Semiconductor package including outer conductive plate

    公开(公告)号:US12300625B2

    公开(公告)日:2025-05-13

    申请号:US17828799

    申请日:2022-05-31

    Abstract: A semiconductor package includes a substrate; and a first semiconductor device and a second semiconductor device that are provided on the substrate. The substrate includes a first dielectric layer and a second dielectric layer provided on the first dielectric layer, a plurality of signal lines provided between the first dielectric layer and the second dielectric layer and connecting the first semiconductor device to the second semiconductor device, and a conductive pad and a conductive plate provided on the second dielectric layer. The conductive pad overlaps the first semiconductor device or the second semiconductor device. The conductive plate overlaps the signal lines.

    Method of manufacturing integrated circuit device

    公开(公告)号:US12300490B2

    公开(公告)日:2025-05-13

    申请号:US17358346

    申请日:2021-06-25

    Abstract: A method of manufacturing an integrated circuit (IC) device, the method including forming an underlayer on a feature layer such that the underlayer includes an acid generator; forming an acid-containing underlayer by generating a first acid from the acid generator; forming a photoresist film on the acid-containing underlayer; generating a second acid in a first area of the photoresist film by exposing the first area of the photoresist film; diffusing the first acid from the acid-containing underlayer into the first area of the photoresist film; and forming a photoresist pattern by developing the photoresist film.

    Electronic device method for adjusting configuration data of fingerprint sensor

    公开(公告)号:US12300016B2

    公开(公告)日:2025-05-13

    申请号:US18482633

    申请日:2023-10-06

    Inventor: Suna Kim Jinho Kim

    Abstract: An electronic device is provided. The electronic device includes a touch display including a touch sensor controller, a fingerprint sensor disposed beneath the touch display, a processor, and memory storing instructions that, when executed by the processor, cause the electronic device to: in response to a touch input to the touch display, obtain, via the touch sensor controller, capacitance data, adjust configuration data for the fingerprint sensor based on the capacitance data, and obtain fingerprint information corresponding to the touch input, using the fingerprint sensor operating with the adjusted configuration data.

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