Non-volatile semiconductor storage device and method of manufacturing the same
    72.
    发明授权
    Non-volatile semiconductor storage device and method of manufacturing the same 有权
    非易失性半导体存储装置及其制造方法

    公开(公告)号:US08338876B2

    公开(公告)日:2012-12-25

    申请号:US12555320

    申请日:2009-09-08

    IPC分类号: H01L29/788

    摘要: A non-volatile semiconductor storage device includes a plurality of memory strings each having a plurality of electrically rewritable memory cells connected in series. Each of the memory strings comprising: a first semiconductor layer including a columnar portion extending in a vertical direction with respect to a substrate; a plurality of first conductive layers formed to surround side surfaces of the columnar portions via insulation layers, and formed at a certain pitch in the vertical direction, the first conductive layers functioning as floating gates of the memory cells; and a plurality of second conductive layers formed to surround the first conductive layers via insulation layers, and functioning as control electrodes of the memory cells. Each of the first conductive layers has a length in the vertical direction that is shorter than a length in the vertical direction of each of the second conductive layers.

    摘要翻译: 非挥发性半导体存储装置包括多个存储串,每个存储串具有串联连接的多个电可重写存储单元。 每个存储器串包括:第一半导体层,包括相对于衬底在垂直方向上延伸的柱状部分; 多个第一导电层,经由绝缘层形成为围绕柱状部分的侧表面,并以垂直方向上的一定间距形成,第一导电层用作存储器单元的浮动栅极; 以及形成为经由绝缘层包围第一导电层并且用作存储单元的控制电极的多个第二导电层。 每个第一导电层在垂直方向上具有比每个第二导电层的垂直方向上的长度短的长度。

    Non-volatile semiconductor storage device and method of manufacturing the same
    73.
    发明授权
    Non-volatile semiconductor storage device and method of manufacturing the same 有权
    非易失性半导体存储装置及其制造方法

    公开(公告)号:US08237211B2

    公开(公告)日:2012-08-07

    申请号:US12556242

    申请日:2009-09-09

    IPC分类号: H01L29/788

    摘要: A non-volatile semiconductor storage device has a memory string including a plurality of electrically rewritable memory cells connected in series. The non-volatile semiconductor storage device also has a protruding layer formed to protrude upward with respect to a substrate. The memory string includes: a plurality of first conductive layers laminated on the substrate; a first semiconductor layer formed to penetrate the plurality of first conductive layers; and an electric charge storage layer formed between the first conductive layers and the first semiconductor layer, and configured to be able to store electric charges. Each of the plurality of first conductive layers includes: a bottom portion extending in parallel to the substrate; and a side portion extending upward with respect to the substrate along the protruding layer at the bottom portion. The protruding layer has a width in a first direction parallel to the substrate that is less than or equal to its length in a lamination direction.

    摘要翻译: 非易失性半导体存储装置具有串联连接的多个电可重写存储单元的存储串。 非挥发性半导体存储装置还具有形成为相对于基板向上突出的突出层。 存储器串包括:层叠在基板上的多个第一导电层; 形成为穿透所述多个第一导电层的第一半导体层; 以及形成在第一导电层和第一半导体层之间的电荷存储层,并且能够存储电荷。 多个第一导电层中的每一个包括:平行于基板延伸的底部; 以及沿底部的突出层相对于基板向上延伸的侧部。 该突出层在平行于基板的第一方向上的宽度小于或等于其在层叠方向上的长度。

    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    76.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US20100213538A1

    公开(公告)日:2010-08-26

    申请号:US12709702

    申请日:2010-02-22

    IPC分类号: H01L27/115 H01L21/8246

    摘要: A memory string comprises: a first semiconductor layer having a plurality of columnar portions extending in a perpendicular direction with respect to a substrate, and joining portions joining lower ends of the plurality of columnar portions; a charge storage layer surrounding a side surface of the first semiconductor layer; and a first conductive layer surrounding a side surface of the charge storage layer and functioning as a control electrode of memory cells. A select transistor comprises: a second semiconductor layer extending upwardly from an upper surface of the columnar portions; an insulating layer surrounding a side surface of the second semiconductor layer; a second conductive layer surrounding a side surface of the insulating layer and functioning as a control electrode of the select transistors; and a third semiconductor layer formed on an upper surface of the second semiconductor layer and including silicon germanium.

    摘要翻译: 存储器串包括:第一半导体层,具有相对于衬底在垂直方向上延伸的多个柱状部分,以及连接多个柱状部分的下端的接合部分; 围绕所述第一半导体层的侧表面的电荷存储层; 以及围绕电荷存储层的侧表面并用作存储单元的控制电极的第一导电层。 选择晶体管包括:从柱状部分的上表面向上延伸的第二半导体层; 围绕所述第二半导体层的侧表面的绝缘层; 围绕所述绝缘层的侧表面并用作所述选择晶体管的控制电极的第二导电层; 以及形成在所述第二半导体层的上表面上并且包括硅锗的第三半导体层。

    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    77.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US20100213537A1

    公开(公告)日:2010-08-26

    申请号:US12708161

    申请日:2010-02-18

    IPC分类号: H01L29/792 H01L21/8239

    摘要: A memory string comprises: a pair of columnar portions; a first insulating layer surrounding a side surface of the columnar portions; a charge storage layer surrounding a side surface of the first insulating layer; a second insulating layer surrounding a side surface of the charge storage layer; and a first conductive layer surrounding a side surface of the second insulating layer. A select transistor comprises: a second semiconductor layer extending from an upper surface of the columnar portions; a third insulating layer surrounding a side surface of the second semiconductor layer; a fourth insulating layer surrounding a side surface of the third insulating layer; and a second conductive layer surrounding a side surface of the fourth insulating layer. The first semiconductor layer is formed continuously in an integrated manner with the second semiconductor layer. The first insulating layer is formed continuously in an integrated manner with the third insulating layer.

    摘要翻译: 存储器串包括:一对柱状部分; 围绕所述柱状部分的侧表面的第一绝缘层; 围绕所述第一绝缘层的侧表面的电荷存储层; 围绕电荷存储层的侧表面的第二绝缘层; 以及围绕所述第二绝缘层的侧表面的第一导电层。 选择晶体管包括:从柱状部分的上表面延伸的第二半导体层; 围绕所述第二半导体层的侧表面的第三绝缘层; 围绕所述第三绝缘层的侧表面的第四绝缘层; 以及围绕所述第四绝缘层的侧表面的第二导电层。 第一半导体层以与第二半导体层一体化的方式连续地形成。 第一绝缘层与第三绝缘层一体地形成。

    NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
    79.
    发明申请
    NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    非挥发性半导体存储器件及其制造方法

    公开(公告)号:US20100148237A1

    公开(公告)日:2010-06-17

    申请号:US12555320

    申请日:2009-09-08

    IPC分类号: H01L29/788 H01L21/4763

    摘要: A non-volatile semiconductor storage device includes a plurality of memory strings each having a plurality of electrically rewritable memory cells connected in series. Each of the memory strings comprising: a first semiconductor layer including a columnar portion extending in a vertical direction with respect to a substrate; a plurality of first conductive layers formed to surround side surfaces of the columnar portions via insulation layers, and formed at a certain pitch in the vertical direction, the first conductive layers functioning as floating gates of the memory cells; and a plurality of second conductive layers formed to surround the first conductive layers via insulation layers, and functioning as control electrodes of the memory cells. Each of the first conductive layers has a length in the vertical direction that is shorter than a length in the vertical direction of each of the second conductive layers.

    摘要翻译: 非挥发性半导体存储装置包括多个存储串,每个存储串具有串联连接的多个电可重写存储单元。 每个存储器串包括:第一半导体层,包括相对于衬底在垂直方向上延伸的柱状部分; 多个第一导电层,经由绝缘层形成为围绕柱状部分的侧表面,并以垂直方向上的一定间距形成,第一导电层用作存储器单元的浮动栅极; 以及形成为经由绝缘层包围第一导电层并且用作存储单元的控制电极的多个第二导电层。 每个第一导电层在垂直方向上具有比每个第二导电层的垂直方向上的长度短的长度。

    SEMICONDUCTOR MEMORY DEVICE
    80.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE 有权
    半导体存储器件

    公开(公告)号:US20100109071A1

    公开(公告)日:2010-05-06

    申请号:US12562781

    申请日:2009-09-18

    IPC分类号: H01L29/792

    CPC分类号: H01L27/11578 H01L27/11582

    摘要: A semiconductor memory device includes: a semiconductor substrate; a stacked body with a plurality of conductive layers and a plurality of dielectric layers alternately stacked, the stacked body being provided on the semiconductor substrate; a semiconductor layer provided inside a hole formed through the stacked body, the semiconductor layer extending in stacking direction of the conductive layers and the dielectric layers; and a charge storage layer provided between the conductive layers and the semiconductor layer. The stacked body in a memory cell array region including a plurality of memory strings is divided into a plurality of blocks by slits with an interlayer dielectric film buried therein, the memory string including as many memory cells series-connected in the stacking direction as the conductive layers, the memory cell including the conductive layer, the semiconductor layer, and the charge storage layer provided between the conductive layer and the semiconductor layer, and each of the block is surrounded by the slits formed in a closed pattern.

    摘要翻译: 半导体存储器件包括:半导体衬底; 具有交替堆叠的多个导电层和多个电介质层的层叠体,所述层叠体设置在所述半导体基板上; 设置在通过所述层叠体形成的孔内的半导体层,所述半导体层沿所述导电层和所述电介质层的堆叠方向延伸; 以及设置在导电层和半导体层之间的电荷存储层。 包含多个存储器串的存储单元阵列区域中的堆叠体被埋置在其中的层间电介质膜的狭缝分成多个块,该存储串包括在堆叠方向上串联连接的存储单元作为导电 存储单元包括导电层,半导体层和设置在导电层和半导体层之间的电荷存储层,并且每个块被形成为封闭图案的狭缝包围。