公开(公告)号：US10580710B2

公开(公告)日：2020-03-03

申请号：US15693230

申请日：2017-08-31

Applicant: Micron Technology, Inc.

Inventor： Wei Zhou ,  Bret K. Street ,  Mark E. Tuttle

IPC: H01L23/00 ,  H01L23/10 ,  H01L25/065 ,  H01L23/04 ,  H01L25/00

Abstract: A semiconductor device includes a substrate including a substrate top surface; interconnects connected to the substrate and extending above the substrate top surface; a die attached over the substrate, wherein the die includes a die bottom surface that connects to the interconnects for electrically coupling the die and the substrate; and a metal enclosure directly contacting and vertically extending between the substrate top surface and the die bottom surface, wherein the metal enclosure peripherally surrounds the interconnects.

公开(公告)号：US20190067137A1

公开(公告)日：2019-02-28

申请号：US15693230

申请日：2017-08-31

Applicant: Micron Technology, Inc.

Inventor： Wei Zhou ,  Bret K. Street ,  Mark E. Tuttle

IPC: H01L23/10 ,  H01L23/00 ,  H01L25/065 ,  H01L23/04 ,  H01L25/00

Abstract: A semiconductor device includes a substrate including a substrate top surface; interconnects connected to the substrate and extending above the substrate top surface; a die attached over the substrate, wherein the die includes a die bottom surface that connects to the interconnects for electrically coupling the die and the substrate; and a metal enclosure directly contacting and vertically extending between the substrate top surface and the die bottom surface, wherein the metal enclosure peripherally surrounds the interconnects.

公开(公告)号：US20180033781A1

公开(公告)日：2018-02-01

申请号：US15728123

申请日：2017-10-09

Applicant: Micron Technology, Inc.

Inventor： Wei Zhou ,  Aibin Yu ,  Zhaohui Ma ,  Sony Varghese ,  Jonathan S. Hacker ,  Bret K. Street ,  Shijian Luo

IPC: H01L25/18 ,  H01L21/683 ,  H01L21/78 ,  H01L23/544 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L25/18 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/544 ,  H01L24/81 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/18161 ,  H01L2224/03 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Methods of making semiconductor device packages may involve attaching a first semiconductor die to a carrier wafer, an inactive surface of the first semiconductor die facing the carrier wafer. One or more additional semiconductor die may be stacked on the first semiconductor die on a side of the first semiconductor die opposite the carrier wafer to form a stack of semiconductor dice. A protective material may be positioned over the stack of semiconductor dice, a portion of the protective material extending along side surfaces of the first semiconductor die to a location proximate the inactive surface of the first semiconductor die. The carrier wafer may be detached from the first semiconductor die.

公开(公告)号：US09865578B2

公开(公告)日：2018-01-09

申请号：US14730681

申请日：2015-06-04

Applicant: Micron Technology, Inc.

Inventor： Wei Zhou ,  Aibin Yu ,  Zhaohui Ma ,  Sony Varghese ,  Jonathan S. Hacker ,  Bret K. Street ,  Shijian Luo

IPC: H01L29/40 ,  H01L25/18 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/544 ,  H01L21/683 ,  H01L21/78

CPC classification number: H01L25/18 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/544 ,  H01L24/81 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/18161 ,  H01L2224/03 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Methods of making semiconductor device packages may involve attaching a first semiconductor die to a carrier wafer, an inactive surface of the first semiconductor die facing the carrier wafer. One or more additional semiconductor die may be stacked on the first semiconductor die on a side of the first semiconductor die opposite the carrier wafer to form a stack of semiconductor dice. A protective material may be positioned over the stack of semiconductor dice, a portion of the protective material extending along side surfaces of the first semiconductor die to a location proximate the inactive surface of the first semiconductor die. The carrier wafer may be detached from the first semiconductor die.