Method and System For Cleaning A Photomask
    72.
    发明申请
    Method and System For Cleaning A Photomask 有权
    清洁光掩模的方法和系统

    公开(公告)号:US20080185021A1

    公开(公告)日:2008-08-07

    申请号:US11671570

    申请日:2007-02-06

    CPC classification number: G03F1/82 Y10S134/902

    Abstract: A method for cleaning a photomask includes cleaning the photomask with a chemical cleaner, introducing a solution to the photomask, the solution is configured to react with residuals generated from the chemical cleaner to form insoluble precipitates, and rinsing the photomask with a fluid to remove the insoluble precipitates from the photomask.

    Abstract translation: 用于清洁光掩模的方法包括用化学清洁剂清洁光掩模,将溶液引入到光掩模中,溶液被配置为与由化学清洁剂产生的残余物反应以形成不溶性沉淀物,并用流体冲洗光掩模以除去 来自光掩模的不溶性沉淀物。

    Method and System For Making Photo-Resist Patterns
    73.
    发明申请
    Method and System For Making Photo-Resist Patterns 审中-公开
    制作防光图案的方法和系统

    公开(公告)号:US20080102648A1

    公开(公告)日:2008-05-01

    申请号:US11555558

    申请日:2006-11-01

    CPC classification number: H01L21/0271 G03F7/095

    Abstract: A method of forming a resist pattern in a semiconductor device layer includes forming a buffer layer on a semiconductor device layer and forming a resist layer on the buffer layer. A decomposing agent is released into a portion of the buffer layer by a portion of the resist layer whereupon the portion of the buffer layer and the portion of the resist layer are removed to form a process window substantially free of resist residue that can be subsequently exploited for etching of the semiconductor device layer.

    Abstract translation: 在半导体器件层中形成抗蚀剂图案的方法包括在半导体器件层上形成缓冲层,并在缓冲层上形成抗蚀剂层。 分解剂通过抗蚀剂层的一部分释放到缓冲层的一部分中,随后缓冲层的部分和抗蚀剂层的一部分被去除以形成基本上不含抗蚀剂残留物的工艺窗口,其可以被随后利用 用于蚀刻半导体器件层。

    ESD-resistant photomask and method of preventing mask ESD damage
    74.
    发明授权
    ESD-resistant photomask and method of preventing mask ESD damage 有权
    防静电光掩模和防止掩膜ESD损伤的方法

    公开(公告)号:US07252911B2

    公开(公告)日:2007-08-07

    申请号:US10810920

    申请日:2004-03-26

    Applicant: Ching-Yu Chang

    Inventor: Ching-Yu Chang

    CPC classification number: G03F1/60 G03F1/40 H01J2237/31794

    Abstract: An ESD-resistant photomask and method of preventing mask ESD damage is disclosed. The ESD-resistant photomask includes a mask substrate, a pattern-forming material provided on the substrate, a circuit pattern defined by exposure regions etched in the pattern-forming material, and positive or negative ions implanted into the mask substrate throughout ion implantation regions. The ions in the ion implantation regions dissipate electrostatic charges on the mask, thus preventing the buildup of electrostatic charges which could otherwise attract image-distorting particles to the mask or damage the mask.

    Abstract translation: 公开了一种防静电防护光掩模和防止掩膜ESD损伤的方法。 防静电光掩模包括掩模基板,设置在基板上的图案形成材料,由在图案形成材料中蚀刻的曝光区域限定的电路图案,以及在离子注入区域中注入到掩模基板中的正或负离子。 离子注入区域中的离子消耗掩模上的静电电荷,从而防止静电电荷的积累,否则可能会吸引图像变形颗粒到掩模或损坏掩模。

    Megasonic immersion lithography exposure apparatus and method
    75.
    发明授权
    Megasonic immersion lithography exposure apparatus and method 有权
    超声波浸没式光刻曝光装置及方法

    公开(公告)号:US07224427B2

    公开(公告)日:2007-05-29

    申请号:US10910480

    申请日:2004-08-03

    CPC classification number: G03F7/70341

    Abstract: A megasonic immersion lithography exposure apparatus and method for substantially eliminating microbubbles from an exposure liquid in immersion lithography is disclosed. The apparatus includes an optical system for projecting light through a mask and onto a wafer.An optical transfer chamber is provided adjacent to the optical system for containing an exposure liquid. At least one megasonic plate operably engages the optical transfer chamber for inducing sonic waves in and eliminating microbubbles from the exposure liquid.

    Abstract translation: 公开了一种用于在浸没式光刻中基本上消除曝光液体中的微泡的兆声浸没式光刻曝光装置和方法。 该装置包括用于通过掩模将光投射到晶片上的光学系统。 光学传递室邻近光学系统设置,用于容纳曝光液体。 至少一个兆欧表板可操作地接合光学传递室,用于在曝光液体中引入声波并消除微泡。

    Optical proximity correction photomasks
    76.
    发明申请
    Optical proximity correction photomasks 有权
    光学接近校正光掩模

    公开(公告)号:US20070082275A1

    公开(公告)日:2007-04-12

    申请号:US11245522

    申请日:2005-10-07

    Applicant: Ching-Yu Chang

    Inventor: Ching-Yu Chang

    CPC classification number: G03F1/36

    Abstract: An optical proximity correction photomask comprises a transparent substrate, a main feature having a first transmitivity disposed on the transparent substrate and at least one assist feature having a second transmitivity disposed beside the main feature and on the transparent substrate, wherein the first transmitivity is not equal to the second transmitivity.

    Abstract translation: 光学邻近校正光掩模包括透明衬底,具有设置在透明衬底上的第一透射率的主要特征和在主要特征旁边和透明衬底上具有第二透射率的至少一个辅助特征,其中第一透射率不相等 到第二个透射率。

    Shallow trench isolation structure and method of fabricating the same
    77.
    发明申请
    Shallow trench isolation structure and method of fabricating the same 审中-公开
    浅沟槽隔离结构及其制造方法

    公开(公告)号:US20070020877A1

    公开(公告)日:2007-01-25

    申请号:US11186360

    申请日:2005-07-21

    CPC classification number: H01L21/76224

    Abstract: A shallow trench isolation structure has a trench formed in a substrate, a silicon oxynitride layer conformally formed on the sidewalls and bottom of the trench, and a high density plasma (HDP) oxide layer substantially filling the trench.

    Abstract translation: 浅沟槽隔离结构具有在衬底中形成的沟槽,保形地形成在沟槽的侧壁和底部上的氧氮化硅层和基本上填充沟槽的高密度等离子体(HDP)氧化物层。

    Immersion lithography defect reduction
    78.
    发明申请
    Immersion lithography defect reduction 审中-公开
    浸没光刻缺陷减少

    公开(公告)号:US20070002296A1

    公开(公告)日:2007-01-04

    申请号:US11384624

    申请日:2006-03-20

    CPC classification number: G03F7/70341

    Abstract: A method of performing immersion lithography on a semiconductor substrate includes providing a layer of resist onto a surface of the semiconductor substrate and exposing the resist layer using an immersion lithography exposure system. The immersion lithography exposure system utilizes a fluid during exposure and may be capable of removing some, but not all, of the fluid after exposure. After exposure, a treatment process is used to remove the remaining portion of fluid from the resist layer. After treatment, a post-exposure bake and a development step are used.

    Abstract translation: 在半导体衬底上进行浸渍光刻的方法包括在半导体衬底的表面上提供抗蚀剂层并使用浸没光刻曝光系统曝光抗蚀剂层。 浸没式光刻曝光系统在曝光期间利用流体,并且可以在曝光后能够去除一些但不是全部的流体。 曝光后,使用处理工艺从抗蚀剂层中除去剩余部分的流体。 处理后,使用曝光后烘烤和显影步骤。

    System and method for photolithography in semiconductor manufacturing
    79.
    发明申请
    System and method for photolithography in semiconductor manufacturing 有权
    半导体制造中的光刻系统和方法

    公开(公告)号:US20060172520A1

    公开(公告)日:2006-08-03

    申请号:US11050312

    申请日:2005-02-03

    CPC classification number: H01L21/76802 H01L21/31144

    Abstract: A method for forming a semiconductor device includes forming a photoresist layer over a substrate and patterning the photoresist layer to form photoresist portions. A second layer is formed over the substrate in areas not covered by the photoresist portions and the photoresist portions are removed. After removing the photoresist portions, the second layer is used to modify the substrate to create at least a portion of the semiconductor device.

    Abstract translation: 一种用于形成半导体器件的方法包括在衬底上形成光致抗蚀剂层并图案化光致抗蚀剂层以形成光致抗蚀剂部分。 在不被光致抗蚀剂部分覆盖的区域中的衬底上形成第二层,并去除光致抗蚀剂部分。 在去除光致抗蚀剂部分之后,第二层用于修改基板以产生半导体器件的至少一部分。

    Photolithography process and photomask structure implemented in a photolithography process
    80.
    发明申请
    Photolithography process and photomask structure implemented in a photolithography process 有权
    在光刻工艺中实现的光刻工艺和光掩模结构

    公开(公告)号:US20050136338A1

    公开(公告)日:2005-06-23

    申请号:US10894924

    申请日:2004-07-20

    Applicant: Ching-Yu Chang

    Inventor: Ching-Yu Chang

    CPC classification number: G03F7/70441 G03F1/36

    Abstract: In a photolithography process, a photoresist layer is formed on a substrate. A photomask is aligned over the substrate to transfer pattern images defined in the photomask on the substrate. The photomask includes first and second patterns of different light transmission rates, and a dummy pattern surrounding the second pattern having a light transmission rate lower than that of the first pattern. The substrate is exposed to a light radiation through the photomask. The photoresist layer then is developed to form the pattern images. The dummy pattern is dimensionally configured to allow light transmission, but in a substantially amount so that the dummy pattern is not imaged during exposure.

    Abstract translation: 在光刻工艺中,在基板上形成光致抗蚀剂层。 光掩模在衬底上对准以传输在衬底上的光掩模中限定的图案图像。 光掩模包括不同透光率的第一和第二图案,以及围绕第二图案的虚拟图案,其透光率低于第一图案的透光率。 将基板暴露于通过光掩模的光辐射。 然后将光致抗蚀剂层显影以形成图案图像。 虚拟图案被尺寸地构造成允许光透射,但是基本上是这样的,使得在曝光期间伪图案不被成像。

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