公开(公告)号：US20050132798A1

公开(公告)日：2005-06-23

申请号：US11002241

申请日：2004-12-03

Applicant: Moon-chul Lee ,  Hyung Choi ,  Seok-jin Kang

Inventor： Moon-chul Lee ,  Hyung Choi ,  Seok-jin Kang

IPC: G01C19/56 ,  B81B3/00 ,  B81C1/00 ,  G01C19/5783 ,  H01R13/52 ,  G01P15/14

CPC classification number: G01C19/5769 ,  B81B3/0035 ,  B81B2201/0242 ,  B81C1/00579 ,  B81C1/0092 ,  B81C1/00936 ,  H01R13/52 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T74/12 ,  Y10T74/1229

Abstract: Method for fabricating a gyroscope including: fabricating a SMS wafer where a first wafer, a metal film, and a second wafer are sequentially stacked; forming a cantilever or a bridge shaped-structure on the relevant portion of the first wafer through the photolithography process; attaching to the surface of the first wafer, a first cap made of glass and having a predetermined space for sealing the movable structure in a vacuum state; separating and removing the metal film and the second wafer from the first wafer; and attaching to the backside of the first wafer, the second cap which is structurally and materially symmetric to the first cap. The SMS wafer is fabricated by depositing the metal film on the second wafer and bonding the first wafer on the metal film using metal paste or material of polymer series. With lower material costs, improvements in performance and characteristics can be achieved.

Abstract translation: 制造陀螺仪的方法，包括：制造顺序堆叠第一晶片，金属膜和第二晶片的SMS晶片; 通过光刻工艺在第一晶片的相关部分上形成悬臂或桥形结构; 附接到第一晶片的表面，由玻璃制成的第一盖，并且具有用于在真空状态下密封可移动结构的预定空间; 从第一晶片分离和去除金属膜和第二晶片; 并且附接到所述第一晶片的所述背面，所述第二盖在所述第一盖结构和物理上对称。 通过在第二晶片上沉积金属膜并使用金属浆料或聚合物系列材料将第一晶片接合在金属膜上来制造SMS晶片。 随着材料成本的降低，可以实现性能和特性的提高。

公开(公告)号：US06720201B2

公开(公告)日：2004-04-13

申请号：US10384495

申请日：2003-03-10

Applicant: Eun-sung Lee ,  Chung-woo Kim ,  In-sang Song ,  Jong-seok Kim ,  Moon-chul Lee

Inventor： Eun-sung Lee ,  Chung-woo Kim ,  In-sang Song ,  Jong-seok Kim ,  Moon-chul Lee

IPC: H01L2100

CPC classification number: B81B3/0078 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/04 ,  B81C2201/0107 ,  B81C2201/014 ,  H01H59/0009

Abstract: A method for fabricating a MEMS device having a fixing part fixed to a substrate, a connecting part, a driving part, a driving electrode, and contact parts, includes patterning the driving electrode on the substrate; forming an insulation layer on the substrate; patterning the insulation layer and etching a fixing region and a contact region of the insulation layer; forming a metal layer over the substrate; planarizing the metal layer until the insulation layer is exposed; forming a sacrificial layer on the substrate; patterning the sacrificial layer to form an opening exposing a portion of the insulation layer and the metal layer in the fixing region; forming a MEMS structure layer on the sacrificial layer to partially fill the opening, thereby forming sidewalls therein; and selectively removing a portion of the sacrificial layer by etching so that a portion of the sacrificial layer remains in the fixing region.

公开(公告)号：US09768753B2

公开(公告)日：2017-09-19

申请号：US14382115

申请日：2012-06-12

Applicant: Jae Chun Lee ,  Duck Hwan Kim ,  Chul Soo Kim ,  Ho Soo Park ,  Sang Uk Son ,  In Sang Song ,  Jea Shik Shin ,  Moon Chul Lee ,  Jing Cui

Inventor： Jae Chun Lee ,  Duck Hwan Kim ,  Chul Soo Kim ,  Ho Soo Park ,  Sang Uk Son ,  In Sang Song ,  Jea Shik Shin ,  Moon Chul Lee ,  Jing Cui

IPC: H03H9/58 ,  H03H7/38 ,  H03H9/54 ,  H03H9/00 ,  H03H9/60 ,  H03H9/205

CPC classification number: H03H9/542 ,  H03H7/38 ,  H03H9/0095 ,  H03H9/205 ,  H03H9/58 ,  H03H9/60 ,  H03H9/605

Abstract: A filter using bulk acoustic wave resonators (BAWRs) is provided including BAWRs connected in series or in parallel to each other. A BAWR set is configured by connecting an inductance and capacitance (L/C) element to each BAWR in series or in parallel.

公开(公告)号：US08057013B2

公开(公告)日：2011-11-15

申请号：US11830112

申请日：2007-07-30

Applicant: Myong-jong Kwon ,  Sung-joon Park ,  Moon-chul Lee

Inventor： Myong-jong Kwon ,  Sung-joon Park ,  Moon-chul Lee

IPC: B41J2/135

CPC classification number: B41J2/1603 ,  B41J2/1606 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1645

Abstract: An inkjet printhead and a method of manufacturing the printhead. The inkjet printhead includes a substrate through which an ink supply passage is formed, a chamber plate stacked on the substrate having an ink chamber filled with ink supplied through the ink supply passage and heating resistors to heat the ink formed in the ink chamber, a nozzle plate formed on the chamber plate and through which a plurality of nozzles through which ink is ejected are formed, and a water repellent layer formed on the nozzle plate, wherein portions of a covalent bond formed by reaction between the material forming the nozzle plate and a hydrolysis material used to form the water repellent layer are discontinuously formed.

Abstract translation: 喷墨打印头和制造打印头的方法。 喷墨打印头包括形成油墨供给通道的基板，在基板上堆叠有一个油墨室的室板，其中填充有通过供墨通道供应的油墨和加热电阻器以加热形成在油墨室中的油墨，喷嘴 形成在所述室板上的板，并且形成有多个喷嘴，通过所述多个喷嘴喷射油墨，以及形成在所述喷嘴板上的防水层，其中通过形成所述喷嘴板的材料与所述喷嘴板之间的反应形成的共价键的部分 用于形成防水层的水解材料不连续地形成。

公开(公告)号：US20100053272A1

公开(公告)日：2010-03-04

申请号：US12416954

申请日：2009-04-02

Applicant: DONG-SIK SHIM ,  Yong-Seop Yoon ,  Bang-Weon Lee ,  Moon-Chul Lee ,  Yong-Won Jeong ,  Jong-Seok Kim

Inventor： DONG-SIK SHIM ,  Yong-Seop Yoon ,  Bang-Weon Lee ,  Moon-Chul Lee ,  Yong-Won Jeong ,  Jong-Seok Kim

IPC: B41J2/14

CPC classification number: B41J2/14145

Abstract: Disclosed are an ink ejecting device and a method of manufacturing the same. The disclosed ink ejecting device includes an inkjet head including a substrate, which includes an ink feed hole, a plurality of via holes, which are formed in the rear surface of the substrate, and which expose the ink feed holes therethtough, a chamber layer stacked on the substrate, and a nozzle layer stacked on the chamber layer, and includes a base header, which is attached to the inkjet head and includes a plurality of ink supply slots having a corresponding arrangement with respect to the via holes.

Abstract translation: 公开了一种喷墨装置及其制造方法。 所公开的喷墨装置包括喷墨头，其包括基板，该基板包括形成在基板的后表面中并且使墨供给孔暴露的多个通孔，堆叠的腔层 在基板上，以及层叠在室层上的喷嘴层，并且包括附接到喷墨头并包括相对于通孔具有相应布置的多个供墨槽的基座。

公开(公告)号：US20090194025A1

公开(公告)日：2009-08-06

申请号：US12139652

申请日：2008-06-16

Applicant: Yong-won JEONG ,  Hyung Choi ,  Eun-bong Han ,  Yong-seop Yoon ,  Moon-chul Lee ,  Dong-sik Shim

Inventor： Yong-won JEONG ,  Hyung Choi ,  Eun-bong Han ,  Yong-seop Yoon ,  Moon-chul Lee ,  Dong-sik Shim

IPC: B05C11/00

CPC classification number: B41J2/04586 ,  B41J2/0454 ,  B41J2/04563

Abstract: An apparatus to sense the temperature of an ink-jet head includes at least one or more CMOS (complementary metal oxide semiconductor) lateral BJTs (bipolar junction transistors) to sense the temperature of the ink-jet head, and a current supply unit to supply a current to the CMOS lateral BJTs. Minimum sized CMOS lateral BJTs are applied to an ink-jet printer head so that precise temperature control can be performed in a shuttle or array type ink-jet printer.

Abstract translation: 感测喷墨头的温度的装置包括至少一个或多个CMOS（互补金属氧化物半导体）横向BJT（双极结型晶体管），以感测喷墨头的温度，以及电流供应单元 电流到CMOS侧向BJT。 将最小尺寸的CMOS侧向BJT施加到喷墨打印机头，使得可以在梭式或阵列式喷墨打印机中进行精确的温度控制。

公开(公告)号：US07528689B2

公开(公告)日：2009-05-05

申请号：US11182775

申请日：2005-07-18

Applicant: Moon-chul Lee ,  Tae-sik Park ,  Hee-moon Jeong

Inventor： Moon-chul Lee ,  Tae-sik Park ,  Hee-moon Jeong

IPC: H01P1/10 ,  H01H57/00

CPC classification number: H01H59/0009 ,  H01H2059/0036 ,  H01H2059/0063

Abstract: A vibration type MEMS switch and a method of fabricating the vibration type MEMS switch. The vibration type MEMS switch includes a vibrating body supplied with an alternating current voltage of a predetermined frequency to vibrate in a predetermined direction; and a stationary contact point spaced apart from the vibrating body along a vibration direction of the vibrating body. When a direct current voltage with a predetermined magnitude is applied to the stationary contact point, a vibration margin of the vibrating body is increased, the vibrating body contacts the stationary contact point and the vibration type MEMS switch is turned on. A first substrate is bonded to a second substrate to isolate the vibrating body in a sealed vacuum space. The vibration type MEMS switch is turned on and/off by a resonance.

Abstract translation: 振动型MEMS开关和制造振动型MEMS开关的方法。 振动型MEMS开关包括：被提供有预定频率的交流电压的振动体以预定方向振动; 以及沿着振动体的振动方向与振动体间隔开的固定接触点。 当具有预定大小的直流电压被施加到固定触点时，振动体的振动边界增大，振动体接触固定触点，振动型MEMS开关导通。 将第一基板接合到第二基板，以在密封的真空空间中隔离振动体。 振动型MEMS开关由共振接通和断开。

公开(公告)号：US07449366B2

公开(公告)日：2008-11-11

申请号：US11365838

申请日：2006-03-02

Applicant: Moon-chul Lee ,  Jong-oh Kwon ,  Woon-bae Kim ,  Ji-hyuk Lim ,  Suk-jin Ham ,  Jun-sik Hwang ,  Chang-youl Moon

Inventor： Moon-chul Lee ,  Jong-oh Kwon ,  Woon-bae Kim ,  Ji-hyuk Lim ,  Suk-jin Ham ,  Jun-sik Hwang ,  Chang-youl Moon

IPC: H01L21/00

CPC classification number: B81C1/00301 ,  B81B2207/095 ,  H01L21/4817 ,  H01L21/50 ,  H01L2924/16235

Abstract: A wafer level packaging cap for covering a device wafer with a device thereon and a fabrication method thereof are provided. The method includes operations of forming a plurality of connection grooves on a wafer, forming a seed layer on the connection grooves, forming connection parts by filling the connection grooves with a metal material, forming cap pads on a top surface of the wafer to be electrically connected to the connection parts, bonding a supporting film with the top surface of the wafer on which the cap pads are formed, forming a cavity on a bottom surface of the wafer to expose the connection parts through the cavity, and forming metal lines on the bottom surface of the wafer to be electrically connected to the connection parts.

Abstract translation: 提供了一种用于在其上覆盖器件晶片的晶片级封装盖及其制造方法。 该方法包括在晶片上形成多个连接槽的操作，在连接槽上形成种子层，通过用金属材料填充连接槽来形成连接部分，在晶片的顶表面上形成电极盖 连接到连接部分，将支撑膜与其上形成有盖垫的晶片的顶表面接合，在晶片的底表面上形成空腔，以通过空腔露出连接部分，并在其上形成金属线 晶片的底表面电连接到连接部分。

公开(公告)号：US07411261B2

公开(公告)日：2008-08-12

申请号：US10773312

申请日：2004-02-09

Applicant: Eun-sung Lee ,  Chung-woo Kim ,  In-sang Song ,  Jong-seok Kim ,  Moon-chul Lee

Inventor： Eun-sung Lee ,  Chung-woo Kim ,  In-sang Song ,  Jong-seok Kim ,  Moon-chul Lee

IPC: H01L29/84

CPC classification number: B81B3/0078 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/04 ,  B81C2201/0107 ,  B81C2201/014 ,  H01H59/0009

Abstract: A method for fabricating a MEMS device having a fixing part fixed to a substrate, a connecting part, a driving part, a driving electrode, and contact parts, includes patterning the driving electrode on the substrate; forming an insulation layer on the substrate; patterning the insulation layer and etching a fixing region and a contact region of the insulation layer; forming a metal layer over the substrate; planarizing the metal layer until the insulation layer is exposed; forming a sacrificial layer on the substrate; patterning the sacrificial layer to form an opening exposing a portion of the insulation layer and the metal layer in the fixing region; forming a MEMS structure layer on the sacrificial layer to partially fill the opening, thereby forming sidewalls therein; and selectively removing a portion of the sacrificial layer by etching so that a portion of the sacrificial layer remains in the fixing region.

Abstract translation: 一种用于制造具有固定到基板上的固定部件，连接部件，驱动部件，驱动电极和接触部件的MEMS器件的方法，包括在所述基板上图形化所述驱动电极; 在所述基板上形成绝缘层; 图案化绝缘层并蚀刻绝缘层的固定区域和接触区域; 在衬底上形成金属层; 平坦化金属层直到绝缘层露出; 在所述基板上形成牺牲层; 图案化牺牲层以形成露出固定区域中绝缘层和金属层的一部分的开口; 在所述牺牲层上形成MEMS结构层以部分地填充所述开口，从而在其中形成侧壁; 并且通过蚀刻选择性地去除牺牲层的一部分，使得牺牲层的一部分保留在固定区域中。

公开(公告)号：US20080170101A1

公开(公告)日：2008-07-17

申请号：US11830112

申请日：2007-07-30

Applicant: Myong-jong KWON ,  Sung-joon PARK ,  Moon-chul LEE

Inventor： Myong-jong KWON ,  Sung-joon PARK ,  Moon-chul LEE

IPC: B41J2/135 ,  G01D15/00

CPC classification number: B41J2/1603 ,  B41J2/1606 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1645

Abstract: An inkjet printhead and a method of manufacturing the printhead. The inkjet printhead includes a substrate through which an ink supply passage is formed, a chamber plate stacked on the substrate having an ink chamber filled with ink supplied through the ink supply passage and heating resistors to heat the ink formed in the ink chamber, a nozzle plate formed on the chamber plate and through which a plurality of nozzles through which ink is ejected are formed, and a water repellent layer formed on the nozzle plate, wherein portions of a covalent bond formed by reaction between the material forming the nozzle plate and a hydrolysis material used to form the water repellent layer are discontinuously formed.

Abstract translation: 喷墨打印头和制造打印头的方法。 喷墨打印头包括形成油墨供给通道的基板，在基板上堆叠有一个油墨室的室板，其中填充有通过供墨通道供应的油墨和加热电阻器以加热形成在油墨室中的油墨，喷嘴 形成在所述室板上的板，并且形成有多个喷嘴，通过所述多个喷嘴喷射油墨，以及形成在所述喷嘴板上的防水层，其中通过形成所述喷嘴板的材料与所述喷嘴板之间的反应形成的共价键的部分 用于形成防水层的水解材料不连续地形成。