公开(公告)号：US20190382260A1

公开(公告)日：2019-12-19

申请号：US16433357

申请日：2019-06-06

Applicant: Innovative Micro Technology

Inventor： Jeffery F. SUMMERS

IPC: B81C1/00 ,  B32B7/12 ,  B32B18/00 ,  B32B37/12 ,  B81B7/00

Abstract: The invention is directed to an inexpensive method for bonding two wafers. The method uses an adhesive material disposed between two handling sheets and stamped with a plurality of through holes. The through holes are registered with the locations of devices formed on a substrate. The adhesive material is placed between to two substrates, around the devices, and cured.

公开(公告)号：US10388468B2

公开(公告)日：2019-08-20

申请号：US15355608

申请日：2016-11-18

Applicant: Innovative Micro Technology

Inventor： Suresh Sampath ,  Christopher S. Gudeman

IPC: H01H1/00 ,  B81C1/00

Abstract: A method for forming electrical contacts on a semiconductor substrate is disclosed. The method includes forming a first metal layer over the substrate, and forming a layer of a second metal oxide by sputter deposition of a second metal in an oxygen environment. In some embodiments, the second metal oxide may be ruthenium dioxide, and the first metal layer may be gold, copper, platinum, silver or aluminum.

公开(公告)号：US20180166850A1

公开(公告)日：2018-06-14

申请号：US15894170

申请日：2018-02-12

Applicant: Innovative Micro Technology

Inventor： Christopher S. GUDEMAN

IPC: H01S5/02 ,  B81B7/00 ,  B81C1/00 ,  H01S5/022 ,  H04J14/02 ,  H04B10/40 ,  H01S5/00 ,  H01S5/40

CPC classification number: H01S5/0206 ,  B81B7/0067 ,  B81C1/00301 ,  H01S5/0064 ,  H01S5/02216 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/02292 ,  H01S5/02296 ,  H01S5/4025 ,  H01S5/4087 ,  H04B10/40 ,  H04J14/02

Abstract: A microfabricated optical apparatus that includes a light source driven by a waveform, wherein the waveform is delivered to the light source by at least one through silicon via. The microfabricated optical apparatus may also include a light-sensitive receiver which generates an electrical signal in response to an optical signal. The electrical signal may be communicated to external devices by at least one additional through silicon via, and the signals routed to the encapsulated devices by metal traces. The vias may couple a ground plane to a metal trace layer at intervals, effectively quashing the ability of the bondline to interfere with the absorbed or radiated signal frequency.

公开(公告)号：US20150183200A1

公开(公告)日：2015-07-02

申请号：US14142712

申请日：2013-12-27

Applicant: Innovative Micro Technology

Inventor： Benedikt ZEYEN ,  Jeffery F. SUMMERS

IPC: B32B37/12 ,  B32B38/00 ,  B32B37/18

CPC classification number: B81B1/00 ,  B32B37/0084 ,  B32B2037/1269 ,  B81B7/00 ,  B81C1/00269 ,  B81C2203/019 ,  Y10T428/13 ,  Y10T428/24851 ,  Y10T428/24975 ,  Y10T428/31536

Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.

Abstract translation: 公开了可以在两个光学透明基板之间形成阳极导电结合的接合技术。 阳极键可以伴随有金属合金，焊料，共晶和聚合物键。 第一阳极键可以提供诸如气密性的一个属性，而第二键可以提供另一个属性，例如导电性。