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公开(公告)号：US11839702B2
公开(公告)日：2023-12-12
申请号：US17749270
申请日：2022-05-20
发明人： Duncan J. Maitland , Todd L Landsman , John Horn , Landon Nash , Chung Yeh
IPC分类号： A61F2/945 , A61B17/12 , A61L31/14 , A61F2/954 , A61F2/07 , A61L31/06 , A61L31/18 , A61F2/82 , A61B90/00 , A61B17/00 , A61F2/89
CPC分类号： A61L31/146 , A61B17/12113 , A61B17/12118 , A61B17/12181 , A61F2/07 , A61F2/945 , A61F2/954 , A61L31/06 , A61L31/18 , A61B2017/00004 , A61B2017/00871 , A61B2090/3966 , A61F2/89 , A61F2002/077 , A61F2002/826 , A61F2210/0023 , A61F2250/0098 , A61L2400/04 , A61L2400/16
摘要： An embodiment includes a process for treating an abdominal aortic aneurysm (AAA) endoleak with a shape memory polymer (SMP) foam device. First, a bifurcated stent graft is placed within the aneurysm while a micro guidewire is positioned within the aneurysm for future catheter access. Second, after placing the iliac graft extension, a catheter is introduced over wire to deliver embolic foams. Third, embolic foams expand and conform to the aneurysm wall. Fourth, embolic foams create a stable thrombus to prevent endoleak formation by isolating peripheral vessels from the aneurysm volume.
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公开(公告)号：US20220323079A1
公开(公告)日：2022-10-13
申请号：US17846449
申请日：2022-06-22
发明人： Duncan J. Maitland , Todd L. Landsman , Jennifer N. Rodriguez , Anthony J. Boyle , Alan C. Glowczwski , Mark A. Wierzbicki
IPC分类号： A61B17/12
摘要： An embodiment includes a system comprising: an outer conduit; a shape memory polymer (SMP) foam; a metal backbone including: (a)(i) a first portion that extends from the SMP foam proximal end to the SMP foam distal end and which is generally covered by the SMP foam, and (a)(ii) a distal portion that extends distally from the SMP foam distal end and which is not covered by the SMP foam; wherein: (b)(i) SMP foam and the metal backbone are both included within the outer conduit adjacent to the outer conduit distal end; (b)(ii) the metal backbone distal portion transitions from a secondary shape that is uncoiled to a primary shape that is coiled; and (b)(iii) the metal backbone distal portion is in the metal backbone distal portion secondary shape and is located between the SMP foam distal end and the distal end of the outer conduit.
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公开(公告)号：US11369385B2
公开(公告)日：2022-06-28
申请号：US17032270
申请日：2020-09-25
发明人： Duncan J. Maitland , Todd L. Landsman , Jennifer N. Rodriguez , Anthony J. Boyle , Alan C. Glowczwski , Mark A. Wierzbicki
摘要： An embodiment includes a system comprising: an outer conduit; a shape memory polymer (SMP) foam; a metal backbone including: (a)(i) a first portion that extends from the SMP foam proximal end to the SMP foam distal end and which is generally covered by the SMP foam, and (a)(ii) a distal portion that extends distally from the SMP foam distal end and which is not covered by the SMP foam; wherein: (b)(i) SMP foam and the metal backbone are both included within the outer conduit adjacent to the outer conduit distal end; (b)(ii) the metal backbone distal portion transitions from a secondary shape that is uncoiled to a primary shape that is coiled; and (b)(iii) the metal backbone distal portion is in the metal backbone distal portion secondary shape and is located between the SMP foam distal end and the distal end of the outer conduit.
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公开(公告)号：US20200222595A1
公开(公告)日：2020-07-16
申请号：US16777190
申请日：2020-01-30
摘要： An embodiment includes a system comprising: a substrate of a medical device; an un-foamed polyurethane coating directly contacting the substrate and fixedly attached to the substrate; a thermoset polyurethane shape memory polymer (SMP) foam, having first and second states, which directly contacts the polyurethane coating and fixedly attaches to the polyurethane coating; wherein the polyurethane coating fixedly attaches the SMP foam to the substrate. Other embodiments are described herein.
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公开(公告)号：US20240260967A1
公开(公告)日：2024-08-08
申请号：US18618018
申请日：2024-03-27
发明人： Duncan J. Maitland , Todd L. Landsman , Jennifer N. Rodriguez , Anthony J. Boyle , Alan C. Glowczwski , Mark A. Wierzbicki
CPC分类号： A61B17/1219 , A61B17/12109 , A61B17/1215 , A61B17/12172 , A61B2017/00526 , A61B2017/00871 , A61B2017/00898 , A61B2017/12063
摘要： An embodiment includes a system comprising: an outer conduit; a shape memory polymer (SMP) foam; a metal backbone including: (a)(i) a first portion that extends from the SMP foam proximal end to the SMP foam distal end and which is generally covered by the SMP foam, and (a)(ii) a distal portion that extends distally from the SMP foam distal end and which is not covered by the SMP foam; wherein: (b)(i) SMP foam and the metal backbone are both included within the outer conduit adjacent to the outer conduit distal end; (b)(ii) the metal backbone distal portion transitions from a secondary shape that is uncoiled to a primary shape that is coiled; and (b)(iii) the metal backbone distal portion is in the metal backbone distal portion secondary shape and is located between the SMP foam distal end and the distal end of the outer conduit.
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公开(公告)号：US11369720B2
公开(公告)日：2022-06-28
申请号：US16777190
申请日：2020-01-30
摘要： An embodiment includes a system comprising: a substrate of a medical device; an un-foamed polyurethane coating directly contacting the substrate and fixedly attached to the substrate; a thermoset polyurethane shape memory polymer (SMP) foam, having first and second states, which directly contacts the polyurethane coating and fixedly attaches to the polyurethane coating; wherein the polyurethane coating fixedly attaches the SMP foam to the substrate. Other embodiments are described herein.
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公开(公告)号：US11090408B2
公开(公告)日：2021-08-17
申请号：US16466073
申请日：2017-12-06
IPC分类号： A61L24/00 , A61L24/04 , C08G18/10 , C08G18/73 , C08G18/83 , C08J9/36 , A61L15/26 , A61L27/50 , A61L31/14 , A61L31/16 , A61L15/46 , A61L27/18 , A61L27/56 , A61L15/42 , A61L31/06 , A61L27/54
摘要： An embodiment includes a system comprising a thermoset polyurethane shape memory polymer (SMP) foam that includes at least one antimicrobial agent. The antimicrobial agent may include at least one phenolic acid that is a pendent group chemically bonded to a polyurethane polymer chain of the SMP foam. Other embodiments are described herein.
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公开(公告)号：US10786261B2
公开(公告)日：2020-09-29
申请号：US15754330
申请日：2016-09-02
发明人： Duncan J. Maitland , Todd L. Landsman , Jennifer N. Rodriguez , Anthony J. Boyle , Alan C. Glowczwski , Mark A. Wierzbicki
摘要： An embodiment includes a system comprising: an outer conduit; a shape memory polymer (SMP) foam; a metal backbone including: (a)(i) a first portion that extends from the SMP foam proximal end to the SMP foam distal end and which is generally covered by the SMP foam, and (a)(ii) a distal portion that extends distally from the SMP foam distal end and which is not covered by the SMP foam; wherein: (b)(i) SMP foam and the metal backbone are both included within the outer conduit adjacent to the outer conduit distal end; (b)(ii) the metal backbone distal portion transitions from a secondary shape that is uncoiled to a primary shape that is coiled; and (b)(iii) the metal backbone distal portion is in the metal backbone distal portion secondary shape and is located between the SMP foam distal end and the distal end of the outer conduit.
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公开(公告)号：US20190282726A1
公开(公告)日：2019-09-19
申请号：US16466073
申请日：2017-12-06
摘要： An embodiment includes a system comprising a thermoset polyurethane shape memory polymer (SMP) foam that includes at least one antimicrobial agent. The antimicrobial agent may include at least one phenolic acid that is a pendent group chemically bonded to a polyurethane polymer chain of the SMP foam. Other embodiments are described herein.
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公开(公告)号：US20240042107A1
公开(公告)日：2024-02-08
申请号：US18486236
申请日：2023-10-13
CPC分类号： A61L31/06 , A61L31/146 , A61F2/07 , A61B17/12181 , A61B17/12118 , A61B17/12113 , A61L31/148 , A61L31/18
摘要： An embodiment includes an apparatus comprising: a shape memory polymer (SMP) foam having an outside surface; and a membrane that encapsulates at least 50% of the outside surface of the SMP foam; wherein (a) the SMP foam includes a thermoset SMP, and (b) the membrane includes a thermoplastic polymer. Other embodiments are addressed herein.
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