-
公开(公告)号：US09608731B2
公开(公告)日：2017-03-28
申请号：US14931883
申请日：2015-11-04
IPC分类号： H04B10/516 , H01S5/022 , G02B27/09 , H01S5/00 , H01S5/40
CPC分类号： H04B10/516 , B81B7/0067 , B81C1/00301 , G02B27/0955 , H01S5/0064 , H01S5/021 , H01S5/02216 , H01S5/02248 , H01S5/02288 , H01S5/02292 , H01S5/02296 , H01S5/0607 , H01S5/4025 , H01S5/4031
摘要： A microfabricated optical apparatus that includes a light source driven by a waveform, a turning mirror, and a beam shaping element, wherein the waveform is delivered to the light source by at least one through silicon via.
-
公开(公告)号：US10388468B2
公开(公告)日：2019-08-20
申请号：US15355608
申请日：2016-11-18
摘要： A method for forming electrical contacts on a semiconductor substrate is disclosed. The method includes forming a first metal layer over the substrate, and forming a layer of a second metal oxide by sputter deposition of a second metal in an oxygen environment. In some embodiments, the second metal oxide may be ruthenium dioxide, and the first metal layer may be gold, copper, platinum, silver or aluminum.
-
公开(公告)号：US11309837B2
公开(公告)日：2022-04-19
申请号：US17035896
申请日：2020-09-29
摘要： Systems and methods for forming a mm wave resonant filter include a lithographically fabricated high Q resonant structure. The resonant structure may include a plurality of cavities, each cavity having a characteristic frequency that defines its passband. A filter may include a plurality of resonant structures, and each resonant structure may include a plurality of cavities. These cavities and filters may be fabricated lithographically.
-
公开(公告)号：US10826153B2
公开(公告)日：2020-11-03
申请号：US16261489
申请日：2019-01-29
摘要： Systems and methods for forming a mm wave resonant filter include a lithographically fabricated high Q resonant structure. The resonant structure may include a plurality of cavities, each cavity having a characteristic frequency that defines its passband. A filter may include a plurality of resonant structures, and each resonant structure may include a plurality of cavities. These cavities and filters may be fabricated lithographically.
-
公开(公告)号：US10302871B2
公开(公告)日：2019-05-28
申请号：US15974516
申请日：2018-05-08
摘要： Described here is a platform for supporting a fiber optic cable. The platform may be made on a silicon wafer using silicon lithographic processing techniques. The platform may include a substrate having a top planar surface; a trench formed in the substrate in the top planar surface and dimensioned to accept a fiber optic cable carrying radiation; and a reflecting surface formed in the top planar surface, wherein this reflecting surface is configured to reflect the radiation by total internal reflection, wherein the reflecting surface is configured to direct radiation travelling in a first direction into a second direction, substantially orthogonal to the first direction.
-
公开(公告)号：US10050409B2
公开(公告)日：2018-08-14
申请号：US15894170
申请日：2018-02-12
IPC分类号： H04B10/00 , H01S5/02 , B81B7/00 , B81C1/00 , H01S5/022 , H01S5/40 , H04J14/02 , H04B10/40 , H01S5/00 , H04J14/00
CPC分类号： H01S5/0206 , B81B7/0067 , B81C1/00301 , H01S5/0064 , H01S5/02216 , H01S5/02248 , H01S5/02284 , H01S5/02288 , H01S5/02292 , H01S5/02296 , H01S5/4025 , H01S5/4087 , H04B10/40 , H04B10/506 , H04J14/02
摘要： A microfabricated optical apparatus that includes a light source driven by a waveform, wherein the waveform is delivered to the light source by at least one through silicon via. The microfabricated optical apparatus may also include a light-sensitive receiver which generates an electrical signal in response to an optical signal. The electrical signal may be communicated to external devices by at least one additional through silicon via, and the signals routed to the encapsulated devices by metal traces. The vias may couple a ground plane to a metal trace layer at intervals, effectively quashing the ability of the bondline to interfere with the absorbed or radiated signal frequency.
-
公开(公告)号：US09953787B2
公开(公告)日：2018-04-24
申请号：US15060630
申请日：2016-03-04
CPC分类号： H01H59/0009 , B81B7/00 , B81B2201/012 , B81C1/00341 , H01H49/00 , H01H2001/0084
摘要： Systems and methods for forming an electrostatic MEMS switch include forming a movable cantilevered beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate. The cantilevered beam may be formed by etching the perimeter shape in the device layer of an SOI substrate. An additional void may be formed in the movable beam such that it bends about an additional hinge line as a result of the additional void. This may give the beam and switch advantageous kinematic characteristics.
-
公开(公告)号：US20150069618A1
公开(公告)日：2015-03-12
申请号：US13987871
申请日：2013-09-11
CPC分类号： H01L21/486 , B81B7/007 , B81B2207/095 , B81B2207/096 , B81C1/00095 , H01L21/76898 , H01L23/481 , H01L31/02167 , H01L31/03529 , H01L31/052 , H01L31/068 , H01L2924/0002 , Y02E10/547 , H01L2924/00
摘要： A method for forming through substrate vias (TSVs) in a non-conducting, glass substrate is disclosed. The method involves patterning a silicon template substrate with a plurality of lands and spaces, bonding a slab or wafer of glass to the template substrate, and melting the glass so that it flows into the spaces formed in the template substrate. The template substrate may then be removed to leave a plurality of TSVs in the glass slab or wafer.
摘要翻译： 公开了一种用于在非导电玻璃基板中形成贯穿衬底通孔（TSV）的方法。 该方法包括用多个焊盘和间隔图案化硅模板衬底，将玻璃板或玻璃晶片粘合到模板衬底上，并使玻璃熔化，使其流入模板衬底中形成的空间。 然后可以移除模板衬底以在玻璃板或晶片中留下多个TSV。
-
公开(公告)号：US11305982B2
公开(公告)日：2022-04-19
申请号：US16515943
申请日：2019-07-18
发明人： Christopher S. Gudeman , Paul Rubel
摘要： Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. A two-fold symmetric switch may be formed by a primary, secondary, and optionally tertiary set of voids formed in the movable plate. These voids may define the spring beams which provide a stable and reliable restoring force to the switch.
-
公开(公告)号：US10804850B2
公开(公告)日：2020-10-13
申请号：US16104146
申请日：2018-08-17
摘要： Systems and methods for forming a compact gas sensor include using a lithographically fabricated high Q resonator coupled to at least one of a Gunn diode and an IMPATT diode. The resonator may include a plurality of cavities filled with a sample gas. A detector coupled to the resonator may measure the amplitude of the emitted mm wave radiation.
-
-
-
-
-
-
-
-
-
搜索结果
16 条记录 (耗时 0.031 秒)
