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公开(公告)号：US20120231309A1
公开(公告)日：2012-09-13
申请号：US13496398
申请日：2011-05-17
IPC分类号： H01M2/10
CPC分类号： H01M2/206 , H01M2/1077 , H01M10/0525 , H01M10/613 , H01M10/625 , H01M10/643 , H01M10/6555
摘要： A battery block includes a metal case including a side surface and a bottom surface, and a plurality of cells accommodated in the metal case, wherein each cell includes a first electrode and a second electrode which is electrically insulated from the first electrode, and also serves as a cell case of the cell, the plurality of cells are aligned with the first electrodes being in a same direction, the first electrodes of the plurality of cells are connected to a connector arranged to face an opening of the metal case, the second electrodes of the plurality of cells are connected to the bottom surface of the metal case, the height of the side surface of the metal case is substantially the same as the height of the cells, and the opening of the metal case is almost completely covered with the connector.
摘要翻译： 电池块包括金属外壳，其包括侧表面和底表面，以及容纳在金属外壳中的多个单元，其中每个单元包括第一电极和与第一电极电绝缘的第二电极， 作为单元的单元壳体，多个单元与第一电极对齐，多个单元的第一电极连接到面对金属壳体的开口的连接器，第二电极 多个电池单元的连接处于金属外壳的底面，金属外壳的侧面高度与电池的高度基本相同，金属外壳的开口几乎完全被 连接器。
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72.发明申请LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE 审中-公开用于光学半导体器件的引线框架，其制造方法和光学半导体器件公开(公告)号：US20120168810A1
公开(公告)日：2012-07-05
申请号：US13382995
申请日：2010-06-23
CPC分类号： H01L33/62 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2933/0066 , Y10T29/49121 , H01L2924/00014
摘要： A lead frame for an optical semiconductor device, having: a layer 2 composed of silver or a silver alloy formed on an electrically-conductive substrate 1; a metal oxide layer 3 of a metal other than silver as an outer layer of the layer composed of silver or a silver alloy, wherein the metal oxide layer 3 is colorless and transparent or silver gray in color, and has a thickness thereof from 0.001 to 0.2 μm; a method of producing the same; and an optical semiconductor device utilizing the same.
摘要翻译： 一种用于光学半导体器件的引线框架，具有：形成在导电基板1上的由银或银合金构成的层2; 作为由银或银合金构成的层的外层的除银以外的金属的金属氧化物层3，其中金属氧化物层3为无色透明或银灰色，其厚度为0.001〜 0.2μm; 其制造方法; 以及使用该光学半导体装置的光学半导体装置。
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73.发明授权Method of manufacturing a semiconductor integrated circuit device including elimination of static charge of a treated wafer 有权制造半导体集成电路器件的方法，包括消除经处理晶片的静电荷公开(公告)号：US08119547B2
公开(公告)日：2012-02-21
申请号：US12123584
申请日：2008-05-20
申请人： Yoshiaki Kobayashi
发明人： Yoshiaki Kobayashi
IPC分类号： H01L21/02
CPC分类号： H01L21/67772 , H01L21/67775 , Y10S438/909
摘要： A sealed type container accommodating a semiconductor substrate is positioned to a load port of a semiconductor manufacturing apparatus. The semiconductor substrate is taken out of the container. An ionizer is used for static-charge-eliminating the semiconductor substrates before and after process treatment in a transport area between the load port and a treatment section. The static-charge-eliminated semiconductor substrate is accommodated in the container positioned to the load port. Thus, it is possible to decrease foreign materials adhering to the semiconductor substrate and errors in handling the semiconductor substrate.
摘要翻译： 容纳半导体基板的密封型容器位于半导体制造装置的负载端口。 将半导体衬底从容器中取出。 离子发生器用于在负载端口和处理部之间的输送区域中的处理处理之前和之后静电电荷消除半导体衬底。 将静电荷消除的半导体衬底容纳在位于负载端口的容器中。 因此，可以减少粘附到半导体衬底的异物和处理半导体衬底的误差。
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公开(公告)号：US20110117488A1
公开(公告)日：2011-05-19
申请号：US13012127
申请日：2011-01-24
IPC分类号： G03G9/083
CPC分类号： G03G9/107 , G03G9/1075 , G03G9/113 , G03G9/1131 , G03G9/1133
摘要： An objective is to provide a carrier exhibiting stable charge providing ability in which sufficient charge can be provided to toner having a small particle diameter, and no image contamination such as fog caused by toner scattering via lack of electrification is generated. Another objective is to provide a carrier capable of maintaining a charging level of no interference for image formation even under the image forming condition at which a charging level for printing a number of prints continuously is difficult to be maintained. Disclosed is a carrier comprising a core particle made of ferrite possessing Mg and coated thereon, a resin, wherein the core particle has a ratio of the number of irregular-shaped core particles of at most 5%, based on the total number of core particles, and a surface of the core particle has grains having a maximum grain diameter of 2-5 μm.
摘要翻译： 目的是提供一种具有稳定的电荷提供能力的载体，其中可以向具有小粒径的调色剂提供足够的电荷，并且不会产生由于通过不起电而由调色剂飞散引起的图像污染。 另一个目标是提供一种即使在连续打印多个打印件的打印水平难以维持的图像形成条件下，也能够保持对图像形成无干扰的充电水平的载体。 公开了一种载体，其包含由具有Mg并且涂覆在其上的铁氧体制成的核心颗粒，树脂，其中核心颗粒具有至多5％的不规则核心颗粒的数量的比率，基于芯颗粒的总数 ，核粒子的表面具有最大粒径为2-5μm的粒子。
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公开(公告)号：US20110003520A1
公开(公告)日：2011-01-06
申请号：US12885059
申请日：2010-09-17
CPC分类号： C25D3/30 , B23K26/354 , C22F1/08 , C25D3/12 , C25D5/10 , C25D5/505 , H01R13/03 , Y10S428/929 , Y10T29/49213 , Y10T428/12715 , Y10T428/12722
摘要： A connector terminal, fabricated from a metallic material for connector which material has a tin or tin alloy layer, formed on a copper or copper alloy base material, wherein the thickness of the tin or tin alloy layer at a contact site on the surface of the terminal is smaller than the thickness of the tin or tin alloy layer in the areas other than the contact site, and a copper-tin alloy layer is formed as an under layer of the tin or tin alloy layer at the contact site; and a connector terminal, fabricated from a metallic material for connector which material has a copper or copper alloy base material, wherein a copper-tin alloy layer is formed in a spot shape at a contact site on the surface of the terminal, and a tin or tin alloy layer is formed in the remaining areas on the surface.
摘要翻译： 由铜或铜合金基材上形成的具有锡或锡合金层的材料的金属连接器制成的连接器端子，其中锡或锡合金层在该表面上的接触部位的厚度 端子小于接触部位以外的区域中的锡或锡合金层的厚度，并且在接触部位形成作为锡或锡合金层的下层的铜锡合金层; 以及由用于连接器的金属材料制成的连接器端子，该材料具有铜或铜合金基材，其中铜 - 锡合金层在端子的表面上的接触部位处形成点状，并且锡 或锡合金层形成在表面上的其余区域中。
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公开(公告)号：US20080263567A1
公开(公告)日：2008-10-23
申请号：US12143976
申请日：2008-06-23
IPC分类号： G06F9/44
CPC分类号： H04M3/5235
摘要： This invention provides methods, systems and apparatus for processing a message of a large number of agents. An example of an apparatus includes: a memory; means for managing a state of an agent based on whether the agent is in the memory and whether there is a message, by determining a priority level of the agent based on a message inserted into the agent; means for assigning a thread to the agent if the agent is in the memory and for assigning a thread to the agent after calling the agent to the memory if the agent is not in the memory, on condition that the agent having a highest priority level has been detected; and message processing means for repeating message processing until a predetermined criterion is satisfied, in relation to the agent to which a thread has been assigned.
摘要翻译： 本发明提供了用于处理大量代理的消息的方法，系统和装置。 设备的示例包括：存储器; 用于基于所述代理是否在所述存储器中以及是否存在消息来管理代理的状态的装置，通过基于插入到所述代理中的消息确定所述代理的优先级; 用于如果所述代理在所述存储器中并且在所述代理不在所述存储器中的所述代理程序调用所述代理程序之后向所述代理分配线程的方法，条件是具有最高优先级的代理具有 被检测到 以及消息处理装置，用于相对于已经分配了线程的代理，重复消息处理直到满足预定标准。
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公开(公告)号：US20070123063A1
公开(公告)日：2007-05-31
申请号：US11698107
申请日：2007-01-26
申请人： Yoshiaki Kobayashi
发明人： Yoshiaki Kobayashi
IPC分类号： H01L21/00
CPC分类号： H01L21/67772 , H01L21/67775 , Y10S438/909
摘要： Decreasing foreign materials adhering to a semiconductor substrate to improve a yield and decreasing handling errors for the semiconductor substrate to improve an operating ratio of the semiconductor manufacturing apparatus. A sealed type container accommodating a semiconductor substrate is positioned to a load port of a semiconductor manufacturing apparatus. The semiconductor substrate is taken out of the container. An ionizer is used for static-eliminating the semiconductor substrates before and after process treatment in a transport area between the load port and a treatment section. The static-eliminated semiconductor substrate is accommodated in the container positioned to the load port. Thus, it is possible to decrease foreign materials adhering to the semiconductor substrate and errors in handling the semiconductor substrate.
摘要翻译： 降低附着于半导体基板的异物，提高半导体基板的成品率，降低处理误差，提高半导体制造装置的工作比。 容纳半导体基板的密封型容器位于半导体制造装置的负载端口。 将半导体衬底从容器中取出。 离子发生器用于在负载端口和处理部之间的输送区域中的处理处理之前和之后静电消除半导体基板。 静电消除的半导体衬底容纳在位于负载端口的容器中。 因此，可以减少粘附到半导体衬底的异物和处理半导体衬底的误差。
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公开(公告)号：US20060140388A1
公开(公告)日：2006-06-29
申请号：US11319893
申请日：2005-12-28
IPC分类号： H04M3/00
CPC分类号： H04M3/5235
摘要： This invention provides methods, systems and apparatus for processing a message of a large number of agents. An example of an apparatus includes: a memory; means for managing a state of an agent based on whether the agent is in the memory and whether there is a message, by determining a priority level of the agent based on a message inserted into the agent; means for assigning a thread to the agent if the agent is in the memory and for assigning a thread to the agent after calling the agent to the memory if the agent is not in the memory, on condition that the agent having a highest priority level has been detected; and message processing means for repeating message processing until a predetermined criterion is satisfied, in relation to the agent to which a thread has been assigned.
摘要翻译： 本发明提供了用于处理大量代理的消息的方法，系统和装置。 设备的示例包括：存储器; 用于基于所述代理是否在所述存储器中以及是否存在消息来管理代理的状态的装置，通过基于插入到所述代理中的消息确定所述代理的优先级; 用于如果所述代理在所述存储器中并且在所述代理不在所述存储器中的所述代理程序调用所述代理程序之后向所述代理分配线程的方法，条件是具有最高优先级的代理具有 被检测到 以及消息处理装置，用于相对于已经分配了线程的代理，重复消息处理直到满足预定标准。
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79.发明授权Method of manufacturing a semiconductor integrated circuit device which prevents foreign particles from being drawn into a semiconductor container containing semiconductor wafers 有权制造半导体集成电路装置的方法，该装置防止外来颗粒被吸入含有半导体晶片的半导体容器中公开(公告)号：US07048493B2
公开(公告)日：2006-05-23
申请号：US10974819
申请日：2004-10-28
IPC分类号： H01L21/69
CPC分类号： H01L21/67775 , H01L21/6735 , H01L21/67772
摘要： When a conventional semiconductor container opening/closing apparatus opens a lid of a semiconductor container, foreign particles enter into the container from outside through a gap between the container and a wall surface of the container opening/closing apparatus and adhere to a wafer in the container. A method is provided to reduce the number of foreign particles adhering to the wafer by preventing foreign particles from entering into the container at the time of opening the container by the opening/closing apparatus. To achieve this, a velocity-differential pressure ratio obtained by dividing the maximum velocity at the time of opening the lid of the container in a vertical direction to an opening of the container, by the differential pressure between the inside pressure and the outside pressure of said semiconductor manufacturing apparatus, is set to be 0.06 ((m/s) Pa) or less.
摘要翻译： 当传统的半导体容器打开/关闭装置打开半导体容器的盖子时，异物通过容器和容器打开/关闭装置的壁表面之间的间隙从外部进入容器，并且粘附到容器中的晶片 。 提供了一种方法，用于通过打开/关闭装置打开容器时防止异物进入容器，从而减少附着在晶片上的异物的数量。 为了实现这一点，通过将容器的盖子在垂直方向上打开容器的最大速度与容器的开口之间的内压和外部压力之间的压差相除来获得的速度差压比 所述半导体制造装置设定为0.06（（m / s）Pa）以下。
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公开(公告)号：US20050236265A1
公开(公告)日：2005-10-27
申请号：US10520424
申请日：2003-07-07
CPC分类号： H01H13/7006 , H01H13/702 , H01H2203/03 , H01H2203/038 , H01H2205/024 , H01H2205/026 , H01H2215/02 , H01H2221/002 , H01H2223/003
摘要： A switch integrated type housing includes a housing body, a switch button sheet, a conductor and a cover sheet. The housing body is provided with a plurality of concave sections on an outer surface of the housing body. The switch button sheet is provided on the outer surface to cover the plurality of concave sections. The conductor has a dome shape downwardly projecting and is provided in each of the plurality of concave sections to contact the switch button sheet. The cover sheet is provided between the switch button sheet and the outer surface of the housing body in a portion of the outer surface of the housing body other than the plurality of concave sections and to cover a lower surface of the conductor in each of the plurality of concave sections.
摘要翻译： 开关一体型壳体包括壳体，开关按钮片，导体和盖片。 壳体在壳体的外表面上设置有多个凹部。 开关按钮片设置在外表面上以覆盖多个凹部。 导体具有向下突出的圆顶形状，并且设置在多个凹部中的每一个中以接触开关按钮片。 覆盖片设置在开关按钮片和外壳主体的外表面之间的除了多个凹部之外的壳体的外表面的一部分中，并且在多个凹部中的每一个中覆盖导体的下表面 的凹部。
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