摘要:
A semiconductor packaging arrangement, or module, includes a printed circuit board having an electrical interconnect thereon and a semiconductor package mounted to the printed circuit board. The semiconductor package includes a fractional portion of a semiconductor wafer having a plurality of integrated circuit chips thereon, such chips being separated by regions in the fractional portion of the wafer. The fractional portion of the wafer has a plurality of electrical contacts electrically connected to the chips. The package also includes a dielectric member having an electrical conductor thereon. The electrical conductor are electrically connected to the plurality of electrical contacts of the plurality of chips to electrically interconnect such plurality of chips with portions of the electrical conductor spanning the regions in the fractional portion of the wafer. A connector is provided for electrically connecting the electrical conductor of the package to the electrical interconnect of the printed circuit board.
摘要:
A method for testing a data path for a semiconductor memory device, in accordance with the present invention, includes providing a semiconductor memory device including a plurality of stages in a data path, and transferring data into the data path. Components are disabled to isolate at least one stage of the plurality of stages such that data written to or read from the at least one stage is available at an output. The data at the output is preferably compared to expected data. Alternately, system level calibration between devices may be performed to ensure proper communication between devices without destroying data in a memory array and making a dynamic data skew calibration possibly while running an application.
摘要:
Multiple conductive paths are provided in a circuit portion between a circuit element and a logic block, enabling repairing of defects in the conductive line coupling the circuit element and logic blocks without the use of fusing.
摘要:
A synchronized data capture circuit configured to synchronize capturing of data in a data signal with a timing signal in an integrated circuit. The synchronized data circuit employs voltage signals having a reduced voltage level, the data signal and the timing signal having a first voltage level higher than the reduced voltage level. The synchronized data capture circuit includes a timing driver circuit arranged to receive the timing signal. The timing driver circuit outputs a reduced voltage timing signal having the reduced voltage level. There is included a data driver circuit arranged to receive the data signal and the timing signal, the data driver outputting a reduced voltage clocked data signal having the reduced voltage level. There is further included a data clocking circuit coupled to the timing driver circuit and the data driver circuit. The data clocking circuit is arranged to receive the reduced voltage timing signal and the reduced voltage clocked data signal. The data clocking circuit outputs a synchronized capture data signal having the first voltage level higher than the reduced voltage level.
摘要:
A dynamic logic circuit having reduced sub-threshold leakage current during standby mode comprises a connection to at least one upper power rail, a connection to a lower power rail, a precharge node, and an output node adapted to be charged to the potential of the upper power rail after a precharge signal is received at the precharge node. A latch on the output node is provided to maintain the potential at the output node, along with at least one input node for receiving at least one evaluation signal to maintain the potential at the output node to the voltage of the upper power rail or reduce the potential at the output node to the potential of the lower power rail. A device is coupled to the output node to set the output node to a potential which minimizes the sub-threshold leakage upon receipt of a standby signal to maintain the potential at the output node at the potential of the upper power rail or at the potential of the lower power rail.
摘要:
An integrated circuit having conductive lines with non-rectangular shaped cross-sections. The non-rectangular shaped cross-sections facilitate a reduction in line pitch without increasing capacitive coupling noise between adjacent conductive lines or, alternatively, reduction in capacitive coupling noise between adjacent lines for a given pitch.
摘要:
An integrated circuit comprising first and second bitline pairs 410 and 420 is described. The bitline paths of a bitline pair are on different bitline levels. The bitline paths of the first and second bitline pairs which are on different bitline levels are adjacent to each other. The first bitline pair comprises m vertical-horizontal twists 440, where m is a whole number≧1, and the second bitline pair comprises n vertical-horizontal twists 460 and 461, where n is a whole number≠m. The vertical-horizontal twists transform coupling noise into common mode noise.
摘要:
A bidirectional full swing voltage repeater implemented on a signal line of an integrated circuit, which includes a first enable node for providing a first enable signal and a second enable node for providing a second enable signal. There is included a first full-swing unidirectional repeater circuit coupled between a first portion of the signal line and a second portion of the signal line. The first full-swing unidirectional repeater is configured to pass a first full swing signal from the first portion of the signal line to the second portion of the signal line when the first enable signal is enabled. The second full-swing unidirectional repeater circuit is coupled between the first portion of the signal line and the second portion of the signal line. The second full-swing unidirectional repeater circuit is configured to pass a second full swing signal from the second portion of the signal line to the first portion of the signal line when the second enable signal is enabled, wherein the first full-swing unidirectional repeater circuit and the second full-swing unidirectional repeater circuit are tri-stated when both the first enable signal and the second enable signal are disabled.
摘要:
A method in an integrated circuit for implementing a reduced voltage repeater circuit on a signal line having thereon reduced voltage signals. The reduced voltage signals has a voltage level that is below VDD. The reduced voltage repeater circuit is configured to be coupled to the signal line and having an input node coupled to a first portion of the signal line for receiving a first reduced voltage signal and an output node coupled to a second portion of the signal line for outputting a second reduced voltage signal. The method includes coupling the input node to the first portion of the signal line. The input node is coupled to an input stage of the reduced voltage repeater circuit. The input stage is configured to receive the first reduced voltage signal on the signal line. The input stage is also coupled to a level shifter stage that is arranged to output a set of level shifter stage control signals responsive to the first reduced voltage signal. A voltage range of the set of level shifter stage control signals is higher than a voltage range associated with the first reduced voltage signal. There is further included coupling the output node to the second portion of the signal line. The output node also is coupled to an output stage of the reduced voltage repeater circuit. The output stage is configured to output the second reduced voltage signal on the output node responsive to the set of level shifter stage control signals. A voltage range of the second reduced voltage signal is lower than the voltage range of the set of level shifter stage control signals.
摘要:
A method for fabricating a semiconductor memory with a split level folded bitline structure consisting of three contact levels, in accordance with the present invention includes forming gate structures for transistors in an array region and a support region of a substrate. First contacts are formed down to diffusion regions between the gate structures in the array region. The first contacts have a height which is substantially the same for all first contacts in the array region. Second contacts are formed between first level bitlines in the array region and a first portion of the first contacts, while forming second contacts to a first metal layer from the gate structures and diffusion regions in the support region. Third contacts are formed between second level bitlines in the array region and a second portion of the first contacts, while forming third contacts to a second metal layer from the first metal layer in the support region.