摘要:
If a normal transmission mode has been specified, then four drivers included in a transmitter unit are activated by the respective outputs of four logical elements such that parallel signal transmission is performed using all of four signal lines each including a terminal resistor. Alternatively, if a limited transmission mode has been specified, then only one particular driver out of the four drivers is activated by the output of a parallel/serial converter such that serial signal transmission is performed using only one particular signal line out of the four signal lines. And the output impedances of three non-used drivers are increased by the outputs of three logical elements, thereby blocking direct current resulting from the terminal resistance of the respective non-used signal lines.
摘要:
A temperature sensor forming method and forming die are provided which perform insert-forming of a temperature sensor with a minimum of processes and in a short time. The temperature sensor formed has a temperature sensing element 1 arranged in a predetermined position inside a resin case 2. The process does not leave traces of pins that would allow water to penetrate the interior of the case. The process comprises a first step of supporting the temperature sensing element 1 with first and second slide blocks 6c and 6g. The process comprises a second step of injecting a molten forming resin 2a into a forming die 6 and retracting the first slide block 6c by injection pressure while the temperature sensing element 1 is being supported by the second slide block 6g. The process comprises a third step of retracting the second slide block 6g while injecting the molten forming resin 2a into the forming die 6. The receiving area S1 of the first slide block 6c is larger than the receiving area S2 of the second slide block 6g.
摘要:
A temperature sensor forming method and forming die are provided which perform insert-forming of a temperature sensor with a minimum of processes and in a short time. The temperature sensor formed has a temperature sensing element 1 arranged in a predetermined position inside a resin case 2. The process does not leave traces of pins that would allow water to penetrate the interior of the case. The process comprises a first step of supporting the temperature sensing element 1 with first and second slide blocks 6c and 6g. The process comprises a second step of injecting a molten forming resin 2a into a forming die 6 and retracting the first slide block 6c by injection pressure while the temperature sensing element 1 is being supported by the second slide block 6g. The process comprises a third step of retracting the second slide block 6g while injecting the molten forming resin 2a into the forming die 6. The receiving area S1 of the first slide block 6c is larger than the receiving area S2 of the second slide block 6g.
摘要:
A memory cell is formed by flip-flop connection of a load transistor pair of a first load transistor and a second load transistor and a drive transistor pair of a first drive transistor and a second drive transistor. A first switch which is controlled by a wordline and a second switch which is activated only at the time of the write operation are connected in series to a first memory node. The second switch is serially coupled between the first memory node and the first drive transistor. An electric current is injected from a sense amplifier into a bitline pair selected at the time of the read operation, to detect an impedance which varies with the signal potential at the first memory node.
摘要:
A second power supply line is connected to a first power supply line via an N-MOS transistor and has a second potential (Vcc-Vt). The second power supply line is grounded to a ground line via one of P-MOS transistors of a clamp circuit, one of N-MOS transistors of a decode switch, an N-MOS sense amplifier, and a common source line of sense amplifiers. Accordingly, even when a power supply potential negatively bumps, a ground potential flows from the second power supply line through a current path thus formed, and the potential of the second power supply line can follow the negative bump. Since the transistors forming the clamp circuit are of the P-MOS type, the data lines are electrically connected to the second power supply line, so that the data lines can follow the negative bump of the first power supply line. Accordingly, it is possible to provide a data line precharging system which can follow the negative bump of the power supply without deteriorating the sensitivity of the amplifier of the voltage detecting type.
摘要:
During a period corresponding to the former half of one cycle of a clock signal, a capacitor is charged to an intermediate potential between the respective precharged potentials of two level-shifters. Subsequently, during a period corresponding to the latter half of one cycle of the clock signal, the capacitor is connected to that one of the output nodes which shifts to a lower potential in the level-shifter on the upper stage, while a power source line is connected to the other output node which shifts to a higher potential. On the other hand, the capacitor is also connected to that one of the output nodes which shifts to the higher potential in the level-shifter on the lower stage, while the ground line is connected to the other output node which shifts to the lower potential. Consequently, there can be provided a semiconductor integrated circuit free from power dissipation that might have been caused by an internal power-source circuit. The semiconductor integrated circuit enables data transfer with a small amplitude and consumes an extremely small amount of current even when multi-bit data lines operate in parallel.
摘要:
In a sampled data transmitting apparatus in which the sampled data to be transmitted are divided into odd-numbered samples and even-numbered samples and arranged in different rows of a two-dimensional data array, and in which error correction codes are annexed to each row and to each column of the two-dimensional data array, the row arraying sequence in one of the odd-numbered or even-numbered rows is caused to differ from the row arraying sequence in the other of the odd-numbered or even-numbered rows so that odd-numbered data and even-numbered data continuous with the odd-numbered data are not arranged in one row. In this manner, even when error correction becomes impossible by the error correcting code for one row, interpolation remains feasible because there exist no odd-numbered data or even-numbered data contiguous to each other in the row.
摘要:
A circuit for reading and writing data to/from memory cells of a DRAM, based upon sense amplifiers formed of N-type and P-type FETs for each pair of bit lines of the DRAM and column switches formed of FETs for transferring data potentials to/from the bit line pairs, in which the current drive capability of the column switches is increased relative to the sense amplifiers during each write cycle and the current drive capability of the sense amplifiers is increased relative to that of the column switches during each read cycle, thereby ensuring satisfactory read and write operation even for a very large-scale DRAM operating with a low value of supply voltage.
摘要:
A sense amplifier circuit for a semiconductor memory includes a flip-flop coupled to a pair of bit lines connected to memory cells, for amplifying a differential read voltage produced between the bit lines, and at least two switches for applying respectively different levels of drive voltage to a common node of the flip-flop. The switches are controlled such as to apply a relatively high value of drive voltage to the common node when a read operation is initiated, to thereby initially provide a high charging current to the bit line capacitance, and thereafter supply a lower value of drive voltage to thereby ensure reliability of the memory cell oxide film.
摘要:
A dynamic random access memory which includes a memory cell array, sense amplifiers disposed at both side of the memory cell array, and sub bit lines coupled to the sense amplifiers. The sub bit lines are coupled to data busses through middle amplifiers. By use of such memory architecture, higher integration of DRAM can be realized. Also, handling of super large bit data more than 1024 bit becomes possible.