公开(公告)号：US10669153B2

公开(公告)日：2020-06-02

申请号：US15602332

申请日：2017-05-23

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Steven J. Holmes ,  Emily R. Kinser ,  Qinghuang Lin ,  Nathan P. Marchack ,  Roy R. Yu

IPC: G01N27/327 ,  B82Y15/00 ,  C12Q1/00 ,  B82Y40/00 ,  C12Q1/26

Abstract: A biosensor includes an array of electrically conductive nanorods formed on a substrate. The nanorods each includes a nanoscale porous coating formed on a surface of the nanorods from silicon dioxide layers. An enzyme coating is bound to the porous coating.

公开(公告)号：US10583471B2

公开(公告)日：2020-03-10

申请号：US15810483

申请日：2017-11-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Steven J. Holmes ,  Emily R. Kinser ,  Qinghuang Lin ,  Nathan P. Marchack ,  Roy R. Yu

IPC: B08B17/02 ,  A61B5/00 ,  A61B5/04 ,  B08B17/06 ,  B82Y15/00 ,  B82Y40/00

Abstract: A biosensor includes an array of metal nanorods formed on a substrate. An electropolymerized conductor is formed over tops of a portion of the nanorods to form a reservoir between the electropolymerized conductor and the substrate. The electropolymerized conductor includes pores that open and close responsively to electrical signals applied to the nanorods. A dispensing material is loaded in the reservoir to be dispersed in accordance with open pores.

公开(公告)号：US20200009844A1

公开(公告)日：2020-01-09

申请号：US16040429

申请日：2018-07-19

Applicant: International Business Machines Corporation

Inventor： Roy R. Yu ,  Wilfried Haensch

IPC: B32B37/02 ,  H01L23/473 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L25/00 ,  H01L23/498 ,  H01L23/48

Abstract: A 4D device comprises a 2D multi-core logic and a 3D memory stack connected through the memory stack sidewall using a fine pitch T&J connection. The 3D memory in the stack is thinned from the original wafer thickness to no remaining Si. A tongue and groove device at the memory wafer top and bottom surfaces allows an accurate stack alignment. The memory stack also has micro-channels on the backside to allow fluid cooling. The memory stack is further diced at the fixed clock-cycle distance and is flipped on its side and re-assembled on to a template into a pseudo-wafer format. The top side wall of the assembly is polished and built with BEOL to fan-out and use the T&J fine pitch connection to join to the 2D logic wafer. The other side of the memory stack is polished, fanned-out, and bumped with C4 solder. The invention also comprises a process for manufacturing the device. In another aspect, the invention comprises a 4D process and device for over 50× greater than 2D memory density per die and an ultra high density memory.

公开(公告)号：US20180339321A1

公开(公告)日：2018-11-29

申请号：US15810483

申请日：2017-11-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Steven J. Holmes ,  Emily R. Kinser ,  Qinghuang Lin ,  Nathan P. Marchack ,  Roy R. Yu

IPC: B08B17/02 ,  A61B5/00 ,  A61B5/04

CPC classification number: B08B17/02 ,  A61B5/04001 ,  A61B5/4839 ,  A61B2562/0209 ,  A61B2562/0285 ,  A61B2562/046 ,  A61B2562/125 ,  B08B17/065 ,  B82Y15/00 ,  B82Y40/00

Abstract: A biosensor includes an array of metal nanorods formed on a substrate. An electropolymerized conductor is formed over tops of a portion of the nanorods to form a reservoir between the electropolymerized conductor and the substrate. The electropolymerized conductor includes pores that open and close responsively to electrical signals applied to the nanorods. A dispensing material is loaded in the reservoir to be dispersed in accordance with open pores.

公开(公告)号：US20180339320A1

公开(公告)日：2018-11-29

申请号：US15602363

申请日：2017-05-23

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Steven J. Holmes ,  Emily R. Kinser ,  Qinghuang Lin ,  Nathan P. Marchack ,  Roy R. Yu

IPC: B08B17/02 ,  A61B5/04 ,  A61B5/00

Abstract: A biosensor includes an array of metal nanorods formed on a substrate. An electropolymerized conductor is formed over tops of a portion of the nanorods to form a reservoir between the electropolymerized conductor and the substrate. The electropolymerized conductor includes pores that open and close responsively to electrical signals applied to the nanorods. A dispensing material is loaded in the reservoir to be dispersed in accordance with open pores.

公开(公告)号：US20170192254A1

公开(公告)日：2017-07-06

申请号：US14985627

申请日：2015-12-31

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Emily R. Kinser ,  John U. Knickerbocker ,  Roy R. Yu

IPC: G02C7/08 ,  G02C7/04

CPC classification number: G02C7/083 ,  B29D11/00028 ,  B29D11/00807 ,  B29D11/00826 ,  G02C7/04

Abstract: Lenses and methods for adjusting the focus of a lens include dividing multiple light sensors in a lens into four quadrants. A position of the lens relative to occlusion along a top and bottom edge of the lens is determined based on lengths of bit sequences from light sensors in each of the four quadrants. An optimal focal length for the lens is determined based on the position of the lens. The focal length of the lens is adjusted to match the optimal focal length.

公开(公告)号：US20150270246A1

公开(公告)日：2015-09-24

申请号：US14221477

申请日：2014-03-21

Applicant: International Business Machines Corporation

Inventor： Daniel C. Edelstein ,  Michael A. Gaynes ,  Thomas M. Shaw ,  Bucknell C. Webb ,  Roy R. Yu

IPC: H01L25/065 ,  H01L21/768 ,  H01L23/29 ,  H01L23/538 ,  H01L23/31 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L23/293 ,  H01L23/291 ,  H01L23/3171 ,  H01L23/3192 ,  H01L2224/11

Abstract: A volumetric integrated circuit manufacturing method is provided. The method includes assembling a slab element of elongate chips, exposing a wiring layer between adjacent elongate chips of the slab element, metallizing a surface of the slab element at and around the exposed wiring layer to form a metallized surface electrically coupled to the wiring layer and passivating the metallized surface to hermetically seal the metallized surface.

Abstract translation: 提供了体积集成电路制造方法。 该方法包括组装细长芯片的平板元件，暴露板坯元件的相邻细长芯片之间的布线层，将暴露的布线层周围和周围的平板元件的表面金属化以形成电耦合到布线层的金属化表面，以及 钝化金属化表面以气密地密封金属化表面。