Tuning A Parameter Associated With Plasma Impedance
    71.
    发明申请
    Tuning A Parameter Associated With Plasma Impedance 审中-公开
    调整与等离子体阻抗相关的参数

    公开(公告)号:US20150206717A1

    公开(公告)日:2015-07-23

    申请号:US14673567

    申请日:2015-03-30

    IPC分类号: H01J37/32 H05H1/46

    摘要: Systems and methods for tuning a parameter associated with plasma impedance are described. One of the methods includes receiving information to determine a variable. The information is measured at a transmission line and is measured when the parameter has a first value. The transmission line is used to provide power to a plasma chamber. The method further includes determining whether the variable is at a local minima and providing the first value to tune the impedance matching circuit upon determining that the variable is at the local minima. The method includes changing the first value to a second value of the parameter upon determining that the variable is not at the local minima and determining whether the variable is at a local minima when the parameter has the second value.

    摘要翻译: 描述了用于调整与等离子体阻抗相关联的参数的系统和方法。 其中一种方法包括接收信息以确定变量。 该信息是在传输线路上测量的,并且在该参数具有第一个值时进行测量。 传输线用于向等离子体室供电。 该方法还包括确定变量是否处于局部最小值,并且在确定变量处于局部最小值时提供第一值以调整阻抗匹配电路。 该方法包括在确定变量不在局部最小值时将第一值改变为参数的第二值,并且当参数具有第二值时确定变量是否处于局部最小值。

    Determining A Malfunctioning Device in A Plasma System
    72.
    发明申请
    Determining A Malfunctioning Device in A Plasma System 有权
    确定等离子体系统中的故障装置

    公开(公告)号:US20140210508A1

    公开(公告)日:2014-07-31

    申请号:US14184631

    申请日:2014-02-19

    IPC分类号: G01R31/40

    摘要: Systems and methods for determining a malfunctioning device in a plasma system, are described. One of the methods includes receiving an indication whether plasma is generated within a plasma chamber of the plasma system. The plasma system includes a processing portion and a power delivery portion. The method further includes determining whether the plasma system operates within constraints in response to receiving the indication that the plasma is generated, determining a value of a variable at an output of the power delivery portion when the processing portion is decoupled from the power delivery portion, and comparing the determined value with a pre-recorded value of the variable. The method includes determining whether the determined value is outside a range of the pre-recorded value and determining that the malfunctioning device within the power delivery portion upon determining that the determined value is outside the range of the pre-recorded value.

    摘要翻译: 描述了用于确定等离子体系统中的故障装置的系统和方法。 方法之一包括接收在等离子体系统的等离子体室内是否产生等离子体的指示。 等离子体系统包括处理部分和电力输送部分。 该方法还包括:响应于接收到产生等离子体的指示,确定等离子体系统是否在约束内运行;当处理部分与电力输送部分分离时,确定电力输送部分的输出处的变量的值; 并将确定的值与变量的预先记录的值进行比较。 该方法包括确定所确定的值是否在预先记录的值的范围之外,并且在确定所确定的值在预先记录的值的范围之外时确定电力输送部分内的故障装置。

    Control of Etch Rate Using Modeling, Feedback and Impedance Match
    73.
    发明申请
    Control of Etch Rate Using Modeling, Feedback and Impedance Match 有权
    使用建模,反馈和阻抗匹配控制蚀刻速率

    公开(公告)号:US20140195033A1

    公开(公告)日:2014-07-10

    申请号:US14152729

    申请日:2014-01-10

    IPC分类号: G05B15/02

    摘要: A method for achieving an etch rate is described. The method includes receiving a calculated variable associated with processing a work piece in a plasma chamber. The method further includes propagating the calculated variable through a model to generate a value of the calculated variable at an output of the model, identifying a calculated processing rate associated with the value, and identifying based on the calculated processing rate a pre-determined processing rate. The method also includes identifying a pre-determined variable to be achieved at the output based on the pre-determined processing rate and identifying a characteristics associated with a real and imaginary portions of the pre-determined variable. The method includes controlling variable circuit components to achieve the characteristics to further achieve the pre-determined variable.

    摘要翻译: 描述了实现蚀刻速率的方法。 该方法包括接收与在等离子体室中处理工件相关联的计算的变量。 该方法还包括通过模型传播所计算的变量,以在模型的输出处产生计算的变量的值,识别与该值相关联的计算的处理速率,以及基于计算的处理速率来识别预定的处理速率 。 该方法还包括基于预定的处理速率来识别要在输出端实现的预定变量,并且识别与预定变量的实部和虚部相关联的特性。 该方法包括控制可变电路组件以实现特性以进一步实现预定变量。