DETERMINING PHYSICAL PROPERTY OF SUBSTRATE
    72.
    发明申请
    DETERMINING PHYSICAL PROPERTY OF SUBSTRATE 有权
    确定基材的物理性质

    公开(公告)号:US20080146120A1

    公开(公告)日:2008-06-19

    申请号:US11611640

    申请日:2006-12-15

    IPC分类号: B24B49/00 G01B11/24

    摘要: A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

    摘要翻译: 确定基板的物理性质的方法包括记录从基板获得的第一光谱,第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号,第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机,端点确定模块和数据库。

    Spectra based endpointing for chemical mechanical polishing
    74.
    发明授权
    Spectra based endpointing for chemical mechanical polishing 有权
    基于光谱的化学机械抛光终点

    公开(公告)号:US08815109B2

    公开(公告)日:2014-08-26

    申请号:US13339057

    申请日:2011-12-28

    IPC分类号: C03C15/00

    摘要: A computer implemented method of monitoring a polishing process includes, for each sweep of a plurality of sweeps of an optical sensor across a substrate undergoing polishing, obtaining a plurality of current spectra, each current spectrum of the plurality of current spectra being a spectrum resulting from reflection of white light from the substrate, for each sweep of the plurality of sweeps, determining a difference between each current spectrum and each reference spectrum of a plurality of reference spectra to generate a plurality of differences, for each sweep of the plurality of sweeps, determining a smallest difference of the plurality of differences, thus generating a sequence of smallest difference, and determining a polishing endpoint based on the sequence of smallest differences.

    摘要翻译: 监测抛光过程的计算机实现的方法包括:对于经历抛光的衬底上的光学传感器的多个扫描的每次扫描,获得多个电流光谱,多个电流光谱的每个电流光谱是由 对于多个扫描的每次扫描,从基板反射白光,确定多个参考光谱的每个当前光谱和每个参考光谱之间的差异,以对于多个扫描的每次扫描产生多个差异, 确定多个差异的最小差异,从而产生最小差异的序列,并且基于最小差异的序列确定抛光端点。

    Methods of using optical metrology for feed back and feed forward process control
    75.
    发明授权
    Methods of using optical metrology for feed back and feed forward process control 有权
    使用光学计量学进行反馈和前馈过程控制的方法

    公开(公告)号:US08579675B2

    公开(公告)日:2013-11-12

    申请号:US12625345

    申请日:2009-11-24

    IPC分类号: B24B49/12

    摘要: A method includes polishing a substrate on a first platen using a first set of parameters, obtaining a plurality of measured spectra from at least two zones, comparing the plurality of measured spectra with a reference spectrum to evaluate the thickness of each of the at least two zones of the substrate, comparing a thickness of a first zone with a thickness of a second zone, determining whether the thickness of the first zone falls within a predetermined range of the thickness of the second zone, and if the thickness does not fall within the predetermined range, at least one of a) adjusting at least one parameter of the first set and polishing a second substrate on the first platen using the adjusted parameters, or b) adjusting at least one parameter of a second set and polishing the substrate on a second platen using the adjusted parameters.

    摘要翻译: 一种方法包括使用第一组参数来抛光第一台板上的基板,从至少两个区域获得多个测量光谱,将多个测量光谱与参考光谱进行比较,以评估至少两个 区域,比较第一区域的厚度和第二区域的厚度,确定第一区域的厚度是否落在第二区域的厚度的预定范围内,并且如果厚度不在第二区域的厚度内 预定范围,以下至少一个:a)调整第一组的至少一个参数并使用经调整的参数来研磨第一台上的第二基板,或b)调整第二组的至少一个参数并在一个 第二个压盘使用调整参数。

    Spectrographic monitoring of a substrate during processing using index values
    76.
    发明授权
    Spectrographic monitoring of a substrate during processing using index values 有权
    使用指标值对处理过程中的基板进行光谱监测

    公开(公告)号:US08554351B2

    公开(公告)日:2013-10-08

    申请号:US13599766

    申请日:2012-08-30

    IPC分类号: G06F19/00 B24B49/00 G01B11/28

    摘要: Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.

    摘要翻译: 描述了在化学机械抛光期间用于光谱监测基底的方法,系统和装置。 一方面,计算机实现的方法包括存储具有多个参考光谱的库,多个参考光谱的每个参考光谱具有存储的相关联的索引值,在抛光期间原位测量光谱序列以获得测量的光谱 ,对于光谱序列的每个测量光谱,找到最佳匹配参考光谱以产生最佳匹配参考光谱序列,从最佳匹配参考光谱序列确定每个最佳匹配光谱的相关索引值,以产生序列 索引值,将线性函数拟合到索引值序列,以及当线性函数匹配或超过目标索引时或者当来自确定步骤的相关索引值匹配或超过目标索引时停止抛光。

    Adjusting Polishing Rates by Using Spectrographic Monitoring of a Substrate During Processing
    77.
    发明申请
    Adjusting Polishing Rates by Using Spectrographic Monitoring of a Substrate During Processing 有权
    通过在处理过程中使用基板的光谱监测来调整抛光速率

    公开(公告)号:US20130204424A1

    公开(公告)日:2013-08-08

    申请号:US13725691

    申请日:2012-12-21

    IPC分类号: H01L21/302

    摘要: A computer-implemented method includes receiving a sequence of current spectra of reflected light from a substrate; comparing each current spectrum from the sequence of current spectra to a plurality of reference spectra from a reference spectra library to generate a sequence of best-match reference spectra; determining a goodness of fit for the sequence of best-match reference spectra; and determining at least one of whether to adjust a polishing rate or an adjustment for the polishing rate, based on the goodness of fit.

    摘要翻译: 计算机实现的方法包括从基板接收反射光的当前光谱序列; 将来自当前光谱序列的每个当前光谱与来自参考光谱库的多个参考光谱进行比较,以生成最佳匹配参考光谱的序列; 确定最佳匹配参考光谱序列的拟合优度; 以及基于拟合优度确定是否调整抛光速率或抛光速率的调整中的至少一个。

    Multiple libraries for spectrographic monitoring of zones of a substrate during processing
    78.
    发明授权
    Multiple libraries for spectrographic monitoring of zones of a substrate during processing 有权
    用于在处理期间对衬底的区域进行光谱监测的多个库

    公开(公告)号:US08392012B2

    公开(公告)日:2013-03-05

    申请号:US12258923

    申请日:2008-10-27

    IPC分类号: G06F19/00

    摘要: A computer-implemented method includes receiving a first sequence of current spectra of reflected light from a first zone of a substrate. A second sequence of current spectra of reflected light from a second zone of the substrate is received. Each current spectrum from the first sequence of current spectra is compared to a plurality of reference spectra from a first reference spectra library to generate a first sequence of best-match reference spectra. Each current spectrum from the second sequence of current spectra is compared to a plurality of reference spectra from a second reference spectra library to generate a second sequence of best-match reference spectra. The second reference spectra library is distinct from the first reference spectra library.

    摘要翻译: 计算机实现的方法包括从基板的第一区域接收反射光的当前光谱的第一序列。 接收来自基板的第二区域的反射光的第二序列的电流光谱。 将来自当前光谱的第一序列的每个当前光谱与来自第一参考光谱库的多个参考光谱进行比较,以生成最佳匹配参考光谱的第一序列。 将来自当前光谱的第二序列的每个当前光谱与来自第二参考光谱库的多个参考光谱进行比较,以生成第二序列的最佳匹配参考光谱。 第二个参考光谱库与第一个参考光谱库不同。

    SPECTROGRAPHIC MONITORING OF A SUBSTRATE DURING PROCESSING USING INDEX VALUES
    79.
    发明申请
    SPECTROGRAPHIC MONITORING OF A SUBSTRATE DURING PROCESSING USING INDEX VALUES 有权
    使用指数值处理过程中基板的光谱监测

    公开(公告)号:US20120323355A1

    公开(公告)日:2012-12-20

    申请号:US13599766

    申请日:2012-08-30

    IPC分类号: G05B19/18

    摘要: Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.

    摘要翻译: 描述了在化学机械抛光期间用于光谱监测基底的方法,系统和装置。 一方面,计算机实现的方法包括存储具有多个参考光谱的库,多个参考光谱的每个参考光谱具有存储的相关联的索引值,在抛光期间原位测量光谱序列以获得测量的光谱 ,对于光谱序列的每个测量光谱,找到最佳匹配参考光谱以产生最佳匹配参考光谱序列,从最佳匹配参考光谱序列确定每个最佳匹配光谱的相关索引值,以产生序列 索引值,将线性函数拟合到索引值序列,以及当线性函数匹配或超过目标索引时或者当来自确定步骤的相关索引值匹配或超过目标索引时停止抛光。

    Spectrographic monitoring of a substrate during processing using index values
    80.
    发明授权
    Spectrographic monitoring of a substrate during processing using index values 有权
    使用指标值对处理过程中的基板进行光谱监测

    公开(公告)号:US08260446B2

    公开(公告)日:2012-09-04

    申请号:US12699014

    申请日:2010-02-02

    IPC分类号: G06F19/00 B24B49/00 G01B11/28

    摘要: Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.

    摘要翻译: 描述了在化学机械抛光期间用于光谱监测基底的方法,系统和装置。 一方面,计算机实现的方法包括存储具有多个参考光谱的库,多个参考光谱的每个参考光谱具有存储的相关联的索引值,在抛光期间原位测量光谱序列以获得测量的光谱 ,对于光谱序列的每个测量光谱,找到最佳匹配参考光谱以产生最佳匹配参考光谱序列,从最佳匹配参考光谱序列确定每个最佳匹配光谱的相关索引值,以产生序列 索引值,将线性函数拟合到索引值序列,以及当线性函数匹配或超过目标索引时或者当来自确定步骤的相关索引值匹配或超过目标索引时停止抛光。