrificial layer is epitaxially grown overlying a silicon substrate. A single crystal silicon layer is then grown by an epitaxial process overlying the graded SiGe layer. A SiGe layer is next grown by an epitaxial process as a single crystal layer overlying the silicon layer. A subsequent silicon layer, which becomes the active silicon layer for the transistors, is epitaxially grown overlying the second silicon germanium layer. Together the epitaxially grown Si, SiGe and Si layers form a laminate semiconductor structure. A MOS transistor is then formed on the active area of the single crystal silicon. The graded SiGe sacrificial layer is removed by an etch process to electrically isolate the laminate semiconductor structure from the substrate.
Abstract:
A dryer having an improved automatic dryness detection circuit is provided. Wet clothing in the dryer bin contacts a sensor and causes a pulse to be sent to a microcontroller if the resistance of the clothes is low enough. The microcontroller disregards pulses which are shorter than a threshold time and counts pulses which are longer than a threshold time. The microcontroller issues a termination signal if the rate of pulses is lower than a threshold rate.
Abstract:
A frequency-domain upmix process uses vector-based signal decomposition and methods for improving the selectivity of center channel extraction. The upmix processes described do not perform an explicit primary/ambient decomposition. This reduces the complexity and improves the quality of the center channel derivation. A method of upmixing a two-channel stereo signal to a three-channel signal is described. A left input vector and a right input vector are added to arrive at a sum magnitude. Similarly, the difference between the left input vector and the right input vector is determined to arrive at a difference magnitude. The difference between the sum magnitude and the difference magnitude is scaled to compute a center channel magnitude estimate, and this estimate is used to calculate a center output vector. A left output vector and a right output vector are computed. The method is completed by outputting the left output vector, the center output vector, and the right output vector.