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公开(公告)号：US5930599A
公开(公告)日：1999-07-27
申请号：US40304
申请日：1998-03-18
IPC分类号： H01L21/56 , H01L21/98 , H01L23/31 , H01L23/498 , H01L25/065 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L25/50 , H01L21/56 , H01L21/561 , H01L21/563 , H01L23/3135 , H01L23/49861 , H01L24/29 , H01L24/32 , H01L24/94 , H01L25/0657 , H01L2224/16145 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/83102 , H01L2224/83192 , H01L2224/83874 , H01L2224/92125 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06582 , H01L2225/06596 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/181 , H01L2924/351
摘要： A semiconductor device comprises a square-shaped first semiconductor chip having a first LSI, a square-shaped second semiconductor chip having a second LSI, which is smaller in size than the first semiconductor chip and connected to the first semiconductor chip by face down bonding, and a square-shaped package made of a molding resin for packaging the first and second semiconductor chips. The respective centers of the first and second semiconductor chips are offset from each other, while the center of the second semiconductor chip is substantially coincident with the center of the molding resin.
摘要翻译： 一种半导体器件包括具有第一LSI的正方形的第一半导体芯片，具有第二LSI的方形第二半导体芯片，其尺寸小于第一半导体芯片，并且通过面朝下接合连接到第一半导体芯片， 以及由用于封装第一和第二半导体芯片的模制树脂制成的方形封装。 第一半导体芯片和第二半导体芯片的各个中心彼此偏移，而第二半导体芯片的中心与模制树脂的中心基本一致。
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公开(公告)号：US5773896A
公开(公告)日：1998-06-30
申请号：US802025
申请日：1997-02-18
IPC分类号： H01L21/56 , H01L21/98 , H01L23/31 , H01L23/498 , H01L25/065 , H01L23/48 , H01L23/34
CPC分类号： H01L25/50 , H01L21/56 , H01L21/561 , H01L21/563 , H01L23/3135 , H01L23/49861 , H01L24/29 , H01L24/32 , H01L24/94 , H01L25/0657 , H01L2224/16145 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/83102 , H01L2224/83192 , H01L2224/83874 , H01L2224/92125 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06582 , H01L2225/06596 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/181 , H01L2924/351
摘要： A semiconductor device comprises a square-shaped first semiconductor chip having a first LSI, a square-shaped second semiconductor chip having a second LSI, which is smaller in size than the first semiconductor chip and connected to the first semiconductor chip by face down bonding, and a square-shaped package made of a molding resin for packaging the first and second semiconductor chips. The respective centers of the first and second semiconductor chips are offset from each other, while the center of the second semiconductor chip is substantially coincident with the center of the molding resin.
摘要翻译： 一种半导体器件包括具有第一LSI的正方形的第一半导体芯片，具有第二LSI的方形第二半导体芯片，其尺寸小于第一半导体芯片，并且通过面朝下接合连接到第一半导体芯片， 以及由用于封装第一和第二半导体芯片的模制树脂制成的方形封装。 第一半导体芯片和第二半导体芯片的各个中心彼此偏移，而第二半导体芯片的中心与模制树脂的中心基本一致。
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公开(公告)号：US5316204A
公开(公告)日：1994-05-31
申请号：US973636
申请日：1992-11-09
IPC分类号： H01L21/60 , B23K20/00 , B23K20/10 , H01L21/603 , H01L21/607 , B23K31/02
CPC分类号： H01L24/85 , B23K20/005 , B23K20/10 , H01L24/50 , H01L24/78 , H01L2224/16 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4847 , H01L2224/49175 , H01L2224/7825 , H01L2224/78301 , H01L2224/78313 , H01L2224/78318 , H01L2224/7865 , H01L2224/851 , H01L2224/85201 , H01L2224/85205 , H01L24/45 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01206 , H01L2924/014 , H01L2924/14 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/351
摘要： A method for bonding leads of a film carrier to electrodes of electronic devices includes a step for positioning the leads and the electrodes with a predetermined clearance aligned to define corresponding pairs of the leads and electrodes, and a step for placing a bonding tool having a conductive bonding material served such that the conductive bonding material is located between the lead and electrode of one of the corresponding pairs. The method further includes a step for pressing the lead of one corresponding pair such that the conductive bonding material is pressed between the lead and the electrode, thereby bonding the lead and electrode. After bonding, the conductive bonding material is pulled to cut and leave the bonded conductive bonding material. Then, while the bonding tool is released from the bonded pair, the conductive bonding material is served to the bonding tool for the next bonding operation.
摘要翻译： 用于将薄膜载体的引线键合到电子器件的电极的方法包括用于将引线和电极以预定的间隙对准的方式定位以限定相应的引线和电极对的步骤，以及用于放置具有导电 使得导电接合材料位于相应对之一的引线和电极之间的接合材料。 该方法还包括用于按压一个相应对的引线的步骤，使得导电接合材料在引线和电极之间被按压，从而接合引线和电极。 接合后，拉动导电性接合材料以切断并离开接合的导电接合材料。 然后，当接合工具从结合对释放时，导电接合材料被用于接合工具以进行下一次接合操作。
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公开(公告)号：US5783463A
公开(公告)日：1998-07-21
申请号：US795185
申请日：1997-02-04
申请人： Shinitsu Takehashi , Kenzo Hatada
发明人： Shinitsu Takehashi , Kenzo Hatada
IPC分类号： H01L21/56 , H01L21/603 , H01L23/495 , H01L21/60
CPC分类号： H01L24/85 , H01L21/565 , H01L23/49503 , H01L23/49558 , H01L23/49575 , H01L24/49 , H01L24/78 , H01L24/97 , H01L2224/32013 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/78 , H01L2224/85205 , H01L2224/92247 , H01L2224/97 , H01L2225/06562 , H01L24/45 , H01L24/48 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181
摘要： The present invention is premised on a semiconductor device in which one semiconductor chip is mounted on each of both faces of a die pad of a lead frame. The semiconductor chips are disposed such that the projected lines, on the die pad, of the corresponding sides of the semiconductor chips, intersect with each other at an angle of 45.degree.. The tips of inner leads are located in the sides of a virtual octagon formed by outwardly enlarging an octagon formed by connecting, to one another, the apexes of the semiconductor chips. The sides of the virtual octagon are respectively opposite to the sides of the semiconductor chips. The number of the inner leads of which tips are located in each of the sides of the virtual octagon, is the same as the number of bonding pads disposed at each of the sides of the semiconductor chips. The inner leads of which tips are located in each of the sides of the virtual octagon, are connected to the bonding pads at each of the sides of one of the first and second semiconductor chips.
摘要翻译： 本发明的前提是半导体器件，其中一个半导体芯片安装在引线框的管芯焊盘的两个面中的每一个上。 半导体芯片被布置成使得半导体芯片的相应侧的芯片上的投影线以45°的角度彼此相交。 内部引线的尖端位于通过向外扩大通过将半导体芯片的顶点彼此连接形成的八边形形成的虚拟八边形的侧面。 虚拟八边形的侧面分别与半导体芯片的侧面相对。 顶端位于虚拟八边形的每一侧的内引线的数量与设置在半导体芯片的每一侧的接合焊盘的数量相同。 位于虚拟八边形的每一侧的尖端的内部引线在第一和第二半导体芯片中的一个的每个侧面处连接到接合焊盘。
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公开(公告)号：US5640044A
公开(公告)日：1997-06-17
申请号：US421183
申请日：1995-04-13
申请人： Shinitsu Takehashi , Kenzo Hatada
发明人： Shinitsu Takehashi , Kenzo Hatada
IPC分类号： H01L21/56 , H01L21/603 , H01L23/495 , H01L23/34
CPC分类号： H01L24/85 , H01L21/565 , H01L23/49503 , H01L23/49558 , H01L23/49575 , H01L24/49 , H01L24/78 , H01L24/97 , H01L2224/32013 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/78 , H01L2224/85205 , H01L2224/92247 , H01L2224/97 , H01L2225/06562 , H01L24/45 , H01L24/48 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181
摘要： The present invention is premised on a semiconductor device in which one semiconductor chip is mounted on each of both faces of a die pad of a lead frame. The semiconductor chips are disposed such that the projected lines, on the die pad, of the corresponding sides of the semiconductor chips, intersect with each other at an angle of 45.degree.. The tips of inner leads are located in the sides of a virtual octagon formed by outwardly enlarging an octagon formed by connecting, to one another, the apexes of the semiconductor chips. The sides of the virtual octagon are respectively opposite to the sides of the semiconductor chips. The number of the inner leads of which tips are located in each of the sides of the virtual octagon, is the same as the number of bonding pads disposed at each of the sides of the semiconductor chips. The inner leads of which tips are located in each of the sides of the virtual octagon, are connected to the bonding pads at each of the sides of one of the first and second semiconductor chips.
摘要翻译： 本发明的前提是半导体器件，其中一个半导体芯片安装在引线框的管芯焊盘的两个面中的每一个上。 半导体芯片被布置成使得半导体芯片的相应侧的芯片上的投影线以45°的角度彼此相交。 内部引线的尖端位于通过向外扩大通过将半导体芯片的顶点彼此连接形成的八边形形成的虚拟八边形的侧面。 虚拟八边形的侧面分别与半导体芯片的侧面相对。 顶端位于虚拟八边形的每一侧的内引线的数量与设置在半导体芯片的每一侧的接合焊盘的数量相同。 位于虚拟八边形的每一侧的尖端的内部引线在第一和第二半导体芯片中的一个的每个侧面处连接到接合焊盘。
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