TRANSACTION CARD WITH PARTIAL GLASS LAYER
    78.
    发明公开

    公开(公告)号:US20230385590A1

    公开(公告)日:2023-11-30

    申请号:US18034152

    申请日:2021-10-28

    CPC classification number: G06K19/07722

    Abstract: A transaction card having a partial glass layer including an interior glass member connected to a non-glass frame. The frame defines opposite planar surfaces, has an outer periphery coextensive with the outer periphery of the card, and has a frame inner periphery spaced radially inward from the frame outer periphery. The frame inner periphery defines an interior area occupied by the glass member. The transaction card further includes at least one additional layer having a periphery coextensive with the periphery of the card, and a payment module configured for contactless operation or dual interface contact/contactless operation.

    Di capacitive embedded metal card
    79.
    发明授权

    公开(公告)号:US11710024B2

    公开(公告)日:2023-07-25

    申请号:US17715506

    申请日:2022-04-07

    CPC classification number: G06K19/07792 G06K19/02 G06K19/0723 G06K19/07794

    Abstract: A transaction card having a metal layer, an opening in the metal layer for a transponder chip, and at least one discontinuity extending from an origin on the card periphery to a terminus in the opening. The card has a greater flex resistance than a card having a comparative discontinuity with the terminus and the origin the same distance from a line defined by a first long side of the card periphery in an absence of one or more strengthening features. Strengthening features include a discontinuity wherein one of the terminus or the origin are located relatively closer to the first long side of the card periphery than the other, a plurality of discontinuities wherein fewer than all extend from the card periphery to the opening, a self-supporting, non-metal layer disposed on at least one surface of the card, or one or more ceramic reinforcing tabs surrounding the opening.

    DI metal transaction devices and processes for the manufacture thereof

    公开(公告)号:US11618191B2

    公开(公告)日:2023-04-04

    申请号:US17168382

    申请日:2021-02-05

    Inventor: Adam Lowe John Esau

    Abstract: A transaction device includes a metal layer with one or more discontinuities in the metal layer. Each discontinuity comprises a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity that defines a path from the device periphery to the opening. A transponder chip module is disposed in the opening. A booster antenna is in communication with the transponder chip module. The device may include at least one fiber-reinforced epoxy laminate material layer. The transponder chip module and the booster antenna may comprise components in a payment circuit, with the metal layer electrically isolated from the payment circuit. The booster antenna may be formed on or embedded in the fiber-reinforced epoxy laminate material layer. Processes for manufacturing transaction devices including a metal layer with one or more fiber-reinforced epoxy laminate material layers are also disclosed.

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