公开(公告)号：US20230003688A1

公开(公告)日：2023-01-05

申请号：US16957614

申请日：2019-07-18

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xiaoxin SONG ,  Feng ZHANG ,  Wenqu LIU ,  Zhijun LV ,  Liwen DONG ,  Zhao CUI ,  Detian MENG ,  Libo WANG ,  Qi YAO

IPC: G01N29/02

Abstract: A micro total analysis system, operating method and manufacturing method thereof are provided. The micro total analysis system includes at least one micro total analysis unit each including: microfluidic device including first electrode and dielectric layer connected to each other, where the dielectric layer drives to-be-measured droplet to move based on voltage of the first electrode; and acoustic wave detection device including second electrode connected to the dielectric layer, where the dielectric layer is also used as transducer of the acoustic wave detection device, and configured to generate acoustic wave toward the droplet based on voltage of the second electrode, and generate a detection result corresponding to the droplet based on received acoustic wave. The micro total analysis system, the operating method and the manufacturing method thereof enables the microfluidic device and the acoustic wave detection device to be integrated in the same chip.

公开(公告)号：US20220344407A1

公开(公告)日：2022-10-27

申请号：US17859605

申请日：2022-07-07

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Chuanxiang XU ,  Guangcai YUAN ,  Shi SHU ,  Qi YAO

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/56

Abstract: Disclosed is a display apparatus, the display apparatus includes: a base, a display layer disposed on a side of the base, and a color filter layer disposed on a display side of the display layer. The display layer includes a plurality of sub-pixels. The color filter layer includes a plurality of color resistance portions in one-to-one correspondence with the plurality of sub-pixels. A thickness of any color resistance portion of the plurality of color resistance portions is decreased in a direction away from a reference line of the color resistance portion, and the reference line is a straight line passing through a geometric center of the color resistance portion and perpendicular to the base.

公开(公告)号：US20220334429A1

公开(公告)日：2022-10-20

申请号：US16964106

申请日：2019-09-03

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Wenqu LIU ,  Qi YAO ,  Feng ZHANG ,  Zhijun LV ,  Liwen DONG ,  Xiaoxin SONG ,  Zhao CUI ,  Detian MENG ,  Libo WANG ,  Jifeng TAN ,  Xiandong MENG

IPC: G02F1/1335 ,  G02F1/1343 ,  G02F1/1333 ,  G02F1/137 ,  G02F1/1337 ,  F21V8/00

Abstract: The embodiments of the present disclosure provide a display panel. The display panel includes a first substrate, a second substrate disposed opposite to the first substrate, and a liquid crystal layer between the first substrate and the second substrate, a plurality of first electrodes disposed on a side, close to the second substrate, of the first substrate and spaced apart at intervals, a first dielectric layer for planarizing the plurality of first electrodes, a second dielectric layer disposed on a side, close to the liquid crystal layer, of the first dielectric layer, a light shielding portion disposed on the side, close to the liquid crystal layer, of the second substrate, and a control circuit configured to apply a voltage between the first electrode and the second electrode so that the liquid crystal layer is in a first state or a second state.

公开(公告)号：US20220238594A1

公开(公告)日：2022-07-28

申请号：US17488243

申请日：2021-09-28

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xue DONG ,  Guangcai YUAN ,  Qi YAO ,  Zhanfeng CAO ,  Shi SHU ,  Mingxing WANG ,  Xiang LI

IPC: H01L27/15 ,  H01L25/065 ,  H01L25/00

Abstract: A LED chip, including: substrate; LEDs on side of the substrate, each including first semiconductor pattern, light emission pattern, second semiconductor pattern sequentially stacked, the first semiconductor patterns of at least two LEDs being formed as single piece to constitute first semiconductor layer; at least one first electrode on side of first semiconductor layer away from the substrate and electrically coupled to first semiconductor layer; second electrodes on side of the second semiconductor patterns away from the substrate, each being electrically coupled to second semiconductor pattern of corresponding LED; pixel defining layer on side of the substrate away from LED, and having pixel openings in one-to-one correspondence with LEDs; and a color conversion pattern within at least two pixel openings, and converting light of first color emitted by the light emission pattern into light of target color other than the first color. The LED chip is Mini-LED or Micro-LED chip.

公开(公告)号：US20220190271A1

公开(公告)日：2022-06-16

申请号：US17485522

申请日：2021-09-27

Applicant: BOE Technology Group Co., Ltd.

Inventor： Xiang LI ,  Shi SHU ,  Yong YU ,  Chuanxiang XU ,  Wei HE ,  Yang YUE ,  Haitao HUANG ,  Wei LI ,  Qi YAO

IPC: H01L51/50 ,  H01L51/52 ,  H01L51/56 ,  H01L27/32

Abstract: A display substrate, a manufacturing method thereof, and a display apparatus are provided. The display substrate includes a base substrate, a light-emitting structure layer disposed on the base substrate and a color conversion layer disposed on a light exiting side of the light-emitting structure layer. The light-emitting structure layer includes a first electrode, a second electrode and a light-emitting layer disposed between the first electrode and the second electrode, wherein the first electrode at least includes a first part and a second part which are connected to each other, and a first interior angle is formed between the first part and the second part, and the first interior angle is greater than 0 and less than 180 degrees.

公开(公告)号：US20220035503A1

公开(公告)日：2022-02-03

申请号：US17242511

申请日：2021-04-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Wenqu LIU ,  Qi YAO ,  Feng ZHANG ,  Zhao CUI ,  Libo WANG ,  Dongfei HOU ,  Xiaoxin SONG ,  Zhijun LV ,  Liwen DONG ,  Detian MENG ,  Jaiil RYU ,  Yang YUE ,  Haitao HUANG

IPC: G06F3/041 ,  G06F3/045 ,  G06F3/044 ,  G06K9/00

Abstract: The present disclosure provides a fingerprint recognition unit and a fabrication method thereof, a fingerprint recognition module and a display device. The fingerprint recognition unit includes: a bearing substrate; a receiving electrode layer on the bearing substrate; a piezoelectric material layer on a side of the receiving electrode layer away from the bearing substrate; and a driving electrode layer on a side of the piezoelectric material layer away from the receiving electrode layer. A density of the driving electrode layer is greater than 5 g/cm3, and a thickness of the driving electrode layer, a thickness of the piezoelectric material layer and a thickness of the bearing substrate are configured such that a vibration nodal plane of the piezoelectric material layer is within the piezoelectric material layer.

公开(公告)号：US20210385583A1

公开(公告)日：2021-12-09

申请号：US17288947

申请日：2020-05-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhao CUI ,  Feng ZHANG ,  Wenqu LIU ,  Liwen DONG ,  Zhijun LV ,  Xiaoxin SONG ,  Detian MENG ,  Libo WANG ,  Qi YAO

IPC: H04R17/00 ,  H04R3/00 ,  H04R31/00 ,  H01L41/047 ,  H01L41/193

Abstract: A transducer, a method of manufacturing a transducer, and a transducing device are provided. The transducer includes a receiving unit and a transmitting unit. The receiving unit includes a first receiving electrode, a first piezoelectric film, and a second receiving electrode which are sequentially stacked, and the receiving unit is configured to convert a first acoustic wave signal into an electrical signal by using a piezoelectric effect of the first piezoelectric film. The transmitting unit is configured to receive a control signal, which is based on the electrical signal, to transmit a second acoustic wave signal.

公开(公告)号：US20210231990A1

公开(公告)日：2021-07-29

申请号：US17263984

申请日：2020-05-27

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Shi SHU ,  Xiang LI ,  Chuanxiang XU ,  Yong YU ,  Haitao HUANG ,  Yang YUE ,  Qi YAO ,  Rui HUANG ,  Ge SHI ,  Kang GUO

IPC: G02F1/1368 ,  G02F1/1362

Abstract: An array substrate, a display panel and a display device are provided. The array substrate includes, a base substrate, a thin film transistor layer, a first passivation layer, a quantum dot layer, a color filter layer, a planarization layer and a metal wire grid polarizing layer that are sequentially disposed on the base substrate. The quantum dot layer is located in a display region of the array substrate, and an orthographic projection of the color filter layer on the base substrate.

公开(公告)号：US20210225877A1

公开(公告)日：2021-07-22

申请号：US16772272

申请日：2019-12-19

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yanan NIU ,  Kuanjun PENG ,  Jiushi WANG ,  Zhanfeng CAO ,  Feng ZHANG ,  Qi YAO ,  Wusheng LI ,  Feng GUAN ,  Lei CHEN ,  Jintao PENG ,  Tingting ZHOU

IPC: H01L27/12

Abstract: The present disclosure provides a display substrate and a manufacturing method thereof, and a display device. In the display substrate of the present disclosure, a first transistor comprises a first gate electrode, a first electrode, a second electrode, and a first active layer; and a second transistor comprises a second gate electrode, a third electrode, a fourth electrode, and a second active layers, wherein the first active layer comprises a silicon material, the second active layer comprises an oxide semiconductor material, and wherein the third electrode and the first gate electrode are disposed in the same layer, and the fourth electrode and the first electrode, the second electrodes are disposed in the same layer.

公开(公告)号：US20210043619A1

公开(公告)日：2021-02-11

申请号：US16920771

申请日：2020-07-06

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yingwei LIU ,  Ke WANG ,  Zhiwei LIANG ,  Muxin DI ,  Zhanfeng CAO ,  Shuang LIANG ,  Guangcai YUAN ,  Qi YAO ,  Dongni LIU

IPC: H01L25/18 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00

Abstract: Provided are a display structure and a preparation method thereof, and a display apparatus. The display structure includes a flexible back plate and a display substrate which are stacked, the flexible back plate including a bonding electrode for bonding to an integrated circuit chip, and the flexible back plate being bent to form a bent portion on which the bonding electrode is located.