公开(公告)号：US06647782B2

公开(公告)日：2003-11-18

申请号：US10194305

申请日：2002-07-15

申请人： Inao Toyoda

发明人： Inao Toyoda

IPC分类号： G01N2722

CPC分类号： G01N27/225

摘要： A humidity sensor has two detection electrodes located on a semiconductor substrate and a humidity sensitive film. The capacitance of the film changes in response to humidity. The sensor includes a reference capacitor and a feedback capacitor. An electrode of each capacitor is located beneath one of the detection electrodes to limit the size of the device.

摘要翻译： 湿度传感器具有位于半导体衬底和湿度敏感膜上的两个检测电极。 膜的电容随湿度而变化。 传感器包括参考电容和反馈电容。 每个电容器的电极位于一个检测电极下方以限制器件的尺寸。

公开(公告)号：US06628501B2

公开(公告)日：2003-09-30

申请号：US10151009

申请日：2002-05-21

申请人： Inao Toyoda

发明人： Inao Toyoda

IPC分类号： H01G406

CPC分类号： G01N27/225

摘要： A capacitive moisture sensor includes a semiconductor substrate, which has a hole. A silicon oxide film is located to close the hole. A pair of electrodes is located on the silicon oxide film. Each electrode is in the shape of a comb, and the electrodes mesh with each other. A silicon nitride film is located on the electrodes to cover and protect the electrodes and on the silicon oxide film between the electrodes. A moisture-sensitive film, the dielectric constant of which varies in response to ambient moisture, is located on the silicon nitride film. The thickness of the substrate is substantially zero under the electrodes to eliminate the parasitic capacitance between each electrode and the substrate.

摘要翻译： 电容式湿度传感器包括具有孔的半导体衬底。 定位氧化硅膜以封闭孔。 一对电极位于氧化硅膜上。 每个电极是梳子的形状，并且电极彼此啮合。 氮化硅膜位于电极上，以覆盖和保护电极和电极之间的氧化硅膜。 其湿度敏感膜的介电常数根据环境湿度而变化，位于氮化硅膜上。 基板的厚度在电极下基本为零，以消除每个电极和基板之间的寄生电容。

公开(公告)号：US06579740B2

公开(公告)日：2003-06-17

申请号：US09960360

申请日：2001-09-24

申请人： Inao Toyoda

发明人： Inao Toyoda

IPC分类号： H01L2100

CPC分类号： H01L31/108

摘要： In a thin-film infrared sensor, (100)-oriented semiconductor substrate is used for the sensor fabrication. A surface of the substrate is partially masked to provide an unmasked section where a concave is made and a masked section on the back side of an alley between thin-film sensing areas. An anisotropic etching using an etchant such as KOH is applied to the masked substrate to make the concave (the thin-film sensing areas) and to provide an unetched portion of the substrate at the bottom of the concave on the back side of the alley between the sensing areas. The unetched portion of the substrate makes a rim to support the sensing areas. High concentration Boron doping is not necessary. Thus, it is possible to reduce deformation of thin-film sensing areas caused by a stress in the rim and to reinforce the rim.

摘要翻译： 在薄膜红外传感器中，（100）取向半导体衬底用于传感器制造。 基板的表面部分地被掩蔽，以提供制造凹部的未掩模部分和在薄膜感测区域之间的胡同后侧的掩蔽部分。 使用诸如KOH的蚀刻剂的各向异性蚀刻被施加到被掩蔽的基板上以形成凹部（薄膜感测区域），并且在凹槽的背面的凹部的底部提供基底的未蚀刻部分， 感应区域。 衬底的未蚀刻部分形成边缘以支撑感测区域。 高浓度硼掺杂是不必要的。 因此，可以减小由于边缘中的应力引起的薄膜感测区域的变形并加强边缘。

公开(公告)号：US06462328B2

公开(公告)日：2002-10-08

申请号：US09920720

申请日：2001-08-03

申请人： Inao Toyoda

发明人： Inao Toyoda

IPC分类号： H01J4014

CPC分类号： H01L27/1443

摘要： In a sensor chip for forming the light receiving elements of a photo-detection sensor, p-type regions of the photodiodes are formed in a surface portion of an n-type epitaxial layer, and they are respectively contacted with electrodes. A deep n+-region is formed in the part of the n-type epitaxial layer between the adjacent p-type regions so as to reach a buried n+-region. Carriers created with the projection of light in the photodiodes are trapped by the deep n+-region (30). An aluminum film serving as a light shielding film is arranged over the part of a silicon substrate between the regions for forming the photodiodes. Thus, the photodiodes can be operated independently from each other.

公开(公告)号：US08028584B2

公开(公告)日：2011-10-04

申请号：US12219785

申请日：2008-07-29

申请人： Kiyoshi Otsuka ,  Yasuaki Makino ,  Tsuyoshi Fukada ,  Inao Toyoda ,  Naoki Kakoiyama

发明人： Kiyoshi Otsuka ,  Yasuaki Makino ,  Tsuyoshi Fukada ,  Inao Toyoda ,  Naoki Kakoiyama

IPC分类号： G01L7/00

CPC分类号： G01L19/0092 ,  G01L19/0069 ,  G01L19/0084 ,  G01L19/141 ,  G01L19/143 ,  H01L24/32 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T29/49002 ,  H01L2924/00014 ,  H01L2924/00

摘要： A pressure sensor includes: a housing having a pressure introduction port; and a connector case integrated with the housing. The connector case includes: a protruding portion that protrudes in the pressure introduction port along with the introduction direction from one end of the connector case, and has a concavity hollowed in a direction perpendicular to the introduction direction; a sensor chip having a pressure gauge on one surface of the chip in the concavity; a terminal having one end inserted and molded in the connector case; and a bonding wire that electrically connects the sensor chip and the one end of the terminal. The connector case seals a connection portion between the bonding wire and the terminal, a connection portion between the boding wire and the sensor chip, and the bonding wire.

摘要翻译： 压力传感器包括：具有压力引入口的壳体; 以及与壳体一体化的连接器壳体。 连接器壳体包括：突出部，其从连接器壳体的一端沿着引入方向在压力引入口中突出，并且具有沿与引入方向垂直的方向中空的凹部; 传感器芯片，其在所述凹部中在所述芯片的一个表面上具有压力计; 端子，其一端插入并模制在连接器壳体中; 以及将传感器芯片和端子的一端电连接的接合线。 连接器壳体密封接合线和端子之间的连接部分，在编织线和传感器芯片之间的连接部分以及接合线。

公开(公告)号：US07536916B2

公开(公告)日：2009-05-26

申请号：US11898519

申请日：2007-09-13

申请人： Hiroshige Matsui ,  Inao Toyoda ,  Hisayuki Takeuchi

发明人： Hiroshige Matsui ,  Inao Toyoda ,  Hisayuki Takeuchi

IPC分类号： G01L9/00

CPC分类号： G01L19/04 ,  G01L19/0645 ,  G01L23/18

摘要： The pressure sensor of the type having a pressure transmitting member transmitting a pressure received by a pressure-receiving diaphragm to a sensor chip is provided with a heat radiating member. This heat radiating member substantially suppresses the heat transferring from the pressure-receiving diaphragm to the sensor chip, to thereby preventing the pressure sensor from malfunction.

摘要翻译： 具有将由受压隔膜接受的压力传递到传感器芯片的压力传递部件的类型的压力传感器设置有散热构件。 该散热构件基本上抑制从受压隔膜向传感器芯片的传热，从而防止压力传感器发生故障。

公开(公告)号：US07497125B2

公开(公告)日：2009-03-03

申请号：US11826844

申请日：2007-07-19

申请人： Inao Toyoda

发明人： Inao Toyoda

IPC分类号： G01L7/08

CPC分类号： G01L9/006 ,  G01L19/04 ,  G01L23/18

摘要： A pressure sensor has a diaphragm with a first layer and a second layer, a pressure transmitting member being in contact with the second layer, and a sensing element. The diaphragm is deformable in response to a pressure applied on a front surface of the first layer. The transmitting member transmits this pressure to the sensing element. The sensing element detects the pressure. A heat applied to the diaphragm induces the layers to be shifted toward the transmitting member or the opposite side of the transmitting member due to a shape of the diaphragm. The layers of the diaphragm have thermal expansion coefficients differing from each other. A thermal deformation of the layers caused by the thermal expansion difference between the layers cancels out the thermal deformation of the layers originated in the shape of the diaphragm.

摘要翻译： 压力传感器具有带有第一层和第二层的隔膜，与第二层接触的压力传递构件和感测元件。 隔膜响应于施加在第一层的前表面上的压力而变形。 传递构件将该压力传递到感测元件。 传感元件检测压力。 施加到隔膜的热量由于隔膜的形状而导致层向发送构件或透射构件的相反侧移动。 隔膜的层具有彼此不同的热膨胀系数。 由层之间的热膨胀差导致的层的热变形消除了起源于隔膜形状的层的热变形。

公开(公告)号：US20090049921A1

公开(公告)日：2009-02-26

申请号：US12219785

申请日：2008-07-29

申请人： Kiyoshi Otsuka ,  Yasuaki Makino ,  Tsuyoshi Fukada ,  Inao Toyoda ,  Naoki Kakoiyama

发明人： Kiyoshi Otsuka ,  Yasuaki Makino ,  Tsuyoshi Fukada ,  Inao Toyoda ,  Naoki Kakoiyama

IPC分类号： G01L7/00 ,  H01S4/00

CPC分类号： G01L19/0092 ,  G01L19/0069 ,  G01L19/0084 ,  G01L19/141 ,  G01L19/143 ,  H01L24/32 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T29/49002 ,  H01L2924/00014 ,  H01L2924/00

摘要： A pressure sensor includes: a housing having a pressure introduction port; and a connector case integrated with the housing. The connector case includes: a protruding portion that protrudes in the pressure introduction port along with the introduction direction from one end of the connector case, and has a concavity hollowed in a direction perpendicular to the introduction direction; a sensor chip having a pressure gauge on one surface of the chip in the concavity; a terminal having one end inserted and molded in the connector case; and a bonding wire that electrically connects the sensor chip and the one end of the terminal. The connector case seals a connection portion between the bonding wire and the terminal, a connection portion between the boding wire and the sensor chip, and the bonding wire.

摘要翻译： 压力传感器包括：具有压力引入口的壳体; 以及与壳体一体化的连接器壳体。 连接器壳体包括：突出部，其从连接器壳体的一端沿着引入方向在压力引入口中突出，并且具有在与引入方向垂直的方向上中空的凹部; 传感器芯片，其在所述凹部中在所述芯片的一个表面上具有压力计; 端子，其一端插入并模制在连接器壳体中; 以及将传感器芯片和端子的一端电连接的接合线。 连接器壳体密封接合线和端子之间的连接部分，在编织线和传感器芯片之间的连接部分以及接合线。

公开(公告)号：US07404312B2

公开(公告)日：2008-07-29

申请号：US10864361

申请日：2004-06-10

申请人： Toshiki Isogai ,  Takahiko Yoshida ,  Inao Toyoda

发明人： Toshiki Isogai ,  Takahiko Yoshida ,  Inao Toyoda

IPC分类号： G01N7/00

CPC分类号： G01N27/121 ,  G01N27/126 ,  G01N27/225

摘要： The invention provides a humidity-sensitive element using, as a humidity-sensitive film, a polyimide having a molecular structure capable of forming a network structure at a high density, exhibiting less drift after being left standing at a high temperature and a high humidity and having excellent characteristics. A humidity-sensitive element according to the invention uses the polyimide obtained by dehydrating and ring closing a polyamide acid forming a network structure in which terminals of basic molecular chains are interconnected with one another, as a humidity-sensitive film. The humidity-sensitive element of the invention suitably uses a polyimide, in which terminals of basic molecular chains are interconnected with one another by use of triamine or a tricarboxylic acid, as a humidity sensitive film.

摘要翻译： 本发明提供了一种湿度敏感元件，其使用具有能够以高密度形成网络结构的分子结构的聚酰亚胺作为湿敏膜，在高温和高湿度下静置后具有较少的漂移， 具有优异的特性。 根据本发明的湿度敏感元件使用通过使形成网络结构的聚酰胺酸脱水和闭环而获得的聚酰亚胺，其中碱性分子链的末端彼此互连，作为湿敏膜。 本发明的湿度敏感元件适当地使用聚酰亚胺，其中碱性分子链的末端通过使用三胺或三羧酸彼此互连，作为湿敏膜。

公开(公告)号：US20080025373A1

公开(公告)日：2008-01-31

申请号：US11785275

申请日：2007-04-17

申请人： Inao Toyoda ,  Yukihiro Katoh

发明人： Inao Toyoda ,  Yukihiro Katoh

IPC分类号： G01K5/66 ,  G01K5/72

CPC分类号： G01K13/02 ,  G01K5/48 ,  G01K5/62 ,  G01K2205/04

摘要： A temperature detecting device includes a heat receiving plate, a displacement transmitting part, a deforming part, a deformation generating part and a displacement detecting part. The heat receiving plate is restrained at its rim portion to generate a displacement of a central portion in its thickness direction with respect to the rim portion in accordance with the temperature of an atmospheric gas. The displacement transmitting part is displaced in accordance with the displacement of the central portion of the heat receiving plate. The deforming part is deformed by the displacement transmitting part. The deformation generating part maintains a distance between the rim portion of the heat receiving plate and the deforming part. The displacement detecting part detects a deformation of the deforming part and outputs an electric signal.

摘要翻译： 温度检测装置包括受热板，位移传递部分，变形部分，变形产生部分和位移检测部分。 受热板被限制在其边缘部分处，以根据大气气体的温度产生相对于边缘部分在其厚度方向上的中心部分的位移。 位移传递部分根据受热板的中心部分的位移而移位。 变形部由位移传递部变形。 变形产生部件保持热接收板的边缘部分和变形部分之间的距离。 位移检测部检测变形部的变形并输出电信号。