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    Composition for an etching mask comprising a silicon-containing material
    71.
    发明申请
    Composition for an etching mask comprising a silicon-containing material 有权
    包含含硅材料的蚀刻掩模的组合物

    公开(公告)号：US20080097065A1

    公开(公告)日：2008-04-24

    申请号：US11508765

    申请日：2006-08-23

    申请人： Frank Y. Xu ,  Michael N. Miller ,  Michael P.C. Watts

    发明人： Frank Y. Xu ,  Michael N. Miller ,  Michael P.C. Watts

    IPC分类号： C08G77/04

    CPC分类号： B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

    摘要： The present invention includes a composition for a silicon-containing material used as an etch mask for underlying layers. More specifically, the silicon-containing material may be used as an etch mask for a patterned imprinted layer comprising protrusions and recessions. To that end, in one embodiment of the present invention, the composition includes a hydroxyl-functional silicone component, a cross-linking component, a catalyst component, and a solvent. This composition allows the silicon-containing material to selectively etch the protrusions and the segments of the patterned imprinting layer in superimposition therewith, while minimizing the etching of the segments in superposition with the recessions, and therefore allowing an in-situ hardened mask to be created by the silicon-containing material, with the hardened mask and the patterned imprinting layer forming a substantially planarized profile.

    摘要翻译： 本发明包括用作下层的蚀刻掩模的含硅材料用组合物。 更具体地，含硅材料可以用作包括突起和凹陷的图案化印记层的蚀刻掩模。 为此，在本发明的一个实施方案中，组合物包括羟基官能的硅氧烷组分，交联组分，催化剂组分和溶剂。 该组合物允许含硅材料与图案化压印层的突起和段的叠加选择性地蚀刻，同时最小化与凹陷叠加的段的蚀刻，并且因此允许形成原位硬化的掩模 通过含硅材料，硬化的掩模和图案化的压印层形成基本平坦化的轮廓。

    Reducing Adhesion between a Conformable Region and a Mold
    73.
    发明申请
    Reducing Adhesion between a Conformable Region and a Mold 审中-公开
    降低适形区域和模具之间的粘合力

    公开(公告)号：US20110215503A1

    公开(公告)日：2011-09-08

    申请号：US13106407

    申请日：2011-05-12

    申请人： Frank Y. Xu ,  Michael N. Miller

    发明人： Frank Y. Xu ,  Michael N. Miller

    IPC分类号： B29C59/02 ,  C08K5/06 ,  C08L31/06 ,  C08L63/02 ,  C08L81/02 ,  C08L35/02

    CPC分类号： G03F7/0002 ,  B82Y10/00 ,  B82Y40/00

    摘要： Improved preferential adhesion and release characteristics are described with respect to a substrate and a mold having imprinting material disposed therebetween, in the absence of an a priori release layer on the mold. The imprinting material is a polymerizable material including a fluorinated surfactant and a photoinitiator. The surfactant includes —CH2CH2CH2O—, —CH(CH3)CH2O—, —OCH(CH3)CH2—, —CH(CH3)CH(CH3)O—, or a combination thereof.

    摘要翻译： 在模具上没有先验剥离层的情况下，相对于具有设置在其间的压印材料的基板和模具来描述改进的优先粘合和剥离特性。 压印材料是包含氟化表面活性剂和光引发剂的可聚合材料。 表面活性剂包括-CH 2 CH 2 CH 2 O-，-CH（CH 3）CH 2 O-，-OCH（CH 3）CH 2 - ， - CH（CH 3）CH（CH 3）O-或其组合。

    Composition to reduce adhesion between a conformable region and a mold
    75.
    发明授权
    Composition to reduce adhesion between a conformable region and a mold 有权
    组合物以减少适形区域和模具之间的粘附

    公开(公告)号：US07307118B2

    公开(公告)日：2007-12-11

    申请号：US11068171

    申请日：2005-02-28

    申请人： Frank Y. Xu ,  Michael N. Miller

    发明人： Frank Y. Xu ,  Michael N. Miller

    IPC分类号： C08K5/02

    CPC分类号： G03F7/0002 ,  B82Y10/00 ,  B82Y40/00

    摘要： The present invention provides compositions that feature improved preferential adhesion and release characteristics with respect to a substrate and a mold having imprinting material disposed therebetween. To that end, the compositions facilitate bifurcation of the imprinting into a surfactant-component-rich sub-portion and a surfactant-component-depleted sub-portion located between said surfactant-component-rich sub-portion and said substrate. This surfactant-component-rich sub-portion attenuates the adhesion forces between the mold and the imprinting material, once solidified.

    摘要翻译： 本发明提供了相对于基底和具有设置在其间的压印材料的模具具有改进的优先粘附和释放特性的组合物。 为此，组合物有利于将压印物分成富含表面活性剂组分的亚部分和位于所述富表面活性剂组分的子部分和所述底物之间的表面活性剂组分贫乏的子部分。 该表面活性剂成分丰富的子部分一旦固化，就会使模具和压印材料之间的粘合力衰减。

    Composition for an etching mask comprising a silicon-containing material
    76.
    发明授权
    Composition for an etching mask comprising a silicon-containing material 有权
    包含含硅材料的蚀刻掩模的组合物

    公开(公告)号：US07122079B2

    公开(公告)日：2006-10-17

    申请号：US10789319

    申请日：2004-02-27

    申请人： Frank Y. Xu ,  Michael N. Miller ,  Michael P. C. Watts

    发明人： Frank Y. Xu ,  Michael N. Miller ,  Michael P. C. Watts

    IPC分类号： C08L83/00

    CPC分类号： B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

    摘要： The present invention includes a composition for a silicon-containing material used as an etch mask for underlying layers. More specifically, the silicon-containing material may be used as an etch mask for a patterned imprinted layer comprising protrusions and recessions. To that end, in one embodiment of the present invention, the composition includes a hydroxyl-functional silicone component, a cross-linking component, a catalyst component, and a solvent. This composition allows the silicon-containing material to selectively etch the protrusions and the segments of the patterned imprinting layer in superimposition therewith, while minimizing the etching of the segments in superposition with the recessions, and therefore allowing an in-situ hardened mask to be created by the silicon-containing material, with the hardened mask and the patterned imprinting layer forming a substantially planarized profile.

    摘要翻译： 本发明包括用作下层的蚀刻掩模的含硅材料用组合物。 更具体地，含硅材料可以用作包括突起和凹陷的图案化印记层的蚀刻掩模。 为此，在本发明的一个实施方案中，组合物包括羟基官能的硅氧烷组分，交联组分，催化剂组分和溶剂。 该组合物允许含硅材料与图案化压印层的突起和段的叠加选择性地蚀刻，同时最小化与凹陷叠加的段的蚀刻，并且因此允许形成原位硬化的掩模 通过含硅材料，硬化的掩模和图案化的压印层形成基本平坦化的轮廓。