MULTILAYERED BOTTOM ELECTRODE FOR MTJ-CONTAINING DEVICES

    公开(公告)号:US20210066578A1

    公开(公告)日:2021-03-04

    申请号:US16552647

    申请日:2019-08-27

    IPC分类号: H01L43/02 H01L27/22 H01L43/12

    摘要: A multilayered bottom electrode for a magnetic tunnel junction (MTJ) containing device is provided that includes, from bottom to top, a base segment having a first diameter and composed of a remaining portion of a first bottom electrode metal-containing layer, a middle segment having a second diameter and composed of a remaining portion of a second bottom electrode metal-containing layer, and an upper segment having a third diameter and composed of a remaining portion of a third bottom electrode metal-containing layer, wherein the first diameter is greater than the second diameter, and the third diameter is equal to, or less than, the second diameter. The wider base segment of each multilayered bottom electrode prevents tilting and/or bowing of the resultant bottom electrode. Thus, a stable bottom electrode is provided.

    MTJ containing device with replacement top electrode

    公开(公告)号:US10903417B2

    公开(公告)日:2021-01-26

    申请号:US16266249

    申请日:2019-02-04

    IPC分类号: H01L43/12 H01L43/02 H01L27/22

    摘要: A method of forming a magnetic tunnel junction (MTJ) containing device is provided in which a patterned sacrificial material is present atop a MTJ pillar that is located on a bottom electrode. A passivation material liner and a dielectric material portion laterally surround the MTJ pillar and the patterned sacrificial material. The patterned sacrificial material is removed from above the MTJ pillar and replaced with a top electrode. A seam is present in the top electrode. The method mitigates the possibility of depositing resputtered conductive metal particles on a sidewall of the MTJ pillar. Thus, improved device performance, in terms of a reduction in failure mode, can be obtained.

    STRUCTURED PEDESTAL FOR MTJ CONTAINING DEVICES

    公开(公告)号:US20200235286A1

    公开(公告)日:2020-07-23

    申请号:US16254021

    申请日:2019-01-22

    IPC分类号: H01L43/02 H01L43/12

    摘要: A magnetic tunnel junction (MTJ) containing device is provided that includes an undercut conductive pedestal structure having a concave sidewall positioned between a bottom electrode and a MTJ pillar. The geometric nature of such a conductive pedestal structure makes the pedestal structure unlikely to be resputtered and deposited on a sidewall of the MTJ pillar, especially the sidewall of the tunnel barrier of the MTJ pillar. Thus, electrical shorts caused by depositing resputtered conductive metal particles on the sidewall of the tunnel barrier of the MTJ pillar are substantially reduced.

    MAGNETIC TUNNEL JUNCTION (MTJ) HARD MASK ENCAPSULATION TO PREVENT REDEPOSITION

    公开(公告)号:US20200220073A1

    公开(公告)日:2020-07-09

    申请号:US16239012

    申请日:2019-01-03

    IPC分类号: H01L43/12 H01L27/22 H01L43/02

    摘要: A semiconductor structure and fabrication method of forming a semiconductor structure. In the method there is provided an electrically conductive structure embedded in an interconnect dielectric material layer of a magnetoresistive random access memory device. A conductive landing pad is located on a surface of the electrically conductive structure. A multilayered magnetic tunnel junction (MTJ) structure and an MTJ cap layer is formed on the landing pad. Then there is formed a metal hardmask layer on a surface of said MTJ cap layer, the etch stop layer being subject to lithographic patterning and etching to form a patterned hardmask pillar structure. An encapsulating is performed to encapsulate, using an insulating material film, a top surface and sidewall surfaces of said patterned hardmask layer. Subsequent etch processing forms an MTJ stack having sidewalls aligned to the patterned hardmask without impacting MTJ stack performance.