Abstract:
Therefore, the invention of the present application provides a fuse in which a position and a posture of a fuse element are easily stabilized and which is easily assembled, and a method for manufacturing the fuse. A fuse including a fuse element having a fusing portion; and a casing accommodating the fusing portion; where the fuse element has a long shape extending in a longitudinal direction of the casing and at least two or more fuse elements are provided; the fuse element has one end portion side coupled to each other by a coupling portion; a first holding portion that holds the fuse element is provided in one opening of the casing; and a locking portion that locks the coupling portion of the fuse element is provided in the first holding portion.
Abstract:
Therefore, the invention of the present application provides a fuse in which a position and a posture of a fuse element are easily stabilized and which is easily assembled, and a method for manufacturing the fuse. A fuse including a fuse element having a fusing portion; and a casing accommodating the fusing portion; where the fuse element has a long shape extending in a longitudinal direction of the casing and at least two or more fuse elements are provided; the fuse element has one end portion side coupled to each other by a coupling portion; a first holding portion that holds the fuse element is provided in one opening of the casing; and a locking portion that locks the coupling portion of the fuse element is provided in the first holding portion.
Abstract:
A chip-type fuse includes a main body portion composed of an insulating material, a fuse conductor that is disposed inside the main body portion and that has both end portions exposed at the main body portion, and a pair of outer electrodes that cover respective end portions of the main body portion and that are connected to respective end portions of the fuse conductor. A hollow portion is present inside the main body portion, and the fuse conductor has a fusing portion disposed along the wall surface of the hollow portion.
Abstract:
A fuse structure may include an anode pattern, a cathode pattern and a connection member. The anode pattern may be formed on a semiconductor substrate. The cathode pattern may be formed on the anode pattern. The connection member may be electrically connected between the anode pattern and the cathode pattern. The connection member may have different widths.
Abstract:
A fuse structure may include an anode pattern, a cathode pattern and a connection member. The anode pattern may be formed on a semiconductor substrate. The cathode pattern may be formed on the anode pattern. The connection member may be electrically connected between the anode pattern and the cathode pattern. The connection member may have different widths.
Abstract:
A fuse structure may include an anode pattern, a cathode pattern and a connection member. The anode pattern may be formed on a semiconductor substrate. The cathode pattern may be formed on the anode pattern. The connection member may be electrically connected between the anode pattern and the cathode pattern. The connection member may have different widths.
Abstract:
In a chip fuse, a heat-storing layer is formed on an insulated substrate, a fuse film is formed on the heat-storing layer, and a protective film is formed on the fuse element section. The chip fuse includes surface electrode sections on both ends in the length direction of the chip fuse and a fuse element section between the surface electrode sections. In this chip fuse, a rectangular bank section is formed over the heat-storing layer and the surface electrode sections to surround the fuse element section, and a first protective layer is formed on the inner side of the bank section. In addition, during the bank formation process, a sheet-like photosensitive-group-containing material is laminated on the fuse element section, surface electrode sections, and heat-storing layer, and the sheet-like photosensitive-group-containing material is exposed to ultraviolet light and developed to form the rectangular bank section.
Abstract:
A fuse assembly of a motor controller is provided. The fuse assembly includes a base, a base plate to which the base is attached, a lead frame that is attached to the base, at least one lead that is attached to the lead frame, and a fuse element attached to the base and covered with a fusible material. Heat is generated in the fuse element by a high flow of current carried by the assembly. The heat is operatively transferred through the assembly by direct conduction to the base and then base plate. The assembly sufficiently transfers heat to reduce rise in temperature of and properly cool the assembly. An operating temperature of the assembly is reduced to minimize or prevent damage thereto. The assembly has increased thermal-fatigue life and minimizes thermal-fatigue damage to the assembly during temperature cycling in an aircraft. Thermal stress of the assembly is minimized.
Abstract:
A fuse formed as part of an integrated circuit has cavities disposed to the sides of the fuse to provide more reliable operation with less chance of re-connection. A method of providing the fuse is also described.
Abstract:
A fuse includes an insulating substrate, a wiring, low-melting-point metal portions insulating layers and metal films. The wiring is located on one principal surface of the insulating substrate. The low-melting-point metal portions are provided over the wiring. The low-melting-point metal portions have a lower melting point than the wiring, and dissolves the wiring when the portions turn into a melt. The insulating layers are located between the wiring and the low-melting-point metal portions. The metal films are located outside the insulating layers on the insulating substrate.