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71.
公开(公告)号:US06383845B2
公开(公告)日:2002-05-07
申请号:US09854626
申请日:2001-05-15
申请人: Masachika Masuda , Tamaki Wada , Michiaki Sugiyama , Hirotaka Nishizawa , Toshio Sugano , Yasushi Takahashi , Masayasu Kawamura
发明人: Masachika Masuda , Tamaki Wada , Michiaki Sugiyama , Hirotaka Nishizawa , Toshio Sugano , Yasushi Takahashi , Masayasu Kawamura
IPC分类号: H01L2144
CPC分类号: H01L24/06 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/32145 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/4826 , H01L2224/48599 , H01L2224/49113 , H01L2224/49171 , H01L2224/73215 , H01L2224/85201 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01039 , H01L2924/01055 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/30105 , H01L2924/3011 , Y10T29/49121 , H01L2924/00 , H01L2924/00012 , H01L2224/85399
摘要: A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.
摘要翻译: 一种半导体器件,包括树脂模具,位于树脂模具内部的两个半导体芯片,具有形成在前表面上的前后表面和外部端子以及从树脂模具的内部延伸到外部的引线,其中每个所述引线 至少在树脂模具中分支成两个分支引线,一个分支引线固定到一个半导体芯片的表面,并通过导线与表面上的外部端子电连接,另一个分支引线被固定到 另一个半导体芯片的表面,并通过导线与表面上的外部端子电连接,并且两个半导体芯片彼此堆叠,并且它们的背面彼此相对。