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公开(公告)号：US20110003167A1
公开(公告)日：2011-01-06
申请号：US12884268
申请日：2010-09-17
CPC分类号： C25D5/10 , C22C1/02 , C22C9/02 , C25D5/12 , C25D5/48 , H01R13/03 , Y10T428/12389 , Y10T428/12715
摘要： A metallic material for a connector, having a base material of a bar material or a rectangular wire material formed of copper or a copper alloy, in which a striped copper-tin alloy layer is formed in the longitudinal direction of the metallic material on a part of the surface of the metallic material, and in which a tin layer or a tin alloy layer is formed on the remaining part of the surface of the metallic material; and, a method of producing a metallic material for a connector, containing: providing a bar material or a rectangular wire material of copper or a copper alloy as a base material; forming a tin plating layer or a tin alloy plating layer on the base material, to obtain an intermediate material; and subjecting the intermediate material to reflow treatment in a stripe form in the longitudinal direction of the intermediate material.
摘要翻译： 一种用于连接器的金属材料，其具有由铜或铜合金形成的棒状材料或矩形线材的基材，其中在金属材料的纵向方向上形成条状铜 - 锡合金层 的金属材料的表面的其余部分上形成锡层或锡合金层， 以及制造用于连接器的金属材料的方法，包括：提供铜或铜合金的棒材或矩形线材作为基材; 在基材上形成镀锡层或锡合金镀层，得到中间材料; 以及使所述中间材料在所述中间材料的长度方向上以带状的方式进行回流处理。
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公开(公告)号：US20110003520A1
公开(公告)日：2011-01-06
申请号：US12885059
申请日：2010-09-17
CPC分类号： C25D3/30 , B23K26/354 , C22F1/08 , C25D3/12 , C25D5/10 , C25D5/505 , H01R13/03 , Y10S428/929 , Y10T29/49213 , Y10T428/12715 , Y10T428/12722
摘要： A connector terminal, fabricated from a metallic material for connector which material has a tin or tin alloy layer, formed on a copper or copper alloy base material, wherein the thickness of the tin or tin alloy layer at a contact site on the surface of the terminal is smaller than the thickness of the tin or tin alloy layer in the areas other than the contact site, and a copper-tin alloy layer is formed as an under layer of the tin or tin alloy layer at the contact site; and a connector terminal, fabricated from a metallic material for connector which material has a copper or copper alloy base material, wherein a copper-tin alloy layer is formed in a spot shape at a contact site on the surface of the terminal, and a tin or tin alloy layer is formed in the remaining areas on the surface.
摘要翻译： 由铜或铜合金基材上形成的具有锡或锡合金层的材料的金属连接器制成的连接器端子，其中锡或锡合金层在该表面上的接触部位的厚度 端子小于接触部位以外的区域中的锡或锡合金层的厚度，并且在接触部位形成作为锡或锡合金层的下层的铜锡合金层; 以及由用于连接器的金属材料制成的连接器端子，该材料具有铜或铜合金基材，其中铜 - 锡合金层在端子的表面上的接触部位处形成点状，并且锡 或锡合金层形成在表面上的其余区域中。
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3.发明申请COMPOSITE MATERIAL FOR ELECTRIC/ELECTRONIC PART, PRODUCTION METHOD THEREOF, AND ELECTRIC/ELECTRONIC PART 有权电子/电子零件的复合材料，其生产方法和电子/电子部件公开(公告)号：US20110091738A1
公开(公告)日：2011-04-21
申请号：US12977136
申请日：2010-12-23
CPC分类号： C23C28/00 , C08G73/14 , C09D179/08 , C23C18/1605 , C23C18/1692 , C23C26/00 , C23C28/021 , C23C28/023 , C25D5/02 , C25D5/022 , C25D5/10 , C25D5/50 , C25D5/505 , H01R13/03 , H05K9/0084 , Y10T428/12229 , Y10T428/12396 , Y10T428/12569 , Y10T428/24917 , Y10T428/31681 , Y10T428/31685
摘要： A composite material for an electric/electronic part, having a metal base, a resin film on at least a part of the metal base, and a layer of Sn or a Sn alloy on at least a part of the metal base at a site where the resin film is not provided, the layer of Sn or a Sn alloy including a solidified structure, and the resin film having a residual solvent quantity adjusted to 5% to 25% by mass.
摘要翻译： 一种用于电气/电子部件的复合材料，在金属基底的至少一部分上具有金属基底，树脂膜和至少一部分金属基底上的Sn或Sn合金层， 不设置树脂膜，包含固化结构的Sn或Sn合金层，残留溶剂量调整为5〜25质量％的树脂膜。
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