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公开(公告)号：US5930599A
公开(公告)日：1999-07-27
申请号：US40304
申请日：1998-03-18
IPC分类号： H01L21/56 , H01L21/98 , H01L23/31 , H01L23/498 , H01L25/065 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L25/50 , H01L21/56 , H01L21/561 , H01L21/563 , H01L23/3135 , H01L23/49861 , H01L24/29 , H01L24/32 , H01L24/94 , H01L25/0657 , H01L2224/16145 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/83102 , H01L2224/83192 , H01L2224/83874 , H01L2224/92125 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06582 , H01L2225/06596 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/181 , H01L2924/351
摘要： A semiconductor device comprises a square-shaped first semiconductor chip having a first LSI, a square-shaped second semiconductor chip having a second LSI, which is smaller in size than the first semiconductor chip and connected to the first semiconductor chip by face down bonding, and a square-shaped package made of a molding resin for packaging the first and second semiconductor chips. The respective centers of the first and second semiconductor chips are offset from each other, while the center of the second semiconductor chip is substantially coincident with the center of the molding resin.
摘要翻译： 一种半导体器件包括具有第一LSI的正方形的第一半导体芯片，具有第二LSI的方形第二半导体芯片，其尺寸小于第一半导体芯片，并且通过面朝下接合连接到第一半导体芯片， 以及由用于封装第一和第二半导体芯片的模制树脂制成的方形封装。 第一半导体芯片和第二半导体芯片的各个中心彼此偏移，而第二半导体芯片的中心与模制树脂的中心基本一致。
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公开(公告)号：US5849107A
公开(公告)日：1998-12-15
申请号：US680793
申请日：1996-07-16
申请人： Shigenori Itoyama , Kimitoshi Fukae , Masahiro Mori , Yuji Inoue , Fumitaka Toyomura , Takashi Ohtsuka
发明人： Shigenori Itoyama , Kimitoshi Fukae , Masahiro Mori , Yuji Inoue , Fumitaka Toyomura , Takashi Ohtsuka
IPC分类号： E04D13/18 , F24J2/04 , H01L31/048 , H01L31/052 , H01L31/058
CPC分类号： E04D3/366 , F24J2/045 , H01L31/048 , H01L31/056 , H02S20/23 , Y02B10/12 , Y02B10/20 , Y02E10/44 , Y02E10/52 , Y10S136/291
摘要： A solar cell module in which the reduction in conversion efficiency is small, and a passive solar heating system using the solar cell module. The solar cell module has a solar cell covered with a filler. A back reinforcement member, the filler and a back insulating member larger than the solar cell are superposed on the non-light-receiving side of the solar cell. The back insulating member has openings corresponding to pierced portions of the solar cell module at which the solar cell module is affixed to a roof. A greater amount of clean energy is obtained with the system. The solar cell is used without any additional base to limit the reduction in the conversion efficiency of the solar cell.
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公开(公告)号：US5773896A
公开(公告)日：1998-06-30
申请号：US802025
申请日：1997-02-18
IPC分类号： H01L21/56 , H01L21/98 , H01L23/31 , H01L23/498 , H01L25/065 , H01L23/48 , H01L23/34
CPC分类号： H01L25/50 , H01L21/56 , H01L21/561 , H01L21/563 , H01L23/3135 , H01L23/49861 , H01L24/29 , H01L24/32 , H01L24/94 , H01L25/0657 , H01L2224/16145 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/83102 , H01L2224/83192 , H01L2224/83874 , H01L2224/92125 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06582 , H01L2225/06596 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/181 , H01L2924/351
摘要： A semiconductor device comprises a square-shaped first semiconductor chip having a first LSI, a square-shaped second semiconductor chip having a second LSI, which is smaller in size than the first semiconductor chip and connected to the first semiconductor chip by face down bonding, and a square-shaped package made of a molding resin for packaging the first and second semiconductor chips. The respective centers of the first and second semiconductor chips are offset from each other, while the center of the second semiconductor chip is substantially coincident with the center of the molding resin.
摘要翻译： 一种半导体器件包括具有第一LSI的正方形的第一半导体芯片，具有第二LSI的方形第二半导体芯片，其尺寸小于第一半导体芯片，并且通过面朝下接合连接到第一半导体芯片， 以及由用于封装第一和第二半导体芯片的模制树脂制成的方形封装。 第一半导体芯片和第二半导体芯片的各个中心彼此偏移，而第二半导体芯片的中心与模制树脂的中心基本一致。
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公开(公告)号：US5589006A
公开(公告)日：1996-12-31
申请号：US348938
申请日：1994-11-25
申请人： Shigenori Itoyama , Kimitoshi Fukae , Masahiro Mori , Yuji Inoue , Fumitaka Toyomura , Takashi Ohtsuka
发明人： Shigenori Itoyama , Kimitoshi Fukae , Masahiro Mori , Yuji Inoue , Fumitaka Toyomura , Takashi Ohtsuka
IPC分类号： E04D13/18 , F24J2/04 , H01L31/048 , H01L31/052 , H01L31/058
CPC分类号： E04D3/366 , F24J2/045 , H01L31/048 , H01L31/056 , H02S20/23 , Y02B10/12 , Y02B10/20 , Y02E10/44 , Y02E10/52 , Y10S136/291
摘要： A solar cell module in which the reduction in conversion efficiency is small, and a passive solar heating system using the solar cell module. The solar cell module has a solar cell covered with a filler. A back reinforcement member, the filler and a back insulating member larger than the solar cell are superposed on the non-light-receiving side of the solar cell. The back insulating member has openings corresponding to pierced portions of the solar cell module at which the solar cell module is affixed to a roof. A greater amount of clean energy is obtained with the system. The solar cell is used without any additional base to limit the reduction in the conversion efficiency of the solar cell.
摘要翻译： 其中转换效率降低的太阳能电池模块以及使用太阳能电池模块的被动太阳能加热系统。 太阳能电池模块具有覆盖有填充物的太阳能电池。 在太阳能电池的非光接收侧上叠置有背面加强构件，填充物和大于太阳能电池的背面绝缘构件。 背面绝缘构件具有对应于太阳能电池模块的穿孔部分的开口，太阳能电池模块固定在屋顶上。 用系统获得更大量的清洁能量。 使用太阳能电池没有任何额外的基极来限制太阳能电池的转换效率的降低。
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