公开(公告)号：US08587011B2

公开(公告)日：2013-11-19

申请号：US13502662

申请日：2011-09-06

申请人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Hideo Nagai ,  Takaari Uemoto ,  Masahiro Miki ,  Atsushi Motoya

发明人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Hideo Nagai ,  Takaari Uemoto ,  Masahiro Miki ,  Atsushi Motoya

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  F21K9/232 ,  F21V3/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/507 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2924/00

摘要： A light-emitting device which emits light omnidirectionally is provided. A light-emitting device according to the present invention includes: a package which is translucent; an LED provided in a recess in the package; and a sealing member for sealing the LED and packaging the recess; and the recess includes a bottom surface on which the LED is mounted and a side surface surrounding a bottom surface, and light emitted by the LED is transmitted inside the package through the bottom surface and the side surface of the recess and is emitted to outside of the package from the back surface and the side surface of the package.

摘要翻译： 提供了全向发光的发光装置。 根据本发明的发光器件包括：半透明的封装; 设置在所述封装中的凹部中的LED; 以及用于密封LED并封装凹部的密封构件; 并且所述凹部包括其上安装有LED的底表面和围绕底表面的侧表面，并且由所述LED发射的光通过所述凹部的底表面和侧表面在所述封装内部传输并且被发射到 包装从包装的后表面和侧表面。

公开(公告)号：US20130294082A1

公开(公告)日：2013-11-07

申请号：US13979891

申请日：2011-10-26

申请人： Tsugihiro Matsuda ,  Masahiro Miki ,  Takaari Uemoto ,  Hideo Nagai

发明人： Tsugihiro Matsuda ,  Masahiro Miki ,  Takaari Uemoto ,  Hideo Nagai

IPC分类号： F21V3/00

CPC分类号： F21V3/00 ,  F21K9/232 ,  F21S8/04 ,  F21V3/061 ,  F21V29/506 ,  F21V29/70 ,  F21Y2107/60 ,  F21Y2115/10 ,  Y02B20/30

摘要： A light bulb shaped lamp according to the present invention includes: a hollow globe having an opening; a plurality of light-emitting modules housed in the globe, each of the light-emitting modules having a semiconductor light-emitting device that is a light source; and a stem extending from the opening of the globe to an inside of the globe, the stem supporting the light-emitting modules, in which the stem penetrates at least one of the light-emitting modules, and the light-emitting modules are spaced a predetermined distance apart along an axis of the stem.

摘要翻译： 根据本发明的灯泡形灯包括：具有开口的中空球体; 每个发光模块具有作为光源的半导体发光器件;多个发光模块， 以及从所述球体的开口延伸到所述球体的内部的杆，所述杆支撑所述发光模块，所述杆在所述发光模块中穿透至少一个所述发光模块，并且所述发光模块间隔开 沿着杆的轴线隔开预定距离。

公开(公告)号：US08421111B2

公开(公告)日：2013-04-16

申请号：US13503242

申请日：2011-08-23

申请人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Hideo Nagai ,  Takaari Uemoto ,  Masahiro Miki ,  Atsushi Motoya

发明人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Hideo Nagai ,  Takaari Uemoto ,  Masahiro Miki ,  Atsushi Motoya

IPC分类号： H01L33/00

CPC分类号： H01L33/507 ,  F21K9/232 ,  F21V3/00 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/505 ,  H01L33/508 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/00

摘要： A light-emitting device including: a base which is translucent; a semiconductor light-emitting element provided on the base; a sealing member for sealing the semiconductor light-emitting element and including a first wavelength conversion material for converting a wavelength of light emitted by the semiconductor light-emitting element to a predetermined wavelength; and a groove provided on a side of the semiconductor light-emitting element, recessed from a top surface of the base on which the semiconductor light-emitting element is provided or a back surface of the base which is a surface opposite to the top surface, and for holding a second wavelength conversion material for converting the wavelength of the light emitted by the semiconductor light-emitting element to the predetermined wavelength.

摘要翻译： 一种发光器件，包括：半透明的基底; 设置在基座上的半导体发光元件; 用于密封半导体发光元件并且包括用于将由半导体发光元件发射的光的波长转换为预定波长的第一波长转换材料的密封构件; 以及设置在半导体发光元件的从设置有半导体发光元件的基座的顶面凹下的槽或与该顶面相反的表面的基座的后表面的槽， 并且用于保持用于将由半导体发光元件发射的光的波长转换为预定波长的第二波长转换材料。

公开(公告)号：US20120300448A1

公开(公告)日：2012-11-29

申请号：US13565652

申请日：2012-08-02

申请人： Kenzi Takahasi ,  Yasushige Tomiyoshi ,  Takaari Uemoto ,  Hideo Nagai ,  Mamoru Takeda ,  Yoshio Manabe

发明人： Kenzi Takahasi ,  Yasushige Tomiyoshi ,  Takaari Uemoto ,  Hideo Nagai ,  Mamoru Takeda ,  Yoshio Manabe

IPC分类号： F21V9/00 ,  F21V29/00

CPC分类号： F21V23/009 ,  F21K9/23 ,  F21K9/233 ,  F21S8/026 ,  F21V3/00 ,  F21V23/002 ,  F21V29/15 ,  F21V29/83 ,  F21V29/89 ,  F21Y2115/10

摘要： A bulb-type lamp having both heat dissipation and size/weight reduction properties with a lower thermal load on a lighting circuit. An LED module is mounted in a case with a base member to allow dissipation of heat. An LED mount member closes another end of the case and allows conduction of heat to the case. A lighting circuit receives power via the base member. The lighting circuit is disposed inside a circuit holder. An air space exists between the circuit holder and both the case and the mount member. The lighting circuit is isolated from the air space by the circuit holder. A relationship 0.5≦S1/S2≦3.0, is satisfied where S1 denotes an area of a portion of the mount member in contact with the case and S2 denotes an area of the portion of the mount member in contact with a substrate of the LED module.

公开(公告)号：US20120256538A1

公开(公告)日：2012-10-11

申请号：US13393397

申请日：2011-09-20

申请人： Nobuyoshi Takeuchi ,  Tsugihiro Matsuda ,  Hideo Nagai ,  Masahiro Miki ,  Takaari Uemoto

发明人： Nobuyoshi Takeuchi ,  Tsugihiro Matsuda ,  Hideo Nagai ,  Masahiro Miki ,  Takaari Uemoto

IPC分类号： H01L33/62 ,  H01L33/48

CPC分类号： F21K9/232 ,  F21V3/00 ,  F21Y2115/10 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49107 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting device capable of effectively dissipating heat generated at an LED is provided. The light-emitting device according to the present invention includes: a base board and an LED chip mounted on the base board. The base board is a translucent base board made of a polycrystalline ceramic. A main region of the base board includes an element mounted region on which the LED chip is mounted, and an average grain size of the polycrystalline ceramic in the main region is between 10 μm and 40 μm inclusive. An end portion region of said base board is a region around an end portion, and an average grain size of the polycrystalline ceramic in the end portion region is preferably smaller than an average grain size of the polycrystalline ceramic in the element mounted region.

摘要翻译： 提供能够有效散发在LED产生的热量的发光装置。 根据本发明的发光装置包括：基板和安装在基板上的LED芯片。 基板是由多晶陶瓷制成的半透明基板。 基板的主区域包括安装有LED芯片的元件安装区域，并且主区域中的多晶陶瓷的平均晶粒尺寸在10μm和40μm之间。 所述基板的端部区域是端部周围的区域，并且端部区域中的多晶陶瓷的平均粒径优选小于元件安装区域中的多晶陶瓷的平均粒径。

公开(公告)号：US20120235181A1

公开(公告)日：2012-09-20

申请号：US13503242

申请日：2011-08-23

申请人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Hideo Nagai ,  Takaari Uemoto ,  Masahiro Miki ,  Atsushi Motoya

发明人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Hideo Nagai ,  Takaari Uemoto ,  Masahiro Miki ,  Atsushi Motoya

IPC分类号： H01L33/08

CPC分类号： H01L33/507 ,  F21K9/232 ,  F21V3/00 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/505 ,  H01L33/508 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/00

摘要： A light-emitting device including: a base which is translucent; a semiconductor light-emitting element provided on the base; a sealing member for sealing the semiconductor light-emitting element and including a first wavelength conversion material for converting a wavelength of light emitted by the semiconductor light-emitting element to a predetermined wavelength; and a groove provided on a side of the semiconductor light-emitting element, recessed from a top surface of the base on which the semiconductor light-emitting element is provided or a back surface of the base which is a surface opposite to the top surface, and for holding a second wavelength conversion material for converting the wavelength of the light emitted by the semiconductor light-emitting element to the predetermined wavelength.

摘要翻译： 一种发光器件，包括：半透明的基底; 设置在基座上的半导体发光元件; 用于密封半导体发光元件并且包括用于将由半导体发光元件发射的光的波长转换为预定波长的第一波长转换材料的密封构件; 以及设置在半导体发光元件的从设置有半导体发光元件的基座的顶面凹下的槽或与该顶面相反的表面的基座的后表面的槽， 并且用于保持用于将由半导体发光元件发射的光的波长转换为预定波长的第二波长转换材料。

公开(公告)号：US20120217862A1

公开(公告)日：2012-08-30

申请号：US13393552

申请日：2011-09-22

申请人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Hideo Nagai ,  Masahiro Miki ,  Takaari Uemoto

发明人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Hideo Nagai ,  Masahiro Miki ,  Takaari Uemoto

IPC分类号： H05B33/08

CPC分类号： F21K9/232 ,  F21V29/506 ,  F21V29/507 ,  F21Y2105/10 ,  F21Y2107/90 ,  F21Y2115/10

摘要： A light bulb shaped lamp capable of achieving light-distribution property equivalent to that of a conventional incandescent light bulb and easily fixing the LED module in the lamp is provided. The lamp according to the present invention includes an LED module housed in a hollow globe and a fixing component for fixing the LED module. The LED module includes a translucent board having a first main surface with an LED mounted thereon and a second main surface. The board includes a first light-emitting area and a second light-emitting area, the first light-emitting area in which predetermined light by the LED is emitted from the first main surface toward the globe, and the second light-emitting area in which predetermined light by the LED is emitted from the second main surface toward the globe.

摘要翻译： 提供能够实现与常规白炽灯泡相同的光分布特性并且容易地将LED模块固定在灯中的灯泡形灯。 根据本发明的灯包括容纳在中空球体中的LED模块和用于固定LED模块的固定部件。 LED模块包括具有安装在其上的LED的第一主表面和第二主表面的半透明板。 该板包括第一发光区域和第二发光区域，其中由LED的预定光从第一主表面朝向球体发射的第一发光区域和第二发光区域，其中 LED的预定光从第二主表面朝向球体发射。

公开(公告)号：US20120044684A1

公开(公告)日：2012-02-23

申请号：US13243517

申请日：2011-09-23

申请人： Kenzi Takahasi ,  Yasushige Tomiyoshi ,  Satoshi Shida ,  Tatsumi Setomoto ,  Akira Taniuchi ,  Takaari Uemoto ,  Hideo Nagai

发明人： Kenzi Takahasi ,  Yasushige Tomiyoshi ,  Satoshi Shida ,  Tatsumi Setomoto ,  Akira Taniuchi ,  Takaari Uemoto ,  Hideo Nagai

IPC分类号： F21V21/00 ,  F21V29/00

CPC分类号： F21V23/009 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21S8/026 ,  F21V3/00 ,  F21V23/002 ,  F21V23/006 ,  F21V29/507 ,  F21V29/70 ,  F21Y2115/10

摘要： Provided is a bulb-type lamp including a lightweight housing with great handleability. An LED light bulb comprises: an LED module on which LEDs are mounted; a cylindrically-shaped case having openings at both ends, which are first and second ends; a mount member on a front surface of which the LED module is mounted, the mount member closing a corresponding one of the openings of the case by being in contact with an inner circumferential surface of the first end of the case; a base member attached to the second end of the case; and a lighting circuit that is disposed inside the case. A wall thickness of the case is in a range of 200 μm to 500 μm inclusive, and the wall thickness of at least one portion of the case decreases from the first end toward the second end of the case.

摘要翻译： 提供一种灯泡型灯，其包括具有很大可操作性的轻质外壳。 LED灯泡包括：安装有LED的LED模块; 在两端具有开口的圆筒状壳体，其为第一端和第二端; 安装构件，其表面上安装有LED模块，所述安装构件通过与所述壳体的第一端的内周面接触而封闭所述壳体的相应一个开口; 附接到所述壳体的第二端的基部构件; 以及设置在壳体内的照明电路。 壳体的壁厚在200μm〜500μm的范围内，壳体的至少一部分的壁厚从壳体的第一端朝向第二端部减小。

公开(公告)号：US08047688B2

公开(公告)日：2011-11-01

申请号：US12994743

申请日：2010-04-21

申请人： Kenzi Takahasi ,  Yasushige Tomiyoshi ,  Satoshi Shida ,  Tatsumi Setomoto ,  Akira Taniuchi ,  Takaari Uemoto ,  Hideo Nagai

发明人： Kenzi Takahasi ,  Yasushige Tomiyoshi ,  Satoshi Shida ,  Tatsumi Setomoto ,  Akira Taniuchi ,  Takaari Uemoto ,  Hideo Nagai

IPC分类号： F21V7/00

CPC分类号： F21V23/009 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21S8/026 ,  F21V3/00 ,  F21V23/002 ,  F21V23/006 ,  F21V29/507 ,  F21V29/70 ,  F21Y2115/10

摘要： Provided is a bulb-type lamp including a lightweight housing with great handleability. An LED light bulb (1) comprises: an LED module (3) on which LEDs are mounted; a cylindrically-shaped case (7) having openings at both ends, which are first and second ends; a mount member (5) on a front surface of which the LED module (3) is mounted, the mount member (5) closing a corresponding one of the openings of the case (7) by being in contact with an inner circumferential surface of the first end of the case (7); a base member (91) attached to the second end of the case (7); and a lighting circuit (11) that is disposed inside the case (7). A wall thickness of the case (7) is in a range of 200 μm to 500 μm inclusive, and the wall thickness of at least one portion of the case (7) decreases from the first end toward the second end of the case (7).

摘要翻译： 提供一种灯泡型灯，其包括具有很大可操作性的轻质外壳。 一种LED灯泡（1）包括：LED模块（3），LED在其上安装; 在两端具有开口的圆柱形壳体（7），其为第一端和第二端; 安装构件（5），其安装有LED模块（3）的前表面，安装构件（5）通过与壳体（7）的内周面接触而关闭壳体（7）的相应的一个开口 案件的第一端（7）; 附接到所述壳体（7）的第二端的基部构件（91）; 以及设置在所述壳体（7）内的照明电路（11）。 壳体（7）的壁厚在200μm〜500μm的范围内，壳体（7）的至少一部分的壁厚从壳体（7）的第一端部朝向第二端部 ）。

公开(公告)号：US20110090699A1

公开(公告)日：2011-04-21

申请号：US12996523

申请日：2009-06-30

申请人： Satoshi Shida ,  Takaari Uemoto

发明人： Satoshi Shida ,  Takaari Uemoto

IPC分类号： F21V29/00

CPC分类号： F21V3/02 ,  F21K9/23 ,  F21K9/233 ,  F21V3/061 ,  F21V3/062 ,  F21V23/002 ,  F21V29/713 ,  F21V29/74 ,  F21V29/89 ,  F21Y2115/10

摘要： To provide a bulb-type lighting source that employs a light-emitting element and has better heat dispersal characteristics than the conventional technology.A lamp 1 comprising a heat sink member 11, a mounting substrate 21 placed in surface contact with a surface of the heat sink member 11, a light-emitting unit 24 placed on a surface of the mounting substrate 21, a globe 41 covering the light-emitting unit 24 in light emission directions thereof, and a heat sink member 31 that has a first part in surface contact with a perimeter 28 of the surface of the mounting substrate 21 where the light-emitting unit 24 is not mounted and a second part in surface contact with the heat sink member 11.

摘要翻译： 提供采用发光元件并且具有比传统技术更好的散热特性的灯泡式照明源。 灯1包括散热构件11，与散热构件11的表面接触地放置的安装基板21，放置在安装基板21的表面上的发光单元24，覆盖光 发光单元24和散热构件31，其具有与安装基板21的未安装发光单元24的表面的周边28表面接触的第一部分，第二部分 与散热构件11表面接触。